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HMC560LM3

Analog Devices

HMC560LM3 by Analog Devices

Analog Devices' HMC560LM3 is a telecom IC with 6 terminals in a square chip carrier package. Operating temp range: -55 to 85°C, peak reflow temp: 250°C. Ideal for telecom interface applications due to its compact size and gold over nickel terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,172 parts In-Stock

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Digiode

USA . 594 parts In-Stock

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594

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

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Parana Technologies

USA . 121 parts In-Stock

1+ parts

$8.408

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$7.820

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121

$8.408

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$7.820

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IDEA Electronic Components Group

UK . 610 parts In-Stock

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$9.041

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$8.589

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610

$9.041

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$8.589

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Aztec Data Supply Inc.

USA . 89 parts In-Stock

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$13.142

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$13.142

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DigiPath Technology Company

USA . 665 parts In-Stock

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$14.104

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$13.540

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$13.540

665

$14.104

$13.540

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$13.540

Corohmni

South Africa . 502 parts In-Stock

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$16.574

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AZTECH Wire

Italy . 730 parts In-Stock

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$18.273

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Ampacity Inc.

Singapore . 678 parts In-Stock

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$133.000

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Semicontronic

India . 544 parts In-Stock

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$396.000

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$386.100

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$384.120

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One Stop Electronics

USA . 237 parts In-Stock

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$497.000

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Continental Prestige Electronics

USA . 6,902 parts In-Stock

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Argo Parts USA

USA . 2,392 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Corphita

USA . 434 parts In-Stock

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434

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Overview

Elevate your telecom projects with the HMC560LM3 by Analog Devices. Known for its superior quality and reliability, Analog Devices is a trusted manufacturer in the industry. This telecom interface IC offers unmatched performance and versatility for a wide range of applications. With its compact size and advanced technology, the HMC560LM3 provides value and benefits that will exceed your expectations. Upgrade your telecom systems with this innovative solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy in the package body makes this product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation of this product onto a PCB.

Package Shape: SQUARE

The square package shape makes this product easy to handle and fit into tight spaces on a circuit board.

No. of Terminals: 6

With 6 terminals, this product offers multiple connection options for versatile applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG

The chip carrier and heat sink/slug package style helps in heat dissipation, ensuring optimal performance of the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand challenging environmental conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows this product to function reliably in cold environments.

Terminal Finish: GOLD OVER NICKEL

The gold over nickel terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: QUAD

The quad terminal position allows for secure connections and stable performance of the product.

Maximum Seated Height: 1.14 mm

The low maximum seated height of 1.14mm helps in maintaining a compact design for space-constrained applications.

Width: 5.08 mm

The 5.08mm width of this product contributes to its compact size and easy integration into electronic systems.

Peak Reflow Temperature °C: 250

With a peak reflow temperature of 250°C, the product can withstand reflow soldering processes without damage.

Length: 5.08 mm

The 5.08mm length of this product complements its width, making it a space-efficient choice for PCB layouts.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and complies with regulations on hazardous substances.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this product offers optimized performance and compatibility.

Terminal Pitch: 1 mm

The 1mm terminal pitch provides a standard spacing for easy connection and compatibility with various PCB designs.

Technical Specifications

Other Function Telecom Interface ICs HMC560LM3 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N6

JESD-609 Code:

e4

Length:

5.08 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

Maximum Seated Height:

1.14 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

GOLD OVER NICKEL

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

QUAD

Width:

5.08 mm

Trade Compliance

HMC560LM3 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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