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HMC552LP4

Analog Devices

HMC552LP4 by Analog Devices

Analog Devices' HMC552LP4 is a 24-terminal telecom IC with a nominal voltage of 5V. It operates in industrial temperature range (-40 to 85°C) and features a square chip carrier package style. Ideal for telecom circuits, this IC is surface mountable and has a terminal pitch of 0.5mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,082 parts In-Stock

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Digiode

USA . 588 parts In-Stock

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588

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Beltway Electronics Company

USA . 2 parts In-Stock

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2

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Distributors (Availability)

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AZTECH Wire

Italy . 707 parts In-Stock

1+ parts

$15.537

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707

$15.537

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Parana Technologies

USA . 172 parts In-Stock

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$16.335

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$15.192

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172

$16.335

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$15.192

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IDEA Electronic Components Group

UK . 36 parts In-Stock

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$17.565

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$16.687

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$16.687

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36

$17.565

$16.687

$16.687

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DigiPath Technology Company

USA . 3,386 parts In-Stock

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$27.401

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$26.305

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$26.305

3,386

$27.401

$26.305

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$26.305

Semicontronic

India . 681 parts In-Stock

1+ parts

$819.000

100+ parts

$798.525

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$794.430

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681

$819.000

$798.525

$794.430

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One Stop Electronics

USA . 1,179 parts In-Stock

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$891.000

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$891.000

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Corphita

USA . 239 parts In-Stock

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Overview

Elevate your telecommunications systems with the Analog Devices HMC552LP4, a high-quality Other Function Telecom Interface IC that guarantees reliable performance and seamless connectivity. Manufactured by Analog Devices, a trusted industry leader known for cutting-edge technology and superior engineering, this product is designed to meet the demands of various applications in the telecom sector. With its advanced features and durable construction, the HMC552LP4 offers exceptional value by providing customers with enhanced efficiency, flexibility, and cost-effectiveness. Upgrade your communication systems today with the Analog Devices HMC552LP4 and experience unparalleled performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and resistance to environmental factors, making this product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort in the manufacturing process.

Package Shape: SQUARE

Square package shape ensures efficient use of PCB space and easy integration into compact electronic designs.

No. of Terminals: 24

Having 24 terminals allows for multiple interface options and connectivity, making this product versatile for various telecom applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of chip carrier, heat sink/slug, and very thin profile package style provides efficient heat dissipation and compact form factor for space-constrained applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for reliable operation in extreme cold conditions, making this product suitable for varied operating environments.

Terminal Finish: TIN LEAD

Tin lead terminal finish offers good solderability and conductivity, ensuring secure connections and reliable performance.

Terminal Position: QUAD

Quad terminal position enables efficient routing of signals and power, enhancing overall functionality and performance of the product.

Maximum Seated Height: 1 mm

Low maximum seated height allows for compact design integration and helps in minimizing overall system size.

Width: 4 mm

Compact width dimension facilitates space-saving integration in electronic layouts and PCB designs.

Length: 4 mm

Small length dimension makes this product suitable for applications requiring compact and sleek form factors.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of lead-related environmental hazards and makes this product environmentally friendly.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this product offers optimized performance and functionality for telecommunication systems.

Nominal Supply Voltage: 5 V

Standard 5V nominal supply voltage is compatible with most electronic systems and ensures easy integration with existing power sources.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density PCB layouts and intricate circuit designs, providing flexibility for complex telecom implementations.

Technical Specifications

Other Function Telecom Interface ICs HMC552LP4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

HMC552LP4 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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