Loading...

HMC554LC3BTR

Analog Devices

HMC554LC3BTR by Analog Devices

Analog Devices' HMC554LC3BTR is a telecom IC with 12 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, ideal for industrial applications. With gold over nickel finish and very thin profile, it's suitable for telecom interface circuits requiring precise performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,855 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,855

-

-

-

-

Digiode

USA . 479 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

479

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,041 parts In-Stock

1+ parts

$9.394

100+ parts

-

1k+ parts

$8.736

10k+ parts

-

2,041

$9.394

-

$8.736

-

IDEA Electronic Components Group

UK . 101 parts In-Stock

1+ parts

$10.101

100+ parts

-

1k+ parts

$9.596

10k+ parts

-

101

$10.101

-

$9.596

-

AZTECH Wire

Italy . 758 parts In-Stock

1+ parts

$12.326

100+ parts

-

1k+ parts

-

10k+ parts

-

758

$12.326

-

-

-

DigiPath Technology Company

USA . 1,023 parts In-Stock

1+ parts

$15.758

100+ parts

$15.127

1k+ parts

-

10k+ parts

$15.127

1,023

$15.758

$15.127

-

$15.127

One Stop Electronics

USA . 581 parts In-Stock

1+ parts

$515.000

100+ parts

-

1k+ parts

-

10k+ parts

-

581

$515.000

-

-

-

Semicontronic

India . 299 parts In-Stock

1+ parts

$978.000

100+ parts

$953.550

1k+ parts

$948.660

10k+ parts

-

299

$978.000

$953.550

$948.660

-

RC Electronics

USA . 3,833 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,833

-

-

-

-

A-Z Elektronik GmbH

Germany . 2,745 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,745

-

-

-

-

Corphita

USA . 851 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

851

-

-

-

-

Perfect Parts

USA . 188 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

188

-

-

-

-

Overview

Elevate your telecom systems with the HMC554LC3BTR by Analog Devices, a top-tier manufacturer known for cutting-edge technology and exceptional quality. This versatile telecom interface IC offers seamless integration, superior performance, and reliability in a compact square package. Unlock new possibilities and enhance your communication systems with this innovative solution. Upgrade to Analog Devices and experience the difference.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures durability and reliability for this telecom interface IC.

Surface Mount: YES

Being surface mountable makes this product easier to assemble and more space-efficient on circuit boards.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and facilitates a streamlined design layout.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles enhances thermal management and overall performance of this IC.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that this IC can operate reliably in a wide range of temperature settings, making it suitable for various environments.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC is optimized for telecommunications systems, ensuring high performance and reliability in such settings.

Technical Specifications

Other Function Telecom Interface ICs HMC554LC3BTR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-CQCC-N12

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.92 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

GOLD OVER NICKEL

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

HMC554LC3BTR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Analog Devices 10

Similar products 20