Loading...

HMC560LM3TR

Analog Devices

HMC560LM3TR by Analog Devices

Analog Devices' HMC560LM3TR is a Telecom IC with 6 terminals in a square chip carrier package. Operating temperature ranges from -55 to 85 °C, making it suitable for telecom applications. With matte tin finish and no-lead terminal form, it offers high performance in a compact 5.08mm x 5.08mm package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,455 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,455

-

-

-

-

Digiode

USA . 981 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

981

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 662 parts In-Stock

1+ parts

$10.103

100+ parts

-

1k+ parts

-

10k+ parts

-

662

$10.103

-

-

-

Parana Technologies

USA . 1,820 parts In-Stock

1+ parts

$15.267

100+ parts

-

1k+ parts

$14.198

10k+ parts

-

1,820

$15.267

-

$14.198

-

IDEA Electronic Components Group

UK . 224 parts In-Stock

1+ parts

$16.416

100+ parts

$15.595

1k+ parts

$15.595

10k+ parts

-

224

$16.416

$15.595

$15.595

-

DigiPath Technology Company

USA . 823 parts In-Stock

1+ parts

$25.609

100+ parts

$24.585

1k+ parts

-

10k+ parts

$24.585

823

$25.609

$24.585

-

$24.585

Semicontronic

India . 869 parts In-Stock

1+ parts

$414.000

100+ parts

$403.650

1k+ parts

$401.580

10k+ parts

-

869

$414.000

$403.650

$401.580

-

One Stop Electronics

USA . 1,363 parts In-Stock

1+ parts

$867.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,363

$867.000

-

-

-

Corphita

USA . 889 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

889

-

-

-

-

Overview

Enhance your telecommunications systems with the high-quality HMC560LM3TR by Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers top-notch products that guarantee reliability and performance. The HMC560LM3TR falls under the category of Other Function Telecom Interface ICs and offers a wide range of applications. With its innovative design and advanced features, this product provides customers with unmatched value, benefits, and advantages. Upgrade your telecom setup today with the HMC560LM3TR and experience seamless communication like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for telecom applications where weight and durability are important factors.

Surface Mount: Yes

Being surface mountable allows for easy and reliable installation on circuit boards, simplifying the manufacturing process and reducing assembly time.

Package Shape: SQUARE

The square shape of the package provides a compact design, saving space on the PCB and allowing for efficient layout of components in the telecom system.

No. of Terminals: 6

With 6 terminals, this product offers a sufficient number of connection points for interfacing with external devices and components in the telecom system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG

The chip carrier style combined with a heat sink/slug design helps in dissipating heat efficiently, ensuring the reliable performance of the telecom interface IC under high operating temperatures.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance of 85 °C allows the product to function reliably in telecom environments prone to temperature fluctuations.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55 °C ensures the product's performance in cold conditions, making it suitable for a wide range of telecom applications.

Terminal Finish: MATTE TIN

The matte tin finish on the terminals provides a reliable and consistent electrical connection, reducing the risk of signal interference or loss in the telecom interface.

Terminal Position: QUAD

The quad terminal position offers a stable and secure mounting arrangement, enhancing the overall reliability and durability of the product in telecom systems.

Maximum Seated Height: 1.14 mm

The low maximum seated height of 1.14 mm contributes to a slim profile and compact form factor, facilitating space-saving integration in telecom equipment.

Width: 5.08 mm

The width of 5.08 mm provides a balance between compactness and ease of handling during installation, making it a convenient choice for telecom system design and assembly.

Peak Reflow Temperature °C: 250

With a high peak reflow temperature tolerance of 250 °C, the product can withstand the solder reflow process during assembly without compromising its structural integrity.

Length: 5.08 mm

The length of 5.08 mm complements the square package shape, offering a symmetrical and space-efficient layout on the PCB, optimizing the overall performance and functionality of the telecom interface IC.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder joint cracking or fatigue, ensuring long-term reliability and stability in the connection of the telecom interface IC to the circuit board.

Telecom IC Type: TELECOM CIRCUIT

As a specialized telecom circuit IC, this product is designed to meet the stringent requirements and performance standards of telecom applications, ensuring optimal functionality and compatibility in telecom systems.

Terminal Pitch: 1 mm

The 1 mm terminal pitch offers a fine pitch spacing for efficient wiring and connection, enabling high-density integration of the telecom interface IC in compact telecom equipment without compromising performance.

Technical Specifications

Other Function Telecom Interface ICs HMC560LM3TR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N6

JESD-609 Code:

e3

Length:

5.08 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Maximum Seated Height:

1.14 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

QUAD

Width:

5.08 mm

Trade Compliance

HMC560LM3TR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Analog Devices 10

Similar products 20