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HMC555

Analog Devices

HMC555 by Analog Devices

Analog Devices' HMC555 is a telecom IC with 6 terminals, gold finish, and operates b/w -55°C to 85°C. It's a surface-mount rectangular chip used in telecom circuits for various applications.

Median Price

$58.055

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 250 parts In-Stock

1+ parts

$71.450

100+ parts

$44.660

1k+ parts

$36.960

10k+ parts

-

250

$71.450

$44.660

$36.960

-

Verical

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$44.660

1k+ parts

$36.960

10k+ parts

-

250

-

$44.660

$36.960

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 58 parts In-Stock

1+ parts

$67.878

100+ parts

-

1k+ parts

-

10k+ parts

-

58

$67.878

-

-

-

Vyrian

USA . 7,557 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,557

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 563 parts In-Stock

1+ parts

$7.303

100+ parts

-

1k+ parts

$6.792

10k+ parts

-

563

$7.303

-

$6.792

-

IDEA Electronic Components Group

UK . 618 parts In-Stock

1+ parts

$7.853

100+ parts

-

1k+ parts

$7.460

10k+ parts

-

618

$7.853

-

$7.460

-

DigiPath Technology Company

USA . 2,216 parts In-Stock

1+ parts

$12.251

100+ parts

$11.761

1k+ parts

-

10k+ parts

$11.761

2,216

$12.251

$11.761

-

$11.761

Semicontronic

India . 250 parts In-Stock

1+ parts

$37.960

100+ parts

$37.011

1k+ parts

$36.821

10k+ parts

-

250

$37.960

$37.011

$36.821

-

Ampacity Inc.

Singapore . 168 parts In-Stock

1+ parts

$37.960

100+ parts

-

1k+ parts

-

10k+ parts

-

168

$37.960

-

-

-

Corphita

USA . 970 parts In-Stock

1+ parts

$64.305

100+ parts

-

1k+ parts

-

10k+ parts

-

970

$64.305

-

-

-

Component Stockers USA

USA . 684 parts In-Stock

1+ parts

$77.930

100+ parts

$48.700

1k+ parts

-

10k+ parts

-

684

$77.930

$48.700

-

-

Overview

Elevate your telecommunications projects with the HMC555 from Analog Devices. This high-quality telecom interface IC boasts superior performance and reliability, thanks to its manufacturer's reputation for excellence. With a surface-mount design and gold terminal finish, this product is perfect for a wide range of applications in the telecom industry. Experience the value and benefits of the HMC555, offering customers unparalleled advantages in their projects. Trust Analog Devices to deliver exceptional products that meet your needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs.

Package Shape: RECTANGULAR

Rectangular shape offers stability and compatibility with standard PCB layouts, ensuring ease of integration into various electronic devices.

No. of Terminals: 6

Having 6 terminals provides flexibility in connectivity options, allowing for versatile circuit designs and multiple connection points.

Package Style: UNCASED CHIP

Uncased chip packaging reduces overall size and weight of the component, making it suitable for compact and lightweight electronic devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding environments or under heavy loads.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature guarantees functionality in cold conditions, making the product suitable for a wide range of applications.

Terminal Finish: GOLD

Gold terminal finish offers excellent conductivity, corrosion resistance, and solderability, leading to stable and durable connections.

Terminal Position: UPPER

Upper terminal position facilitates easy access and soldering during assembly, simplifying the manufacturing process and improving efficiency.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and complies with RoHS regulations, making the product eco-friendly and safe for use in various applications.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this IC type ensures high performance, reliability, and compatibility with telecommunications systems.

Technical Specifications

Other Function Telecom Interface ICs HMC555 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

R-XUUC-N6

JESD-609 Code:

e4

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

GOLD

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

HMC555 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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