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HMC554LC3B

Analog Devices

HMC554LC3B by Analog Devices

Analog Devices' HMC554LC3B is a telecom IC with 12 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, with peak reflow temp of 260°C. Ideal for industrial applications requiring very thin profile and surface mount compatibility.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,100 parts In-Stock

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6,100

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Digiode

USA . 569 parts In-Stock

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569

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Bristol Electronics

USA . 31 parts In-Stock

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31

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Cyclops Electronics Ltd

UK . 30 parts In-Stock

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30

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Distributors (Availability)

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AZTECH Wire

Italy . 286 parts In-Stock

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$12.515

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286

$12.515

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Parana Technologies

USA . 1,404 parts In-Stock

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$15.170

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$14.108

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IDEA Electronic Components Group

UK . 1,332 parts In-Stock

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$16.312

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$15.496

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$15.496

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$15.496

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DigiPath Technology Company

USA . 3,288 parts In-Stock

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$25.447

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$24.429

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$24.429

3,288

$25.447

$24.429

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$24.429

Component Stockers USA

USA . 377 parts In-Stock

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$99.990

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377

$99.990

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Semicontronic

India . 1,287 parts In-Stock

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$146.000

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$142.350

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$141.620

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1,287

$146.000

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One Stop Electronics

USA . 1,543 parts In-Stock

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$576.000

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Perfect Parts

USA . 2,316 parts In-Stock

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Corphita

USA . 716 parts In-Stock

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Overview

Elevate your telecom interface with the Analog Devices HMC554LC3B. As a leading manufacturer in the industry, Analog Devices ensures top-notch quality and reliability in all their products. The HMC554LC3B offers a wide range of applications in the telecom sector, providing seamless connectivity and functionality. With its surface mount design and compact package shape, this product is perfect for various telecom circuit needs. Experience unparalleled performance and efficiency with the HMC554LC3B, a valuable investment that delivers unmatched benefits to customers seeking cutting-edge telecom solutions.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes it easier to integrate this IC into modern electronic devices, saving space and enabling automated assembly.

Package Shape: SQUARE

The square shape of the package provides stability and ease of handling during assembly and installation.

No. of Terminals: 12

Having 12 terminals allows for versatile connectivity options, making this IC suitable for a variety of telecom interface applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand demanding operating conditions without compromising performance.

Terminal Finish: GOLD OVER NICKEL

The gold over nickel terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections.

Width: 3 mm

The compact width of 3 mm allows for efficient use of space on the PCB, especially in constrained environments.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables high-density mounting, facilitating miniaturization of the overall telecom interface design.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that this IC has a moderate degree of sensitivity to moisture, making it suitable for a wide range of operating environments.

Technical Specifications

Other Function Telecom Interface ICs HMC554LC3B attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N12

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.92 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

GOLD OVER NICKEL

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

HMC554LC3B Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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