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HMC556

Analog Devices

HMC556 by Analog Devices

Analog Devices' HMC556 is a telecom IC with 6 terminals, gold finish, and operates b/w -55°C to 85°C. It's surface mountable in a rectangular package style for telecom circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,532 parts In-Stock

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8,532

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Digiode

USA . 288 parts In-Stock

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288

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 602 parts In-Stock

1+ parts

$5.009

100+ parts

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602

$5.009

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Parana Technologies

USA . 157 parts In-Stock

1+ parts

$13.279

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$12.350

10k+ parts

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157

$13.279

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$12.350

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IDEA Electronic Components Group

UK . 1,433 parts In-Stock

1+ parts

$14.279

100+ parts

$13.565

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$13.565

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1,433

$14.279

$13.565

$13.565

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DigiPath Technology Company

USA . 2,648 parts In-Stock

1+ parts

$22.275

100+ parts

$21.384

1k+ parts

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$21.384

2,648

$22.275

$21.384

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$21.384

One Stop Electronics

USA . 464 parts In-Stock

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$370.000

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464

$370.000

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Semicontronic

India . 1,615 parts In-Stock

1+ parts

$515.000

100+ parts

$502.125

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$499.550

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1,615

$515.000

$502.125

$499.550

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Corphita

USA . 802 parts In-Stock

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802

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Overview

Unleash the power of connectivity with the HMC556 by Analog Devices. Crafted with precision and expertise, this telecom interface IC promises unparalleled quality and reliability. From its surface mount capability to its robust rectangular package shape, this product is designed to elevate your communication infrastructure. Whether you're integrating it into telecom circuits or other applications, the HMC556 delivers unmatched performance in any environment. Trust Analog Devices to provide you with cutting-edge technology that ensures seamless operation and maximum efficiency. Upgrade your systems today with the HMC556 and experience the difference.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation and replacement of the IC, saving time and effort.

Package Shape: RECTANGULAR

Rectangular shape is a common and versatile package shape, making it compatible with a wide range of PCB designs.

No. of Terminals: 6

Having 6 terminals allows for multiple connections and functionalities, increasing the versatility of the IC.

Package Style: UNCASED CHIP

Uncased chip design offers simplicity in integration and reduces the overall size of the product, making it suitable for compact designs.

Operating Temperature Range: -55 to 85 °C

Wide operating temperature range ensures reliable performance in various environmental conditions, making it suitable for a range of applications.

Terminal Finish: GOLD

Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring stable and long-lasting connections.

Terminal Position: UPPER

Upper terminal position allows for easier access and connection to other components on the PCB, simplifying the assembly process.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and eliminates the risk of lead contamination, making it a safer choice for both users and the environment.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC type ensures optimized performance and compatibility with telecommunication systems.

Technical Specifications

Other Function Telecom Interface ICs HMC556 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

R-XUUC-N6

JESD-609 Code:

e4

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

GOLD

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

HMC556 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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