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ADN2913ACPZ

Analog Devices

ADN2913ACPZ by Analog Devices

ADN2913ACPZ by Analog Devices is a 24-terminal telecom IC with a nominal voltage of 3.3V. It operates in industrial temperature range (-40 to 85 °C) and has a terminal pitch of 0.5mm. This square-shaped chip carrier is suitable for telecom circuit applications requiring surface mount technology.

Median Price

$37.340

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,720 parts In-Stock

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-

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$37.340

1k+ parts

$33.410

10k+ parts

$31.450

2,720

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$37.340

$33.410

$31.450

Distributors (In-Stock)

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Bristol Electronics

USA . 8 parts In-Stock

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$36.000

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$36.000

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Digiode

USA . 213 parts In-Stock

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$39.520

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213

$39.520

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Vyrian

USA . 6,808 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 9 parts In-Stock

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Dan-Mar Components

USA . 9 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 230 parts In-Stock

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$9.690

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$9.690

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Parana Technologies

USA . 316 parts In-Stock

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$13.438

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$12.497

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316

$13.438

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$12.497

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IDEA Electronic Components Group

UK . 181 parts In-Stock

1+ parts

$14.449

100+ parts

$13.727

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$13.727

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-

181

$14.449

$13.727

$13.727

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DigiPath Technology Company

USA . 2,900 parts In-Stock

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$22.540

100+ parts

$21.639

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$21.639

2,900

$22.540

$21.639

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$21.639

Semicontronic

India . 2,738 parts In-Stock

1+ parts

$35.360

100+ parts

$34.476

1k+ parts

$34.299

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2,738

$35.360

$34.476

$34.299

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Corphita

USA . 323 parts In-Stock

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$37.440

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323

$37.440

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Vigor

Singapore . 1,131 parts In-Stock

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$39.940

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Northwest PG Solutions

USA . 1,803 parts In-Stock

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Native Components

USA . 824 parts In-Stock

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Microchip USA

USA . 156 parts In-Stock

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156

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Perfect Parts

USA . 26 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 8 parts In-Stock

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Overview

Upgrade your telecom interface systems with the ADN2913ACPZ by Analog Devices. With a reputation for top-quality manufacturing, Analog Devices delivers reliable and innovative solutions for various applications in the telecom industry. This surface-mount IC boasts a square package shape with 24 terminals, making it compact yet powerful. Enjoy the benefits of a wide operating temperature range, industrial-grade reliability, and a nominal supply voltage of 3.3V. Trust Analog Devices to provide you with cutting-edge technology that ensures optimal performance and efficiency in your telecom systems.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and reliable soldering onto circuit boards, making installation convenient and efficient.

Package Shape: SQUARE

The square package shape helps ensure the IC fits neatly into tight spaces on the circuit board, maximizing space efficiency.

No. of Terminals: 24

Having 24 terminals allows for a greater number of connections, providing flexibility in the design and functionality of the telecom interface IC.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this telecom IC can withstand varying environmental conditions and operate reliably in demanding applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the IC can function effectively even in cold environments, enhancing its versatility.

Terminal Finish: MATTE TIN

The matte tin finish on the terminals provides excellent conductivity and solderability, promoting stable electrical connections.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is a common standard in many electronic devices, allowing for seamless integration with various systems.

Technical Specifications

Other Function Telecom Interface ICs ADN2913ACPZ attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

ADN2913ACPZ Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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