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RECTANGULAR Other Function Telecom Interface ICs 538

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Applications Battery Feed Battery Supply (V) Carrier Type-1 Carrier Type-2 Carrier Type-3 Companding Law Data Rate Filter Maximum Gain Tolerance Hybrid ISDN Access Rate Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Minimum Output High Voltage Maximum Output Low Current Maximum Output Low Voltage Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Reference Point Resolution (um) Screening Level Maximum Seated Height Standard Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
MMG30271BT1 by NXP Semiconductors

MMG30271BT1

NXP Semiconductors

TELECOM CIRCUIT; Terminal Form: FLAT; No. of Terminals: 3; Package Code: LSOF; Package Shape: RECTANGULAR; JESD-30 Code: R-PSSO-F3;

R-PSSO-F3

4.5 mm

1

1

3

PLASTIC/EPOXY

LSOF

RECTANGULAR

SMALL OUTLINE, LOW PROFILE

260

1.6 mm

5 V

YES

TELECOM CIRCUIT

FLAT

1.5 mm

SINGLE

40

2.5 mm

MMG30301BT1 by NXP Semiconductors

MMG30301BT1

NXP Semiconductors

TELECOM CIRCUIT; Terminal Form: FLAT; No. of Terminals: 3; Package Code: LSOF; Package Shape: RECTANGULAR; No. of Functions: 1;

R-PSSO-F3

4.5 mm

1

1

3

PLASTIC/EPOXY

LSOF

RECTANGULAR

SMALL OUTLINE, LOW PROFILE

260

1.6 mm

5 V

YES

TELECOM CIRCUIT

FLAT

1.5 mm

SINGLE

40

2.5 mm

SPWF04SA by STMicroelectronics

SPWF04SA

STMicroelectronics

SPWF04SA by STMicroelectronics is a telecom IC with 30 terminals, operating temperature range of -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 1.524mm. Ideal for industrial applications requiring compact surface mount telecom interface ICs.

R-XXMA-N30

26.924 mm

1

30

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

2.3 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.524 mm

UNSPECIFIED

NOT SPECIFIED

15.24 mm

SPWF04SC by STMicroelectronics

SPWF04SC

STMicroelectronics

SPWF04SC by STMicroelectronics is a compact telecom interface IC designed for industrial applications, operating b/w -40 °C to 85 °C. It features a 3.3V nominal voltage and comes in a rectangular package with 30 terminals. Ideal for surface mount designs, it ensures reliable performance in demanding environments.

R-XXMA-N30

26.924 mm

1

30

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

2.3 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.524 mm

UNSPECIFIED

NOT SPECIFIED

15.24 mm

PI3USB30532ZLE by Diodes Incorporated

PI3USB30532ZLE

Diodes Incorporated

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: RECTANGULAR;

R-XQCC-N40

6 mm

1

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.8 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.4 mm

QUAD

NOT SPECIFIED

3 mm

WYSBHVGXG by Taiyo Yuden

WYSBHVGXG

Taiyo Yuden

Taiyo Yuden's WYSBHVGXG is a telecom IC with 70 terminals, operating at -30 to 85°C. Its compact MICROELECTRONIC ASSEMBLY package measures 8.9mm x 12.6mm x 1.9mm, suitable for telecom circuit applications requiring a nominal voltage of 3.3V.

R-XXMA-N70

12.6 mm

1

70

85 Cel

-30 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

1.9 mm

3.3 V

YES

TELECOM CIRCUIT

OTHER

NO LEAD

UNSPECIFIED

NOT SPECIFIED

8.9 mm

EFR32BG1B232F256GJ43-C0 by Silicon Labs

EFR32BG1B232F256GJ43-C0

Silicon Labs

EFR32BG1B232F256GJ43-C0 by Silicon Labs is a 43-terminal IC with telecom circuit type, operating at -40 to 85°C. It has a nominal voltage of 3.3V and uses ball terminal form. This industrial-grade IC in grid array package is ideal for telecom interface applications.

R-PBGA-B43

3.295 mm

1

43

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.54 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.4 mm

BOTTOM

3.143 mm

EFR32BG1P332F256GJ43-C0 by Silicon Labs

EFR32BG1P332F256GJ43-C0

Silicon Labs

EFR32BG1P332F256GJ43-C0 by Silicon Labs is a Telecom IC with 3.3V supply voltage, operating from -40 to 85°C. It features a grid array package style with 43 terminals and tin silver copper finish. Ideal for telecom circuits, it has a very thin profile and fine pitch design for industrial applications.

R-PBGA-B43

e1

3.295 mm

1

1

43

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.54 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

40

3.143 mm

EFR32BG1V132F256GJ43-C0 by Silicon Labs

EFR32BG1V132F256GJ43-C0

Silicon Labs

EFR32BG1V132F256GJ43-C0 by Silicon Labs is a telecom IC with 3.3V supply voltage, operating from -40 to 85°C. It features a grid array package style with 43 terminals and 0.4mm pitch, suitable for industrial applications requiring thin profile and fine pitch components.

R-PBGA-B43

3.295 mm

1

43

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.54 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.4 mm

BOTTOM

3.143 mm

PI3PCIE3242ZLEX by Diodes Incorporated

PI3PCIE3242ZLEX

Diodes Incorporated

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 30; Package Code: HVQCCN; Package Shape: RECTANGULAR;

R-XQCC-N30

4.5 mm

1

30

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.8 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.4 mm

QUAD

30

2.5 mm

NEO-M8Q-0 by U-blox Ag

NEO-M8Q-0

U-blox Ag

NEO-M8Q-0 by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. With AEC-Q100 screening and TS 16949 certification, it's ideal for industrial applications requiring a 3V supply voltage. Its compact rectangular package measures 12.2mm x 16mm with a seated height of 2.6mm, making it suitable for space-constrained designs in automotive or telecommunications systems.

R-XDMA-N24

16 mm

4

1

24

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

AEC-Q100; TS 16949

2.6 mm

3 V

NO

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

DUAL

12.2 mm

BGM111E256V2 by Silicon Labs

BGM111E256V2

Silicon Labs

Silicon Labs BGM111E256V2 is a RECTANGULAR MICROELECTRONIC ASSEMBLY with 31 terminals, operating from -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 1.2mm, suitable for TELECOM CIRCUIT applications in INDUSTRIAL settings.

R-XXMA-B31

15 mm

1

31

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.15 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BUTT

1.2 mm

UNSPECIFIED

12.9 mm

BM71BLE01FC2-0B02AA by Microchip Technology

BM71BLE01FC2-0B02AA

Microchip Technology

BM71BLE01FC2-0B02AA by Microchip Technology is a RECTANGULAR MICROELECTRONIC ASSEMBLY with 17 terminals, operating from -40 to 85 °C. It's a TELECOM CIRCUIT IC with 3V supply voltage, 0.0086 Mbps data rate, suitable for industrial applications like telecom interfaces.

.0086 Mbps

R-XQMA-N17

8 mm

1

17

85 Cel

-40 Cel

UNSPECIFIED

QMA

MODULE,17LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

260

1.66 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.2 mm

QUAD

30

6 mm

SL869GNS117T001 by Telit Communications Plc

SL869GNS117T001

Telit Communications Plc

Telit Communications Plc's SL869GNS117T001 is a small outline telecom IC with 24 terminals, operating from -40 to 85°C. It has a nominal voltage of 3.3V and is surface-mountable. Ideal for industrial applications requiring compact telecom circuitry with dual terminal positions.

R-PDSO-N24

16 mm

1

24

85 Cel

-40 Cel

PLASTIC/EPOXY

SON

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

2.4 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

DUAL

NOT SPECIFIED

12.2 mm

MGM111A256V1 by Silicon Labs

MGM111A256V1

Silicon Labs

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 31; Package Code: XMA; Package Shape: RECTANGULAR;

.25 Mbps

R-XXMA-N31

15 mm

1

31

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.1 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.2 mm

UNSPECIFIED

12.9 mm

BGM111A256V21 by Silicon Labs

BGM111A256V21

Silicon Labs

BGM111A256V21 by Silicon Labs is a telecom IC with 31 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 1.2mm. This rectangular surface-mount package is ideal for industrial telecom circuit applications due to its compact size and temperature range.

R-XXMA-N31

15 mm

31

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.2 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.2 mm

UNSPECIFIED

12.9 mm

AMW037 by Silicon Labs

AMW037

Silicon Labs

Silicon Labs' AMW037 is a telecom IC with 44 terminals, operating at -40 to 85°C. With a data rate of 54 Mbps and nominal voltage of 3.3 V, it's ideal for telecom circuit applications requiring high-speed connectivity in compact microelectronic assemblies.

54 Mbps

R-XQMA-N44

24.77 mm

1

44

85 Cel

-40 Cel

UNSPECIFIED

QMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.72 mm

3.3 V

YES

TELECOM CIRCUIT

NO LEAD

1.27 mm

UNSPECIFIED

16.51 mm

ATSAMB11-XR2100A by Microchip Technology

ATSAMB11-XR2100A

Microchip Technology

ATSAMB11-XR2100A by Microchip: Telecom IC with 49 terminals, 3.6V supply voltage, and -40 to 85°C operating range. Ideal for telecom circuits in industrial applications due to TS 16949 screening level and compact GRID ARRAY package style.

R-XBGA-N49

5.5 mm

1

49

85 Cel

-40 Cel

UNSPECIFIED

HLGA

RECTANGULAR

GRID ARRAY, HEAT SINK/SLUG

TS 16949

1.4 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

BOTTOM

4.5 mm

RN4870U-V/RM118 by Microchip Technology

RN4870U-V/RM118

Microchip Technology

RN4870U-V/RM118 by Microchip Technology is a telecom IC with 30 terminals, operating temperature range of -20 to 70°C, and data rate of 0.01 Mbps. It is a surface mount IC suitable for telecom applications requiring a nominal voltage of 3V in a compact rectangular package style.

.01 Mbps

R-XXMA-N30

15 mm

1

30

70 Cel

-20 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

1.6 mm

3 V

YES

TELECOM CIRCUIT

NO LEAD

UNSPECIFIED

12 mm

RN4871-V/RM118 by Microchip Technology

RN4871-V/RM118

Microchip Technology

RN4871-V/RM118 by Microchip Tech is a TS 16949-certified IC with 16 terminals, operating at -20 to 70°C. It's a telecom circuit with 3V supply voltage, supporting data rates up to 0.01 Mbps. Ideal for applications requiring compact size and surface mount compatibility.

.01 Mbps

R-XXMA-N16

11.5 mm

1

16

70 Cel

-20 Cel

UNSPECIFIED

XMA

MODULE,16LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

2.16 mm

3 V

YES

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

1.2 mm

UNSPECIFIED

9 mm

MAX-8Q by U-blox Ag

MAX-8Q

U-blox Ag

The U-blox Ag MAX-8Q is a telecom IC with 18 terminals, operating temperature range of -40 to 85°C. It is AEC-Q100 and TS 16949 compliant, suitable for industrial applications requiring a nominal voltage of 3V. The package is made of PLASTIC/EPOXY material, surface mountable in a small outline style for telecom circuit interfaces.

R-PDSO-N18

1

18

85 Cel

-40 Cel

PLASTIC/EPOXY

SON

RECTANGULAR

SMALL OUTLINE

NOT SPECIFIED

AEC-Q100; TS 16949

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

DUAL

NOT SPECIFIED

CC2564BYFVR-XI by Texas Instruments

CC2564BYFVR-XI

Texas Instruments

CC2564BYFVR-XI by Texas Instruments is a 54-terminal IC with a package style of GRID ARRAY. It operates at -40 to 85°C, has a data rate of 4 Mbps, and requires a nominal voltage of 3.6 V. Ideal for telecom circuits, this IC is surface mountable and features TIN SILVER COPPER terminal finish.

4 Mbps

R-XBGA-B54

e1

3.26 mm

1

1

54

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.575 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

2.93 mm

CC2560BYFVR by Texas Instruments

CC2560BYFVR

Texas Instruments

CC2560BYFVR by Texas Instruments is a telecom IC with 54 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage of 3.6V. Ideal for telecom circuits, it features a very thin profile and fine pitch design for compact applications.

R-PBGA-B54

e1

3.265 mm

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.575 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

2.925 mm

CC2560BYFVT by Texas Instruments

CC2560BYFVT

Texas Instruments

CC2560BYFVT by Texas Instruments is a telecom IC with 54 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage of 3.6V. Ideal for telecom circuits, it features a very thin profile and fine pitch design for compact applications.

R-PBGA-B54

e1

3.265 mm

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.575 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

2.925 mm

TLE8457BSJXUMA1 by Infineon Technologies

TLE8457BSJXUMA1

Infineon Technologies

TLE8457BSJXUMA1 by Infineon is a BICMOS technology telecom IC with 8 terminals in a small outline package. It operates at a nominal voltage of 8V and has a terminal pitch of 1.27mm. This AEC-Q100 screened IC is ideal for telecom circuit applications due to its compact size and gull wing terminal form.

R-PDSO-G8

e3

5 mm

3

1

8

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

AEC-Q100

1.75 mm

8 V

YES

BICMOS

TELECOM CIRCUIT

TIN

GULL WING

1.27 mm

DUAL

4 mm

BGS13PN10E6327XTSA1 by Infineon Technologies

BGS13PN10E6327XTSA1

Infineon Technologies

BGS13PN10E6327XTSA1 by Infineon is a Telecom Interface IC with 10 terminals in a rectangular chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial applications. Features CMOS technology, nominal voltage of 2.85V, and terminal pitch of 0.4mm for telecom circuits.

R-XBCC-B10

e3

1.5 mm

1

1

10

85 Cel

-40 Cel

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

.4 mm

2.85 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN

BUTT

.4 mm

BOTTOM

1.1 mm

BGM1033N7E6327XUSA1 by Infineon Technologies

BGM1033N7E6327XUSA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: HVSON; Package Shape: RECTANGULAR;

R-PDSO-N6

2.3 mm

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

HVSON

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

.77 mm

2.7 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.54 mm

DUAL

NOT SPECIFIED

1.7 mm

BGM15HA12E6327XTSA1 by Infineon Technologies

BGM15HA12E6327XTSA1

Infineon Technologies

BGM15HA12E6327XTSA1 by Infineon is a telecom interface IC with 12 terminals in a chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 2.8V, it's ideal for telecom circuit applications requiring surface mount technology.

R-PBCC-N12

e4

1.9 mm

1

1

12

85 Cel

-40 Cel

PLASTIC/EPOXY

VQCCN

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE

.65 mm

2.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

GOLD NICKEL

NO LEAD

.4 mm

BOTTOM

1.1 mm

BGM15MA12E6327XTSA1 by Infineon Technologies

BGM15MA12E6327XTSA1

Infineon Technologies

BGM15MA12E6327XTSA1 by Infineon is a telecom IC with 12 terminals, operating temperature range of -40 to 85°C. It features a chip carrier package style, very thin profile, and no-lead terminal form. Ideal for telecom circuit applications with a nominal voltage of 2.8V and compact dimensions of 1.9mm x 1.1mm x 0.65mm.

R-PBCC-N12

1.9 mm

1

1

12

85 Cel

-40 Cel

PLASTIC/EPOXY

VQCCN

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE

.65 mm

2.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

.4 mm

BOTTOM

1.1 mm

BGT24AR2E6433XUMA1 by Infineon Technologies

BGT24AR2E6433XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: RECTANGULAR;

R-PQCC-N32

e3

5.5 mm

3

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

.9 mm

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

AUTOMOTIVE

TIN

NO LEAD

.5 mm

QUAD

4.5 mm

BGT24AT2E6433XUMA1 by Infineon Technologies

BGT24AT2E6433XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: RECTANGULAR;

R-PQCC-N32

e3

5.5 mm

3

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

.9 mm

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

AUTOMOTIVE

TIN

NO LEAD

.5 mm

QUAD

4.5 mm

BGT24ATR12E6433XUMA1 by Infineon Technologies

BGT24ATR12E6433XUMA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: RECTANGULAR;

R-PQCC-N32

e3

5.5 mm

3

1

32

125 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

AEC-Q100

.9 mm

3.3 V

YES

BIPOLAR

TELECOM CIRCUIT

AUTOMOTIVE

TIN

NO LEAD

.5 mm

QUAD

4.5 mm

RN4870-I/RM128 by Microchip Technology

RN4870-I/RM128

Microchip Technology

RN4870-I/RM128 by Microchip Technology is a telecom IC with 33 terminals, operating temperature range of -40 to 85°C, and data rate of 0.01 Mbps. It is used in industrial applications requiring a nominal voltage of 3.3V for wireless communication.

.01 Mbps

R-XXMA-N33

22 mm

1

33

85 Cel

-40 Cel

UNSPECIFIED

XMA

MODULE,33LEAD(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.46 mm

3.3 V

NO

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.1 mm

UNSPECIFIED

12 mm

LEA-6H-0 by U-blox Ag

LEA-6H-0

U-blox Ag

LEA-6H-0 by U-blox Ag is a telecom circuit IC with 28 terminals, operating at -40 to 85°C. It features a 3V supply voltage, AEC-Q100 screening level, and compact rectangular package ideal for industrial applications. With dual terminal position and no lead terminal form, it offers reliable performance in microelectronic assemblies.

R-XDMA-N28

22.4 mm

1

28

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

AEC-Q100

2.7 mm

3 V

NO

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

1.1 mm

DUAL

NOT SPECIFIED

17 mm

LC72720YVS-MPB-E by Onsemi

LC72720YVS-MPB-E

Onsemi

LC72720YVS-MPB-E by Onsemi is a telecom IC with 30 terminals, operating from -40 to 85 °C. It has a supply voltage of 3.3V and peak reflow temp of 260°C. Ideal for telecom circuits, it comes in a small outline package with gull wing terminals.

R-PDSO-G30

e6

9.75 mm

4

1

30

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

1.5 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN BISMUTH

GULL WING

.65 mm

DUAL

30

5.6 mm

LC72720YVS-TLM-E by Onsemi

LC72720YVS-TLM-E

Onsemi

LC72720YVS-TLM-E by Onsemi is a telecom IC with 30 terminals in a small outline package. It operates b/w -40 to 85 °C, suitable for industrial use. Features include 3.3V supply voltage, Gull Wing terminals, and tin bismuth finish for telecom circuit applications.

R-PDSO-G30

e6

9.75 mm

4

1

30

85 Cel

-40 Cel

PLASTIC/EPOXY

LSSOP

RECTANGULAR

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

260

1.5 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN BISMUTH

GULL WING

.65 mm

DUAL

30

5.6 mm

IP4047CX6/LF,135 by Nexperia

IP4047CX6/LF,135

Nexperia

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR;

R-PBGA-B6

1.44 mm

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.7 mm

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.5 mm

BOTTOM

.99 mm

RN41XVC-I/RM by Microchip Technology

RN41XVC-I/RM

Microchip Technology

Microchip Technology's RN41XVC-I/RM is a telecom IC with 20 terminals, operating from -40 to 85°C. It has a nominal voltage of 3.3V and is designed for industrial applications. The package style is rectangular with dimensions of 24.4mm x 29.9mm, making it suitable for various telecom interface functions.

R-XDMA-T20

29.9 mm

1

1

20

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2 mm

3.3 V

NO

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

DUAL

24.4 mm

RN41XVU-I/RM by Microchip Technology

RN41XVU-I/RM

Microchip Technology

Microchip Technology's RN41XVU-I/RM is a telecom IC with 20 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and nickel/gold terminal finish. This rectangular package is ideal for industrial applications requiring a compact MICROELECTRONIC ASSEMBLY design.

R-XDMA-T20

e4

29.9 mm

1

20

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2 mm

3.3 V

NO

TELECOM CIRCUIT

INDUSTRIAL

Nickel/Gold (Ni/Au)

THROUGH-HOLE

DUAL

24.4 mm

RN42XVU-I/RM by Microchip Technology

RN42XVU-I/RM

Microchip Technology

RN42XVU-I/RM by Microchip Technology is a telecom interface IC with 1 function. It has a rectangular package shape with 20 terminals and a max seated height of 2mm. This industrial-grade IC operates at temperatures ranging from -40 to 85°C and has a nominal voltage of 3.3V, making it suitable for various telecom circuit applications.

R-XDMA-T20

e4

29.9 mm

1

20

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2 mm

3.3 V

NO

TELECOM CIRCUIT

INDUSTRIAL

Nickel/Gold (Ni/Au)

THROUGH-HOLE

DUAL

24.4 mm

AX-SFEU-1-01-TB05 by Onsemi

AX-SFEU-1-01-TB05

Onsemi

AX-SFEU-1-01-TB05 by Onsemi is a Telecom Circuit IC with 40 terminals in a rectangular chip carrier package. It operates b/w -40 to 85°C, with a nominal voltage of 3V. This surface-mount IC is ideal for telecom interface applications requiring a very thin profile and industrial temperature grade.

R-PQCC-N40

e4

7 mm

1

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC40,.2X.27,20

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

5 mm

BGA5M1BN6E6327XTSA1 by Infineon Technologies

BGA5M1BN6E6327XTSA1

Infineon Technologies

Infineon's BGA5M1BN6E6327XTSA1 is a RECTANGULAR CHIP CARRIER with 6 terminals, operating from -40 to 85°C. It is an INDUSTRIAL-grade TELECOM CIRCUIT IC with a supply voltage of 1.8V, suitable for telecom interface applications due to its compact size and surface-mount capability.

R-XBCC-B6

1.1 mm

1

1

6

85 Cel

-40 Cel

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

.4 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BUTT

.4 mm

BOTTOM

.7 mm

BGSF110GN26E6327XTSA1 by Infineon Technologies

BGSF110GN26E6327XTSA1

Infineon Technologies

BGSF110GN26E6327XTSA1 by Infineon is a Telecom IC with 26 terminals in a rectangular chip carrier package. Operating temperature range from -30 to 85°C, suitable for telecom circuits. Utilizes CMOS technology with a nominal voltage of 3V, ideal for surface mount applications.

R-PQCC-N26

e4

3.4 mm

1

1

26

85 Cel

-30 Cel

PLASTIC/EPOXY

HQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG

.77 mm

3 V

YES

CMOS

TELECOM CIRCUIT

OTHER

NICKEL PALLADIUM GOLD SILVER

NO LEAD

QUAD

2.6 mm

RM024-P125-C-30 by Laird Technologies

RM024-P125-C-30

Laird Technologies

RM024-P125-C-30 by Laird Technologies is an industrial-grade TELECOM CIRCUIT with a data rate of 0.5 Mbps. Operating temperature ranges from -40°C to 85°C, making it suitable for various telecom applications. Packaged in MICROELECTRONIC ASSEMBLY, this IC is ideal for telecommunications interfaces requiring reliable performance in harsh environments.

ALSO AVAILABLE WITH 280kbps data rate

.5 Mbps

R-XXMA-X

1

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

NO

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

UNSPECIFIED

NOT SPECIFIED

RM024-S125-C-30 by Laird Technologies

RM024-S125-C-30

Laird Technologies

RM024-S125-C-30 by Laird Technologies is an industrial-grade TELECOM CIRCUIT with a data rate of 0.5 Mbps. Operating temperature ranges from -40°C to 85°C, making it suitable for various telecom applications. Packaged in MICROELECTRONIC ASSEMBLY, this RECTANGULAR device excels in telecom interface functions.

ALSO AVAILABLE WITH 280kbps data rate

.5 Mbps

R-XXMA-X

1

85 Cel

-40 Cel

UNSPECIFIED

XMA

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

NO

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

UNSPECIFIED

NOT SPECIFIED

LEA-6T-0 by U-blox Ag

LEA-6T-0

U-blox Ag

LEA-6T-0 by U-blox Ag is a telecom IC with 28 terminals, operating from -40 to 85°C. It has a nominal voltage of 3V and is AEC-Q100 and TS 16949 compliant. This surface-mount IC is designed for industrial applications requiring reliable telecom circuitry in a small outline package.

R-PDSO-N28

1

28

85 Cel

-40 Cel

PLASTIC/EPOXY

SON

RECTANGULAR

SMALL OUTLINE

AEC-Q100; TS 16949

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

DUAL

BGAU1A10E6327XTSA1 by Infineon Technologies

BGAU1A10E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 10; Package Code: BCC; Package Shape: RECTANGULAR;

R-XBCC-B10

1.5 mm

1

1

10

85 Cel

-30 Cel

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

.65 mm

1.8 V

YES

TELECOM CIRCUIT

OTHER

BUTT

.4 mm

BOTTOM

1.1 mm

ACFM-7037-TR1 by Broadcom

ACFM-7037-TR1

Broadcom

TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 15; Package Shape: RECTANGULAR; JESD-30 Code: R-XXMA-N15; Terminal Position: UNSPECIFIED;

R-XXMA-N15

3.6 mm

1

15

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

.8 mm

YES

TELECOM CIRCUIT

NO LEAD

UNSPECIFIED

2 mm