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SPWF04SC

STMicroelectronics

SPWF04SC by STMicroelectronics

SPWF04SC by STMicroelectronics is a compact telecom interface IC designed for industrial applications, operating b/w -40 °C to 85 °C. It features a 3.3V nominal voltage and comes in a rectangular package with 30 terminals. Ideal for surface mount designs, it ensures reliable performance in demanding environments.

Median Price

$0.281

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 305 parts In-Stock

1+ parts

$0.281

100+ parts

$0.281

1k+ parts

$0.281

10k+ parts

$0.281

305

$0.281

$0.281

$0.281

$0.281

Verical

USA . 305 parts In-Stock

1+ parts

-

100+ parts

$0.281

1k+ parts

$0.281

10k+ parts

$0.281

305

-

$0.281

$0.281

$0.281

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,277 parts In-Stock

1+ parts

$0.267

100+ parts

-

1k+ parts

-

10k+ parts

-

2,277

$0.267

-

-

-

Vyrian

USA . 6,588 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,588

-

-

-

-

Anansix

USA . 1,785 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,785

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,545 parts In-Stock

1+ parts

$0.253

100+ parts

-

1k+ parts

-

10k+ parts

-

4,545

$0.253

-

-

-

IDEA Electronic Components Group

UK . 1,552 parts In-Stock

1+ parts

$10.941

100+ parts

-

1k+ parts

$9.847

10k+ parts

-

1,552

$10.941

-

$9.847

-

AZTECH Wire

Italy . 776 parts In-Stock

1+ parts

$12.180

100+ parts

-

1k+ parts

-

10k+ parts

-

776

$12.180

-

-

-

MKK Technologies

India . 2,312 parts In-Stock

1+ parts

$20.573

100+ parts

-

1k+ parts

-

10k+ parts

-

2,312

$20.573

-

-

-

DigiPath Technology Company

USA . 2,312 parts In-Stock

1+ parts

$20.573

100+ parts

-

1k+ parts

-

10k+ parts

-

2,312

$20.573

-

-

-

Perfect Parts

USA . 1,747 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,747

-

-

-

-

Parana Technologies

USA . 434 parts In-Stock

1+ parts

-

100+ parts

$13.081

1k+ parts

-

10k+ parts

-

434

-

$13.081

-

-

Overview

Elevate your connectivity solutions with STMicroelectronics' SPWF04SC, a robust telecom interface IC designed for industrial applications. With its compact, surface-mount design and exceptional temperature resilience, this device ensures reliable performance in demanding environments. Trust in STMicroelectronics' legacy of quality and innovation to enhance your products, streamline integration, and drive operational efficiency—unlocking the full potential of your telecommunications systems.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient space utilization, making it ideal for compact applications.

Package Shape: RECTANGULAR

The rectangular package shape ensures optimal layout in PCB designs, enhancing performance and reliability.

No. of Terminals: 30

With 30 terminals, this IC offers ample connectivity options for complex telecom functions.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

This package style provides robust performance essential for microelectronics applications, ensuring durability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the IC to function reliably in a variety of environments, enhancing its versatility.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature enables the product to perform in harsh conditions, making it suitable for industrial applications.

Maximum Seated Height: 2.3 mm

The compact seated height supports high-density designs, facilitating integration into space-constrained applications.

Width: 15.24 mm

The specified width helps optimize PCB layout, permitting better routing and connectivity options in telecom designs.

Length: 26.924 mm

This length is suitable for advanced telecom ICs, allowing for enhanced performance without compromising space.

Temperature Grade: INDUSTRIAL

Designed to meet industrial standards, this IC provides reliability and longevity in demanding environments.

Terminal Form: NO LEAD

The no-lead construction minimizes parasitic inductance, improving electrical performance in high-speed applications.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC ensures optimized performance in communications systems.

Nominal Supply Voltage: 3.3 V

This nominal supply voltage is standard for many digital circuits, ensuring compatibility with a wide range of devices.

Terminal Pitch: 1.524 mm

The 1.524 mm terminal pitch facilitates easy soldering and assembly, enhancing manufacturability and reliability.

Technical Specifications

Other Function Telecom Interface ICs SPWF04SC attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-XXMA-N30

Length:

26.924 mm

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

2.3 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.524 mm

Terminal Position:

UNSPECIFIED

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

SPWF04SC Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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