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SPWF01SC.21

STMicroelectronics

SPWF01SC.21 by STMicroelectronics

SPWF01SC.21 by STMicroelectronics is a telecom interface IC designed for industrial applications, operating b/w -40 °C to 85 °C. It features a compact 25-terminal microelectronic assembly with a nominal voltage of 3.3V. Ideal for surface mount designs, it ensures reliable performance in demanding environments.

Median Price

$12.870

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 772 parts In-Stock

1+ parts

$12.870

100+ parts

$11.879

1k+ parts

$10.553

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772

$12.870

$11.879

$10.553

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Digiode

USA . 4,360 parts In-Stock

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Vyrian

USA . 3,406 parts In-Stock

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3,406

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Anansix

USA . 440 parts In-Stock

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440

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Inventory MP

USA . 429 parts In-Stock

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429

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Lakeland Logistics Inc

USA . 343 parts In-Stock

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343

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J2 Sourcing AB

Sweden . 30 parts In-Stock

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30

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Bas Electronics GmbH & Co. KG

Germany . 5 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 540 parts In-Stock

1+ parts

$13.891

100+ parts

-

1k+ parts

$12.502

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540

$13.891

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$12.502

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Continental Prestige Electronics

USA . 206 parts In-Stock

1+ parts

$15.060

100+ parts

$11.700

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206

$15.060

$11.700

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MKK Technologies

India . 1,929 parts In-Stock

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$26.121

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1,929

$26.121

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DigiPath Technology Company

USA . 1,929 parts In-Stock

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$26.121

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1,929

$26.121

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Parana Technologies

USA . 1,961 parts In-Stock

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$16.609

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1,961

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$16.609

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Metaverse IC Inc.

Canada . 577 parts In-Stock

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577

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Perfect Parts

USA . 336 parts In-Stock

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Corphita

USA . 166 parts In-Stock

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Overview

Unlock seamless connectivity with the SPWF01SC.21 from STMicroelectronics, a trusted leader in innovation and quality. This robust telecom interface IC is designed for industrial applications, ensuring reliable performance in challenging environments from -40 °C to 85 °C. Its compact, surface-mount design saves space while providing exceptional efficiency. Elevate your projects with a solution that combines advanced technology, durability, and unmatched support from a renowned manufacturer. Experience the difference!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient assembly and smaller circuit board footprints, making it ideal for modern compact electronics.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on the board, ensuring compatibility with various layouts and designs.

No. of Terminals: 25

With 25 terminals, this IC offers multiple connectivity options, facilitating complex circuit designs and enhancing versatility.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

This package style is suitable for high-density applications, ensuring reliable performance in compact electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this IC suitable for use in demanding environments, ensuring reliable performance under stress.

Minimum Operating Temperature: -40 °C

Operating at temperatures as low as -40 °C ensures the IC can be used in a wide range of outdoor and harsh environmental applications.

Maximum Seated Height: 2.45 mm

The low maximum seated height allows for a compact design, making it an excellent choice for space-constrained applications.

Width: 15.24 mm

With a moderate width of 15.24 mm, this device can fit in a variety of equipment layouts without compromising performance.

Length: 26.924 mm

The length provides a balance between functionality and size, accommodating necessary terminal connections without excessive board space.

Temperature Grade: INDUSTRIAL

This industrial temperature grade guarantees reliability and durability for critical applications, making it suitable for harsh environments.

Terminal Form: NO LEAD

The no lead terminal form provides a sleek design that enhances the overall thermal and electrical performance of the device.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom applications, this IC ensures optimized performance in communication systems and networks.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V is widely adopted in the industry, ensuring compatibility with many existing circuits and systems.

Terminal Pitch: 1.524 mm

The 1.524 mm terminal pitch provides a good balance between ease of soldering and compact design, ensuring reliable connections.

Technical Specifications

Other Function Telecom Interface ICs SPWF01SC.21 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-XXMA-N25

Length:

26.924 mm

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

2.45 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.524 mm

Terminal Position:

UNSPECIFIED

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

SPWF01SC.21 Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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