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BGA Other Function Telecom Interface ICs 27

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Applications Battery Feed Battery Supply (V) Carrier Type-1 Carrier Type-2 Carrier Type-3 Companding Law Data Rate Filter Maximum Gain Tolerance Hybrid ISDN Access Rate Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Minimum Output High Voltage Maximum Output Low Current Maximum Output Low Voltage Maximum Output Voltage Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Reference Point Resolution (um) Screening Level Maximum Seated Height Standard Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
CC2564NSYFVR by Texas Instruments

CC2564NSYFVR

Texas Instruments

The Texas Instruments CC2564NSYFVR is a telecom IC with 54 terminals in a grid array package. It operates b/w -40°C to 85°C, with peak reflow temperature of 260°C. Suitable for industrial applications, it has a nominal voltage of 3.6V and features tin silver copper terminal finish.

R-PBGA-B54

e1

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

260

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

CC2564NYFVR by Texas Instruments

CC2564NYFVR

Texas Instruments

Texas Instruments CC2564NYFVR is a 54-terminal IC with industrial temperature grade. It operates at -40 to 85°C, with a peak reflow temp of 260°C. Ideal for telecom circuits, it has a nominal voltage of 3.6V and features surface mount packaging in plastic/epoxy material.

R-PBGA-B54

e1

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

260

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

CC2564YFVR by Texas Instruments

CC2564YFVR

Texas Instruments

Texas Instruments CC2564YFVR is a telecom IC with 54 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.6V and peak reflow temperature of 260°C. Ideal for industrial applications requiring reliable telecom circuit interfaces in a surface-mount grid array package.

R-PBGA-B54

e1

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

260

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

CC2564YFVT by Texas Instruments

CC2564YFVT

Texas Instruments

The Texas Instruments CC2564YFVT is a telecom IC with 54 terminals, operating from -40 to 85°C. It has a supply voltage of 3.6V and peak reflow temperature of 260°C. This rectangular grid array package is ideal for industrial telecom applications.

R-PBGA-B54

e1

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

260

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

TLK3138ZDU by Texas Instruments

TLK3138ZDU

Texas Instruments

TLK3138ZDU by Texas Instruments is a telecom IC with 2 transceivers, operating at 3125 Mbps data rate. It has a package style of grid array, with 484 terminals and power supplies ranging from 1.2V to 2.5V. Ideal for telecom circuit applications due to its CMOS technology and commercial temperature grade suitability.

3125 Mbps

S-PBGA-B484

e1

23 mm

4

2

484

2

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

260

1.2,1.5,2.5

Not Qualified

2.42 mm

Network Interfaces

1.2 V

YES

CMOS

TELECOM CIRCUIT

COMMERCIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

23 mm

DS31256B by Maxim Integrated

DS31256B

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B256

e0

27 mm

1

256

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Not Qualified

2.54 mm

3.3 V

YES

CMOS

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

BALL

1.27 mm

BOTTOM

27 mm

TLK3138GDU by Texas Instruments

TLK3138GDU

Texas Instruments

TLK3138GDU by Texas Instruments is a telecom IC with 2 transceivers, operating at 3125 Mbps data rate. It has a package style of grid array, suitable for commercial temperature grade applications. The IC supports power supplies of 1.2V, 1.5V, and 2.5V in a square package shape with 484 terminals.

3125 Mbps

S-PBGA-B484

e0

4

2

484

2

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

220

1.2,1.5,2.5

Not Qualified

Network Interfaces

1.2 V

YES

CMOS

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

BALL

1 mm

BOTTOM

20

TLK3134ZEL by Texas Instruments

TLK3134ZEL

Texas Instruments

TLK3134ZEL by Texas Instruments is a telecom IC with data rate of 3750 Mbps, operating temperature range of -40 to 85°C, and supply voltage options of 1.2V. It features a grid array package style, CMOS technology, and is suitable for telecom circuit applications.

3750 Mbps

S-PBGA-B289

e1

19 mm

4

1

289

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA289,17X17,40

SQUARE

GRID ARRAY

260

1.2,1.5,2.5

Not Qualified

2.48 mm

Other Telecom ICs

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

19 mm

STLC60845 by STMicroelectronics

STLC60845

STMicroelectronics

STLC60845 by STMicroelectronics is a CMOS telecom circuit IC designed for efficient communication. It features a 1.8 V nominal voltage, 292 terminals in a square grid array package, and supports surface mount technology. Ideal for advanced telecom applications, it ensures reliable performance in compact designs.

S-PBGA-B292

1

292

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Not Qualified

1.8 V

YES

CMOS

TELECOM CIRCUIT

BALL

BOTTOM

GC4016-PBZ by Texas Instruments

GC4016-PBZ

Texas Instruments

Texas Instruments GC4016-PBZ is a 160-terminal IC with CMOS technology, operating b/w -40 to 85°C. It features a 2.5V supply voltage, square package style, and ball terminal form. Ideal for telecom circuits, it has a peak reflow temp of 260°C and MSL level of 3 for industrial applications.

S-PBGA-B160

e1

15 mm

3

1

160

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

Not Qualified

1.75 mm

2.5 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

15 mm

AD6652BBCZ by Analog Devices

AD6652BBCZ

Analog Devices

AD6652BBCZ by Analog Devices is a 256-terminal IC with CMOS technology. It operates b/w -40 to 70°C, suitable for telecom circuits with a 2.5V supply voltage requirement. The package is a square grid array measuring 17x17mm, designed for surface mount applications.

S-PBGA-B256

e1

17 mm

3

1

256

70 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

Not Qualified

2.5 V

YES

CMOS

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

17 mm

VSC8484YJP by Microchip Technology

VSC8484YJP

Microchip Technology

VSC8484YJP by Microchip Technology is a telecom IC with 324 terminals in a square grid array package. It operates b/w -40°C to 105°C, suitable for industrial use. With a nominal voltage of 1.2V, it is designed for telecom circuit applications.

S-PBGA-B324

18.6 mm

1

324

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

2.74 mm

1.2 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

1 mm

BOTTOM

18.6 mm

LMS7002M by Lime Microsystems

LMS7002M

Lime Microsystems

Lime Microsystems' LMS7002M is a telecom IC with 261 terminals, operating from -40 to 85°C. It has a nominal voltage of 1.2V and uses a grid array package style. Ideal for industrial applications requiring precise telecom circuit functionality in compact form factor.

S-PBGA-B261

11.5 mm

1

261

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.2 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

BOTTOM

11.5 mm

PM5440B-FEI by Microchip Technology

PM5440B-FEI

Microchip Technology

PM5440B-FEI by Microchip Technology is a grid array package with 1894 terminals. It is a telecom circuit IC designed for telecom interface applications. The package body material is plastic/epoxy, and it features surface mount technology with bottom terminal position in a square shape.

S-PBGA-B1894

1

1894

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TELECOM CIRCUIT

BALL

BOTTOM

PM5980B-FEI by Microchip Technology

PM5980B-FEI

Microchip Technology

PM5980B-FEI by Microchip Technology is a GRID ARRAY package with 1932 terminals. It is a TELECOM CIRCUIT IC for telecom applications, featuring PLASTIC/EPOXY material and BOTTOM terminal position. Suitable for surface mount assembly, it offers high functionality in a compact SQUARE package shape.

S-PBGA-B1932

1

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TELECOM CIRCUIT

BALL

BOTTOM

PM5981B-FEI by Microchip Technology

PM5981B-FEI

Microchip Technology

PM5981B-FEI by Microchip Technology is a GRID ARRAY package with 1932 terminals in PLASTIC/EPOXY material. It is a TELECOM CIRCUIT IC designed for telecom interfaces, featuring surface mount capability and ball-shaped bottom terminals.

S-PBGA-B1932

1

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TELECOM CIRCUIT

BALL

BOTTOM

PM5990B-FEI by Microchip Technology

PM5990B-FEI

Microchip Technology

PM5990B-FEI by Microchip Technology is a GRID ARRAY IC with 1932 terminals in PLASTIC/EPOXY package. It's a TELECOM CIRCUIT for telecom applications, designed for surface mount with BALL terminals at the bottom.

S-PBGA-B1932

1

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TELECOM CIRCUIT

BALL

BOTTOM

PM5991B-FEI by Microchip Technology

PM5991B-FEI

Microchip Technology

TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 1932; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

S-PBGA-B1932

1

1932

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TELECOM CIRCUIT

BALL

BOTTOM

WP3160W6NFEI-320B1 by Microchip Technology

WP3160W6NFEI-320B1

Microchip Technology

WP3160W6NFEI-320B1 by Microchip Technology is a GRID ARRAY IC with 672 terminals in PLASTIC/EPOXY package. It's a TELECOM CIRCUIT for telecom applications, designed for surface mount with BALL terminals at the bottom.

S-PBGA-B672

1

672

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TELECOM CIRCUIT

BALL

BOTTOM

WP3161F5NFEI-320B1 by Microchip Technology

WP3161F5NFEI-320B1

Microchip Technology

WP3161F5NFEI-320B1 by Microchip Technology is a telecom IC with 672 terminals in a grid array package. It features plastic/epoxy body material, surface mount capability, and ball-shaped bottom terminals. Ideal for telecom circuit applications due to its square package shape.

S-PBGA-B672

1

672

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TELECOM CIRCUIT

BALL

BOTTOM

WP3161W6NFEI-320B1 by Microchip Technology

WP3161W6NFEI-320B1

Microchip Technology

WP3161W6NFEI-320B1 by Microchip Technology is a telecom IC with 672 terminals in a grid array package. It features plastic/epoxy body material, surface mount capability, and ball-shaped bottom terminals. Ideal for telecom circuit applications due to its advanced interface functionalities.

S-PBGA-B672

1

672

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TELECOM CIRCUIT

BALL

BOTTOM

WP3161D4NFEI-400B1 by Microchip Technology

WP3161D4NFEI-400B1

Microchip Technology

WP3161D4NFEI-400B1 by Microchip Technology is a telecom IC with 672 terminals in a grid array package. It features plastic/epoxy body material, surface mount capability, and ball-shaped bottom terminals. Ideal for telecom circuit applications due to its advanced interface functionalities.

S-PBGA-B672

1

672

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

YES

TELECOM CIRCUIT

BALL

BOTTOM

AD9988BBPZRL-4D4AC by Analog Devices

AD9988BBPZRL-4D4AC

Analog Devices

TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B324

15 mm

1

324

120 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

1.72 mm

1 V

YES

TELECOM CIRCUIT

BALL

.8 mm

BOTTOM

15 mm

ADRV9004BBCZ-RL by Analog Devices

ADRV9004BBCZ-RL

Analog Devices

Analog Devices ADRV9004BBCZ-RL is a telecom IC with 2 functions, operating b/w -40 to 85°C. It has 196 terminals in a square grid array package style, suitable for telecom circuit applications. With a nominal voltage of 1V and terminal pitch of 0.8mm, it offers high performance in a compact form factor.

S-PBGA-B196

12 mm

3

2

196

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

1.25 mm

1 V

YES

TELECOM CIRCUIT

BALL

.8 mm

BOTTOM

30

12 mm

ADRV9004BBCZ by Analog Devices

ADRV9004BBCZ

Analog Devices

Analog Devices ADRV9004BBCZ is a telecom IC with 2 functions, operating b/w -40 to 85°C. It features a grid array package with 196 terminals and 0.8mm pitch, suitable for telecom interface applications. The PLASTIC/EPOXY body material and bottom terminal position make it ideal for surface mount assembly.

S-PBGA-B196

12 mm

3

2

196

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

1.25 mm

1 V

YES

TELECOM CIRCUIT

BALL

.8 mm

BOTTOM

30

12 mm

AFE7903IABJ by Texas Instruments

AFE7903IABJ

Texas Instruments

AFE7903IABJ by Texas Instruments is a telecom IC with 400 terminals in a square grid array package. It operates b/w -40 to 85°C, has a data rate of 29500 Mbps, and requires a nominal voltage of 0.925 V. Ideal for telecom applications requiring high-speed data transmission.

ALSO VNOM IS 1.2V & 1.8V; RF Frequency Max is 7400 MHz; RF Frequency Min is 5 MHz

29500 Mbps

S-PBGA-B400

e1

17 mm

3

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA400,20X20,32

SQUARE

GRID ARRAY

260

2.65 mm

.925 V

YES

TELECOM CIRCUIT

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

17 mm

AFE7903IALK by Texas Instruments

AFE7903IALK

Texas Instruments

AFE7903IALK by Texas Instruments is a telecom interface IC with 400 terminals in a square grid array package. It operates b/w -40 to 85°C, with a data rate of 29500 Mbps. Ideal for telecom circuits, it has a nominal voltage of 0.925V and terminal pitch of 0.8mm.

ALSO VNOM IS 1.2V & 1.8V; RF Frequency Max is 7400 MHz; RF Frequency Min is 5 MHz

29500 Mbps

S-PBGA-B400

e0

17 mm

3

1

400

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA400,20X20,32

SQUARE

GRID ARRAY

220

2.65 mm

.925 V

YES

TELECOM CIRCUIT

TIN LEAD

BALL

.8 mm

BOTTOM

17 mm