Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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CC110LRTKR
Texas Instruments
CC110LRTKR by Texas Instruments is a cellphone IC with 20 terminals in a square package. It operates b/w -40 to 85°C, with power supplies of 1.8/3.6V and terminal finish of NiPdAu. Ideal for RF and baseband circuits, it has a compact size of 4x4mm and is suitable for industrial temperature grades.
S-PQCC-N20
e4
4 mm
3
1
20
85 Cel
-40 Cel
PLASTIC/EPOXY
HVQCCN
LCC20,.16SQ,20
SQUARE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
260
1.8/3.6
Not Qualified
.9 mm
Other Telecom ICs
3 V
YES
RF AND BASEBAND CIRCUIT
INDUSTRIAL
NICKEL PALLADIUM GOLD
NO LEAD
.5 mm
QUAD
30
CC110LRTKT
CC110LRTKT by Texas Instruments is a cellphone IC with 20 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features RF and baseband circuits, operates at 3V supply voltage, and has moisture sensitivity level of MSL3.
CC113LRTKR
The Texas Instruments CC113LRTKR is a cellphone IC with 20 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.
CC113LRTKT
The Texas Instruments CC113LRTKT is a cellphone IC with 20 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.
CC115LRTKR
CC115LRTKR by Texas Instruments is a cellphone IC with a square package and 20 terminals. It operates at temperatures ranging from -40 to 85 °C and has a nominal voltage of 3.6 V. This RF and baseband circuit is suitable for industrial applications.
3.6 V
CC115LRTKT
CC115LRTKT by Texas Instruments is a cellphone IC with a package style of chip carrier, suitable for RF and baseband circuits. It operates in industrial temperature range (-40 to 85°C) with a nominal voltage of 3.6V. This surface-mount device has 20 terminals, nickel palladium gold finish, and compact dimensions (4x4mm).
ADL5363ACPZ-R7
Analog Devices
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
S-XQCC-N20
e3
5 mm
UNSPECIFIED
5 V
BICMOS
MATTE TIN
.65 mm
CC110LRGPT
The Texas Instruments CC110LRGPT is a cellphone IC with 20 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features RF and baseband circuits, operates at 3V, with data rate of 0.6 Mbps for wireless communication applications.
.6 Mbps
1 mm
NICKEL PALLADIUM GOLD SILVER
CC113LRGPT
The Texas Instruments CC113LRGPT is a cellphone IC with 20 terminals in a square chip carrier package. Operating at temperatures from -40 to 85°C, it supports RF and baseband circuits with a data rate of 0.6 Mbps. Ideal for industrial applications, this IC has a nominal voltage of 3V and terminal pitch of 0.5mm.
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
NOT SPECIFIED
NRF24L01-REEL7
Nordic Semiconductor Asa
NRF24L01-REEL7 by Nordic Semiconductor Asa is a cellphone IC with 20 terminals, operating from -40 to 85°C. It features a square package shape, matte tin finish, and RF/baseband circuit type. Ideal for industrial applications due to its low profile and no lead terminal form.
2
.95 mm
NRF24L01-REEL
NRF24L01-REEL by Nordic Semiconductor Asa is a cellphone IC with 20 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for wireless communication applications.
NRF24L01
NRF24L01 by Nordic Semiconductor Asa is a cellphone IC with 20 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With RF and baseband circuitry, it has a nominal voltage of 3V, making it ideal for wireless communication applications.
CC1070RGWR
The Texas Instruments CC1070RGWR is a cellphone IC with 20 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 105°C and has a supply voltage of 3V. This RF and baseband circuit uses CMOS technology, making it suitable for industrial telecom applications.
105 Cel
QCCN
LCC20,.20SQ,25
CHIP CARRIER
2.5/3.3
CMOS
.635 mm
CC1070RGWT
CC1070RGWT by Texas Instruments is a cellphone IC with 20 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 105°C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 3V and terminal pitch of 0.635mm, making it ideal for telecom applications.
CC1100RTKG3
Matte Tin (Sn)
CC1100RTKRG3
CC1100RTKRG3 by Texas Instruments is a cellphone IC with 20 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 1.8/3.6V, RF and baseband circuit technology, and a compact square package suitable for telecom applications.
AD607ARS-REEL
AD607ARS-REEL by Analog Devices is a Cellphone IC with 20 terminals in a small outline package. It operates b/w -25°C to 85°C, with a nominal voltage of 3V. Ideal for baseband circuits, this IC has Gull Wing terminals and is surface mountable.
R-PDSO-G20
e0
7.2 mm
-25 Cel
SSOP
RECTANGULAR
SMALL OUTLINE, SHRINK PITCH
240
2 mm
BASEBAND CIRCUIT
OTHER
TIN LEAD
GULL WING
DUAL
5.3 mm
MAX2041ETP-T
Maxim Integrated
5
.8 mm
.145 mA
MAX2041ETP
MAX2039ETP-T
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: VQCCN; Package Shape: SQUARE;
VQCCN
CHIP CARRIER, VERY THIN PROFILE
.135 mA
CC1101RTKR
CC1101RTKR by Texas Instruments is a cellphone IC with power supplies of 1.8/3.6V, operating temperature range of -40 to 85°C, and RF & baseband circuit type. Its package style is chip carrier with very thin profile, suitable for industrial telecom applications due to its nickel palladium gold terminal finish and moisture sensitivity level of 3 MSL.
CC1101RTK
CC1101RTK by Texas Instruments is a cellphone IC with 20 terminals, operating at -40 to 85°C. It features a supply voltage of 3V, RF and baseband circuitry, and a package style of chip carrier. Ideal for industrial applications requiring RF communication in compact form factors.
MAX2029ETP-T
BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
MAX2029ETP
245
SI4710-B30-GMR
Silicon Labs
SI4710-B30-GMR by Silicon Labs is a cellphone IC with 20 terminals in a square chip carrier package. Operating temp range -20 to 85°C, CMOS tech, and 3.3V supply voltage make it ideal for RF and baseband circuits in telecom applications.
3 mm
-20 Cel
.6 mm
3.3 V
SI4710-B30-GM
SI4710-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20 to 85°C, ideal for RF and baseband circuits. With CMOS technology and 3.3V supply voltage, it's perfect for compact telecom applications.
SI4711-B30-GMR
SI4711-B30-GMR by Silicon Labs is a cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuitry, CMOS technology, and a nominal voltage of 3.3V. Ideal for telecom applications due to its compact size and surface-mount capability.
SI4711-B30-GM
SI4711-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square chip carrier package. Operating temperature ranges from -20 to 85°C. It features RF and baseband circuit technology, suitable for cellphone applications.
SI4712-B30-GMR
SI4712-B30-GMR by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20°C to 85°C, utilizing CMOS technology and requiring 3.3V supply voltage. This RF and baseband circuit is ideal for compact mobile devices due to its very thin profile and small dimensions of 3mm x 3mm.
SI4713-B30-GMR
SI4713-B30-GMR by Silicon Labs is a Cellphone IC with 20 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it features RF and baseband circuits for telecom applications. With a nominal voltage of 3.3V, this CMOS technology IC has a compact size of 3x3mm and terminal pitch of 0.5mm.
SI4713-B30-GM
SI4713-B30-GM by Silicon Labs is a Cellphone IC with 20 terminals in a square package. It operates b/w -20°C to 85°C, suitable for RF and baseband circuits. With a compact size of 3x3mm and CMOS technology, it's ideal for mobile phone applications.
SA601DK,112
NXP Semiconductors
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;
6.5 mm
LSSOP
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
1.5 mm
Nickel/Palladium/Gold (Ni/Pd/Au)
4.4 mm
SA601DK,118
SA620DK,112
SA620DK,118
MAX9982ETP
MAX9989ETP
MAX1958ETP
MAX1959ETP
MAX9989ETP-T
CC1101RTKG3
CC1101RTKG3 by Texas Instruments is a cellphone IC with 20 terminals, operating at 1.8-3.6V. It features a square shape, nickel palladium gold finish, and industrial temperature grade suitable for RF and baseband circuits. This chip carrier has a very thin profile, measures 4x4mm in size, and can withstand peak reflow temperatures up to 260°C in surface mount applications.
CC1101RTKRG3
CC1101RTKRG3 by Texas Instruments is a cellphone IC with 20 terminals in a square chip carrier package. It operates at temperatures from -40 to 85°C, with a supply voltage of 1.8/3.6V. This RF and baseband circuit is ideal for industrial telecom applications due to its compact size and surface-mount capability.
AD607ARSZ
AD607ARSZ by Analog Devices is a cellphone IC with 20 terminals in a small outline package. Operating temp range -25 to 85°C, nominal voltage of 3V, and peak reflow temp of 260°C. Ideal for telecom applications as a baseband circuit due to its compact size and gull wing terminal form.
AD607ARSZ-REEL
AD607ARSZ-REEL by Analog Devices is a BASEBAND CIRCUIT for cellphones. It operates b/w -25 to 85°C with a supply voltage of 3V. This SMALL OUTLINE IC has 20 terminals, matte tin finish, and measures 7.2mm x 5.3mm in size for telecom applications.
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