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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC6SLX75T-3FGG484C by Xilinx

XC6SLX75T-3FGG484C

Xilinx

Xilinx XC6SLX75T-3FGG484C FPGA features 74637 logic cells, 5831 CLBs, and 268 inputs/outputs. Utilized in applications requiring high clock frequencies up to 862 MHz, with a max operating temperature of 85°C. Ideal for designs needing programmable ICs with low combinatorial delay and compact form factor.

FPGA

74637

268

268

5831

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX75T-3FGG484I by Xilinx

XC6SLX75T-3FGG484I

Xilinx

Xilinx XC6SLX75T-3FGG484I FPGA features 74637 logic cells, 5831 CLBs, and 268 inputs/outputs. Utilized in industrial applications, it operates at a max clock frequency of 862 MHz with a combinatorial delay of 0.21 ns per CLB. The package style is grid array with a moisture sensitivity level of 3.

FPGA

74637

268

268

5831

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6SLX75T-3FGG676C by Xilinx

XC6SLX75T-3FGG676C

Xilinx

The Xilinx XC6SLX75T-3FGG676C is a FPGA with 74637 logic cells, 5831 CLBs, and 320 inputs/outputs. It operates at a max frequency of 862 MHz and supports supply voltages of 1.2V, 2.5V, and 3.3V. Ideal for applications requiring high-speed processing such as telecommunications equipment or industrial automation systems.

FPGA

74637

320

320

5831

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC6SLX75T-3FGG676I by Xilinx

XC6SLX75T-3FGG676I

Xilinx

Xilinx XC6SLX75T-3FGG676I FPGA features 74637 logic cells, 5831 CLBs, and 348 inputs/outputs. It operates at a max frequency of 862 MHz and is ideal for industrial applications requiring high-speed processing in a compact form factor. With a wide temperature range from -40 to 100°C, it offers versatile performance for various electronic designs.

FPGA

74637

348

348

5831

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC6SLX75T-4CSG484C by Xilinx

XC6SLX75T-4CSG484C

Xilinx

Xilinx XC6SLX75T-4CSG484C is a CMOS FPGA with 74637 logic cells, 292 inputs/outputs, and operates at temperatures from 0 to 85°C. It features a grid array package style with 0.8mm terminal pitch, suitable for various applications requiring high-performance programmable ICs.

FPGA

74637

292

292

CMOS

Field Programmable Gate Arrays

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75T-4FGG484C by Xilinx

XC6SLX75T-4FGG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

74637

268

268

CMOS

Field Programmable Gate Arrays

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

484

S-PBGA-B484

e1

No

XC6SLX75T-4FGG676C by Xilinx

XC6SLX75T-4FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

74637

348

348

CMOS

Field Programmable Gate Arrays

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC6SLX9-2CPG196C by Xilinx

XC6SLX9-2CPG196C

Xilinx

XC6SLX9-2CPG196C by Xilinx is a CMOS-based FPGA with 9152 logic cells and 715 CLBs. It operates at a max clock frequency of 667 MHz and is commonly used in applications requiring high-performance programmable ICs.

FPGA

9152

100

100

715

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX9-2CPG196I by Xilinx

XC6SLX9-2CPG196I

Xilinx

Xilinx XC6SLX9-2CPG196I is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 667 MHz. It operates at -40 to 100 °C, suitable for industrial applications requiring high-speed processing and programmable ICs in compact form factors.

FPGA

9152

100

100

715

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX9-2CSG225C by Xilinx

XC6SLX9-2CSG225C

Xilinx

Xilinx XC6SLX9-2CSG225C is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 667 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.

FPGA

9152

160

160

715

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX9-2CSG225I by Xilinx

XC6SLX9-2CSG225I

Xilinx

Xilinx XC6SLX9-2CSG225I FPGA features 9152 logic cells, 715 CLBs, and 160 inputs/outputs. With a max clock frequency of 667 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. The device operates b/w -40 to 100°C and supports supply voltages of 1.14V to 1.26V.

FPGA

9152

160

160

715

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX9-2CSG324C by Xilinx

XC6SLX9-2CSG324C

Xilinx

Xilinx XC6SLX9-2CSG324C FPGA features 9152 logic cells, 715 CLBs, and a max clock frequency of 667 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

9152

200

200

715

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX9-2CSG324I by Xilinx

XC6SLX9-2CSG324I

Xilinx

Xilinx XC6SLX9-2CSG324I FPGA features 9152 logic cells, 715 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design. Operating temperature range from -40 to 100°C makes it suitable for various environments.

FPGA

9152

200

200

715

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX9-2FT256C by Xilinx

XC6SLX9-2FT256C

Xilinx

Xilinx XC6SLX9-2FT256C is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 667 MHz. It operates at 1.2V nominal voltage and is used in applications requiring high-speed processing like telecommunications and industrial automation.

FPGA

9152

186

186

715

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC6SLX9-2FT256I by Xilinx

XC6SLX9-2FT256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

9152

186

186

715

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC6SLX9-2FTG256C by Xilinx

XC6SLX9-2FTG256C

Xilinx

XC6SLX9-2FTG256C by Xilinx is a CMOS-based FPGA with 9152 logic cells and 715 CLBs. It operates at a max clock frequency of 667 MHz and is commonly used in applications requiring programmable ICs for high-speed data processing.

FPGA

9152

186

186

715

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC6SLX9-2FTG256I by Xilinx

XC6SLX9-2FTG256I

Xilinx

Xilinx XC6SLX9-2FTG256I FPGA features 9152 logic cells, 715 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

FPGA

9152

186

186

715

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC6SLX9-3CPG196C by Xilinx

XC6SLX9-3CPG196C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

9152

100

100

715

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX9-3CPG196I by Xilinx

XC6SLX9-3CPG196I

Xilinx

The Xilinx XC6SLX9-3CPG196I is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 862 MHz. It operates at temperatures from -40 to 100 °C and is ideal for industrial applications requiring high-speed processing in compact designs.

FPGA

9152

106

106

715

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX9-3CSG225C by Xilinx

XC6SLX9-3CSG225C

Xilinx

Xilinx XC6SLX9-3CSG225C is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 862 MHz. It operates at 1.2V nominal voltage and is used in applications requiring high-speed processing like telecommunications and signal processing.

FPGA

9152

160

160

715

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX9-3CSG225I by Xilinx

XC6SLX9-3CSG225I

Xilinx

XC6SLX9-3CSG225I by Xilinx is a FPGA with 9152 logic cells, 715 CLBs, and 160 inputs/outputs. Operating at max frequency of 862 MHz, it's ideal for industrial applications requiring high-speed processing in a temperature range from -40 to 100°C. The package style is grid array with low profile and fine pitch terminals.

FPGA

9152

160

160

715

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX9-3CSG324C by Xilinx

XC6SLX9-3CSG324C

Xilinx

The Xilinx XC6SLX9-3CSG324C is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 862 MHz. It operates at 1.2V nominal voltage and is used in applications requiring high-speed processing like telecommunications and industrial automation.

FPGA

9152

200

200

715

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX9-3CSG324I by Xilinx

XC6SLX9-3CSG324I

Xilinx

The Xilinx XC6SLX9-3CSG324I is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 862 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor. Operates b/w -40 to 100°C with low combinatorial delay and fine pitch grid array package style.

FPGA

9152

200

200

715

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX9-3FT256I by Xilinx

XC6SLX9-3FT256I

Xilinx

The Xilinx XC6SLX9-3FT256I is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 862 MHz. It operates at industrial temperatures from -40 to 100°C, suitable for high-performance applications in various industries like telecommunications and automotive.

FPGA

9152

186

186

715

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC6SLX9-3FTG256C by Xilinx

XC6SLX9-3FTG256C

Xilinx

The Xilinx XC6SLX9-3FTG256C is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 862 MHz. It operates at 1.2V nominal voltage and is ideal for applications requiring high-speed processing in compact form factors.

FPGA

9152

186

186

715

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC6SLX9-3FTG256I by Xilinx

XC6SLX9-3FTG256I

Xilinx

Xilinx XC6SLX9-3FTG256I FPGA features 9152 logic cells, 715 CLBs, and max clock frequency of 862 MHz. Ideal for industrial applications requiring high-speed processing, it operates at temperatures ranging from -40 to 100°C with a low profile grid array package style.

FPGA

9152

186

186

715

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC6SLX9-L1CPG196I by Xilinx

XC6SLX9-L1CPG196I

Xilinx

The Xilinx XC6SLX9-L1CPG196I is a FPGA with 9152 logic cells, 715 CLBs, and 100 inputs/outputs. It operates at a voltage range of 0.95V to 1.05V and has a max combinatorial delay of 0.46ns per CLB. Ideal for industrial applications requiring high-speed processing in compact designs.

FPGA

9152

100

100

715

0.46 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA196,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

196

S-PBGA-B196

e8

No

XC6SLX9-L1CSG225C by Xilinx

XC6SLX9-L1CSG225C

Xilinx

The Xilinx XC6SLX9-L1CSG225C is a FPGA with 9152 logic cells, 715 CLBs, and 160 inputs/outputs. It operates at voltages of 1.05V and supports CMOS technology. Ideal for applications requiring high-speed processing in compact designs with low power consumption.

FPGA

9152

160

160

715

0.46 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX9-L1CSG225I by Xilinx

XC6SLX9-L1CSG225I

Xilinx

Xilinx XC6SLX9-L1CSG225I is a FPGA with 9152 logic cells, 715 CLBs, and 160 inputs/outputs. Operating at max voltage of 1.05V, it's ideal for industrial applications requiring high combinatorial delay performance in a compact package. With a grid array style and low profile design, it offers versatility in various electronic systems.

FPGA

9152

160

160

715

0.46 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

13 mm

13 mm

1.4 mm

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

XC6SLX9-L1CSG324I by Xilinx

XC6SLX9-L1CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

9152

200

200

715

0.46 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

15 mm

15 mm

1.5 mm

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

XC6SLX9-L1FT256I by Xilinx

XC6SLX9-L1FT256I

Xilinx

XC6SLX9-L1FT256I by Xilinx is a FPGA with 9152 logic cells, 715 CLBs, and 186 inputs/outputs. Operating at 1.05V, it offers 0.46ns combinatorial delay per CLB. Ideal for industrial applications requiring high-speed processing in compact designs.

FPGA

9152

186

186

715

0.46 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC6SLX9-L1FTG256C by Xilinx

XC6SLX9-L1FTG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

9152

186

186

715

0.46 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC6SLX9-L1FTG256I by Xilinx

XC6SLX9-L1FTG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

9152

186

186

715

0.46 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XA3S1200E-4FGG400Q by Xilinx

XA3S1200E-4FGG400Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

19512

304

232

2168

1200000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

AEC-Q100

XA3S1200E-4FTG256Q by Xilinx

XA3S1200E-4FTG256Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

19512

190

150

2168

1200000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

XA3S1600E-4FGG400I by Xilinx

XA3S1600E-4FGG400I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

33192

304

232

3688

1600000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

AEC-Q100

XA3S1600E-4FGG400Q by Xilinx

XA3S1600E-4FGG400Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

FPGA

33192

304

232

3688

1600000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

21 mm

21 mm

2.43 mm

BGA400,20X20,40

Bottom

Ball

Tin Silver Copper

1 mm

400

S-PBGA-B400

e1

No

AEC-Q100

XA3S1600E-4FGG484Q by Xilinx

XA3S1600E-4FGG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

FPGA

33192

376

294

3688

1600000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

3688 CLBS, 1600000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA3S250E-4CPG132Q by Xilinx

XA3S250E-4CPG132Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;

FPGA

5508

92

85

612

250000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Thin Profile, Fine Pitch

TFBGA

Square

8 mm

8 mm

1.1 mm

BGA132,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

132

S-PBGA-B132

e1

No

AEC-Q100

XA3S250E-4FTG256Q by Xilinx

XA3S250E-4FTG256Q

Xilinx

XA3S250E-4FTG256Q by Xilinx is a FPGA with 5508 logic cells, 612 CLBs, and 250000 gates. It operates at max frequency of 572 MHz, suitable for automotive applications due to AEC-Q100 screening level. The package style is grid array with low profile, making it ideal for compact designs in harsh environments.

FPGA

5508

172

132

612

250000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

XA3S500E-4FTG256I by Xilinx

XA3S500E-4FTG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10476

190

149

1164

500000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

1164 CLBS, 500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

XC6VCX130T-1FFG1156I by Xilinx

XC6VCX130T-1FFG1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

128000

600

600

10000

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC6VCX130T-1FFG484C by Xilinx

XC6VCX130T-1FFG484C

Xilinx

The Xilinx XC6VCX130T-1FFG484C is a FPGA with 128,000 logic cells and 10,000 CLBs. Operating at a max frequency of 1098 MHz, it's ideal for high-performance applications requiring advanced programmable ICs in a compact grid array package. With low combinatorial delay and multiple power supply options, this CMOS technology device offers versatile solutions for various electronic designs.

FPGA

128000

240

240

10000

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6VCX130T-1FFG484I by Xilinx

XC6VCX130T-1FFG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1,1.2/2.5,2.5;

FPGA

128000

240

240

10000

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

3 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

XC6VCX130T-1FFG784C by Xilinx

XC6VCX130T-1FFG784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

400

400

10000

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VCX130T-1FFG784I by Xilinx

XC6VCX130T-1FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Length: 29 mm;

FPGA

128000

400

400

10000

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VCX130T-2FFG1156C by Xilinx

XC6VCX130T-2FFG1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

600

600

10000

1098 MHz

0.91 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC6VCX195T-1FFG1156C by Xilinx

XC6VCX195T-1FFG1156C

Xilinx

XC6VCX195T-1FFG1156C by Xilinx is a CMOS-based FPGA with 199,680 logic cells and 15,600 CLBs. It operates at a max clock frequency of 1098 MHz and has a package style of grid array. This FPGA is commonly used in applications requiring high-speed processing and programmable logic capabilities.

FPGA

199680

600

600

15600

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No