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XC6SLX75T-3FGG484I

Xilinx

XC6SLX75T-3FGG484I by Xilinx

Xilinx XC6SLX75T-3FGG484I FPGA features 74637 logic cells, 5831 CLBs, and 268 inputs/outputs. Utilized in industrial applications, it operates at a max clock frequency of 862 MHz with a combinatorial delay of 0.21 ns per CLB. The package style is grid array with a moisture sensitivity level of 3.

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Overview

Unlock the potential of your projects with the Xilinx XC6SLX75T-3FGG484I Field Programmable Gate Array. Manufactured by industry leader Xilinx, this FPGA boasts 74637 logic cells and 5831 CLBs for unparalleled performance. With a maximum clock frequency of 862 MHz and a wide range of power supplies, this FPGA is versatile and efficient. Whether you're designing cutting-edge electronics or optimizing data processing, the XC6SLX75T-3FGG484I offers value, reliability, and innovation for all your applications. Elevate your projects to new heights with Xilinx's top-of-the-line technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FPGA lightweight and durable, perfect for portable and long-lasting applications.

No. of Logic Cells: 74637

With a high number of logic cells, this FPGA provides ample resources for complex designs and advanced functionality.

Surface Mount: YES

Being surface mountable allows for easy and secure installation on PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage of 1.26 V helps in reducing power consumption and heat generation, making it energy-efficient.

No. of CLBs: 5831

The large number of configurable logic blocks (CLBs) enables flexibility in design and implementation of various logic functions.

Technology Used: CMOS

The use of CMOS technology ensures low power consumption, high noise immunity, and improved performance for the FPGA.

No. of Inputs: 268

With a sufficient number of inputs, this FPGA can handle a wide range of signals and data inputs for versatile applications.

Package Shape: SQUARE

The square shape of the package provides easy mounting and alignment on PCBs, ensuring a compact and efficient design layout.

Form Of Terminal: BALL

The ball terminals offer secure connections and reliable contact with the PCB, ensuring good signal integrity and robustness.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2 V is optimal for the performance and stability of the FPGA in various operating conditions.

Power Supplies (V): 1.2,2.5/3.3

The availability of multiple power supply options allows for compatibility with different voltage requirements in a system.

No. of Terminals: 484

The high number of terminals provides ample connection options and compatibility with various PCB layouts and designs.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As an FPGA, this product offers flexibility and programmability for custom logic functions and adaptable designs.

Package Style (Meter): GRID ARRAY

The grid array package style ensures easy integration and alignment on the PCB, facilitating efficient routing and signal flow.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage of 1.14 V ensures reliable operation and flexibility in various power supply conditions.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature of 100°C, this FPGA is suitable for rugged and industrial environments.

Pitch Of Terminal: 1 mm

The terminal pitch of 1 mm allows for fine-pitch connections and compact PCB layouts, saving space and enabling high-density designs.

Maximum Combinatorial Delay of a CLB: 0.21 ns

The low combinatorial delay of 0.21 ns in each CLB ensures fast signal processing and high-speed operation for time-critical applications.

Organization: 5831 CLBS

The organized structure of 5831 CLBs provides a systematic layout for logic functions and design implementation, enabling efficient development and testing.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance in harsh environmental conditions and temperature extremes.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin-silver-copper finishing on the terminals improves conductivity, corrosion resistance, and durability for long-lasting connections.

Position Of Terminal: BOTTOM

The bottom terminal positioning allows for easy mounting and secure connections to the PCB, facilitating efficient signal routing and layout.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this FPGA is suitable for standard moisture exposure levels during assembly and operation, ensuring reliability and performance.

Maximum Seated Height: 2.6 mm

The low maximum seated height of 2.6 mm allows for slim and compact PCB designs, ideal for space-constrained applications.

Width: 23 mm

The width of 23 mm provides a compact form factor for the FPGA, enabling easy integration into various system designs and layouts.

Maximum Clock Frequency: 862 MHz

With a high maximum clock frequency of 862 MHz, this FPGA can handle high-speed operations and data processing for demanding applications.

No. of Outputs: 268

The ample number of outputs offers flexibility in routing signals and data output options for diverse applications and complex designs.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum reflow time of 30 seconds at peak temperature ensures proper soldering and reliability during assembly, leading to robust PCB connections.

Peak Reflow Temperature °C: 250

The high peak reflow temperature of 250°C allows for efficient soldering and thermal bonding during assembly, ensuring durable and secure connections.

Length: 23 mm

The length of 23 mm provides a compact and standardized size for the FPGA, ideal for compatibility with various PCB layouts and designs.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation and performance in harsh industrial environments and extended temperature ranges.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX75T-3FGG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

74637

No. of Inputs:

268

No. of Outputs:

268

No. of CLBs:

5831

Maximum Clock Frequency:

862 MHz

CLB Maximum Delay:

0.21 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

5831 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX75T-3FGG484I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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