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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC2V2000-5BG575I by Xilinx

XC2V2000-5BG575I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 575; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.575 V;

FPGA

24192

408

408

2688

2000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

2.6 mm

BGA575,24X24,50

Bottom

Ball

Tin Lead

1.27 mm

575

S-PBGA-B575

e0

No

XC2V2000-5FF896I by Xilinx

XC2V2000-5FF896I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS;

FPGA

24192

624

624

2688

2000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

896

S-PBGA-B896

e0

No

XC2V2000-5FG676I by Xilinx

XC2V2000-5FG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

24192

456

456

2688

2000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XC2V250-4FG256I by Xilinx

XC2V250-4FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;

FPGA

3456

172

172

384

250000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 250000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2V250-4FG456I by Xilinx

XC2V250-4FG456I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

3456

200

200

384

250000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 250000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

456

S-PBGA-B456

e0

No

XC2V250-5FG256I by Xilinx

XC2V250-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: .39 ns;

FPGA

3456

172

172

384

250000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 250000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2V250-5FG456I by Xilinx

XC2V250-5FG456I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

3456

200

200

384

250000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 250000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

456

S-PBGA-B456

e0

No

XC2V250-6FG256C by Xilinx

XC2V250-6FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

3456

172

172

384

250000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 250000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2V3000-4BF957C by Xilinx

XC2V3000-4BF957C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 957; Package Code: BGA; Package Shape: SQUARE;

FPGA

32256

684

684

3584

3000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.5 mm

BGA957,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

957

S-PBGA-B957

e0

No

XC2V3000-4BF957I by Xilinx

XC2V3000-4BF957I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 957; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 32256;

FPGA

32256

684

684

3584

3000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.5 mm

BGA957,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

957

S-PBGA-B957

e0

No

XC2V3000-4BG728I by Xilinx

XC2V3000-4BG728I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 728; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;

FPGA

32256

516

516

3584

3000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

2.6 mm

BGA728,27X27,50

Bottom

Ball

Tin Lead

1.27 mm

728

S-PBGA-B728

e0

No

XC2V3000-4FF1152I by Xilinx

XC2V3000-4FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Width: 35 mm;

FPGA

32256

720

720

3584

3000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2V3000-4FG676I by Xilinx

XC2V3000-4FG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA676,26X26,40;

FPGA

32256

484

484

3584

3000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XC2V3000-5BF957I by Xilinx

XC2V3000-5BF957I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 957; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

32256

684

684

3584

3000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.5 mm

BGA957,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

957

S-PBGA-B957

e0

No

XC2V3000-5BG728I by Xilinx

XC2V3000-5BG728I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 728; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 750 MHz;

FPGA

32256

516

516

3584

3000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

2.6 mm

BGA728,27X27,50

Bottom

Ball

Tin Lead

1.27 mm

728

S-PBGA-B728

e0

No

XC2V3000-5FF1152I by Xilinx

XC2V3000-5FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 32256;

FPGA

32256

720

720

3584

3000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2V3000-5FG676I by Xilinx

XC2V3000-5FG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

32256

484

484

3584

3000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XC2V40-4FG256I by Xilinx

XC2V40-4FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

576

88

88

64

40000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

64 CLBS, 40000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2V40-5FG256I by Xilinx

XC2V40-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 88;

FPGA

576

88

88

64

40000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

64 CLBS, 40000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2V4000-4BF957I by Xilinx

XC2V4000-4BF957I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 957; Package Code: BGA; Package Shape: SQUARE; No. of Equivalent Gates: 4000000;

FPGA

51840

684

684

5760

4000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

5760 CLBS, 4000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.5 mm

BGA957,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

957

S-PBGA-B957

e0

No

XC2V4000-4FF1152I by Xilinx

XC2V4000-4FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.575 V;

FPGA

51840

824

824

5760

4000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

5760 CLBS, 4000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2V4000-4FF1517I by Xilinx

XC2V4000-4FF1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 4;

FPGA

51840

912

912

5760

4000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

5760 CLBS, 4000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1517

S-PBGA-B1517

e0

No

XC2V4000-5BF957C by Xilinx

XC2V4000-5BF957C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 957; Package Code: BGA; Package Shape: SQUARE;

FPGA

51840

684

684

5760

4000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

5760 CLBS, 4000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.5 mm

BGA957,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

957

S-PBGA-B957

e0

No

XC2V4000-5BF957I by Xilinx

XC2V4000-5BF957I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 957; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;

FPGA

51840

684

684

5760

4000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

5760 CLBS, 4000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.5 mm

BGA957,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

957

S-PBGA-B957

e0

No

XC2V4000-5FF1152I by Xilinx

XC2V4000-5FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: Tin/Lead (Sn63Pb37);

FPGA

51840

824

824

5760

4000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

5760 CLBS, 4000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2V500-4FG256I by Xilinx

XC2V500-4FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Organization: 768 CLBS, 500000 GATES;

FPGA

6912

172

172

768

500000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

768 CLBS, 500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2V500-4FG456I by Xilinx

XC2V500-4FG456I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

6912

264

264

768

500000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

768 CLBS, 500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

456

S-PBGA-B456

e0

No

XC2V500-5FG256I by Xilinx

XC2V500-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.425 V;

FPGA

6912

172

172

768

500000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

768 CLBS, 500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2V500-5FG456I by Xilinx

XC2V500-5FG456I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE; Length: 23 mm;

FPGA

6912

264

264

768

500000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

768 CLBS, 500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

456

S-PBGA-B456

e0

No

XC2V6000-4BF957C by Xilinx

XC2V6000-4BF957C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 957; Package Code: BGA; Package Shape: SQUARE;

FPGA

76032

684

684

8448

6000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

8448 CLBS, 6000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.5 mm

BGA957,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

957

S-PBGA-B957

e0

No

XC2V6000-4FF1152I by Xilinx

XC2V6000-4FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 76032;

FPGA

76032

824

824

8448

6000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

8448 CLBS, 6000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2V6000-5BF957C by Xilinx

XC2V6000-5BF957C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 957; Package Code: BGA; Package Shape: SQUARE;

FPGA

76032

684

684

8448

6000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

8448 CLBS, 6000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.5 mm

BGA957,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

957

S-PBGA-B957

e0

No

XC2V6000-5BF957I by Xilinx

XC2V6000-5BF957I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 957; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

76032

684

684

8448

6000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

8448 CLBS, 6000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.5 mm

BGA957,31X31,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

957

S-PBGA-B957

e0

No

XC2V6000-5FF1152I by Xilinx

XC2V6000-5FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.575 V;

FPGA

76032

824

824

8448

6000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

8448 CLBS, 6000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2V80-4FG256I by Xilinx

XC2V80-4FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 120;

FPGA

1152

120

120

128

80000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

128 CLBS, 80000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2V80-5FG256I by Xilinx

XC2V80-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1.5,1.5/3.3,3.3;

FPGA

1152

120

120

128

80000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

128 CLBS, 80000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2V8000-4FF1152I by Xilinx

XC2V8000-4FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.4 mm;

FPGA

104832

824

824

11648

8000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

11648 CLBS, 8000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2V8000-4FF1517I by Xilinx

XC2V8000-4FF1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Width: 40 mm;

FPGA

104832

1108

1108

11648

8000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

11648 CLBS, 8000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1517

S-PBGA-B1517

e0

No

XC2V8000-5FF1152I by Xilinx

XC2V8000-5FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e0;

FPGA

104832

824

824

11648

8000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

11648 CLBS, 8000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2V8000-5FF1517I by Xilinx

XC2V8000-5FF1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Length: 40 mm;

FPGA

104832

1108

1108

11648

8000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

11648 CLBS, 8000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1517

S-PBGA-B1517

e0

No

XC2VP2-6FF672C by Xilinx

XC2VP2-6FF672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

3168

204

204

352

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

352 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

672

S-PBGA-B672

e0

No

XC2VP2-6FF672I by Xilinx

XC2VP2-6FF672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

3168

204

204

352

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

352 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

672

S-PBGA-B672

e0

No

XC2VP2-6FG256C by Xilinx

XC2VP2-6FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

3168

140

140

352

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

352 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2VP2-6FG256I by Xilinx

XC2VP2-6FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 225;

FPGA

3168

140

140

352

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

352 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2VP2-6FG456C by Xilinx

XC2VP2-6FG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

3168

156

156

352

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

352 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

456

S-PBGA-B456

e0

No

XC2VP2-6FG456I by Xilinx

XC2VP2-6FG456I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e0;

FPGA

3168

156

156

352

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

352 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

456

S-PBGA-B456

e0

No

XC2VP20-6FF1152C by Xilinx

XC2VP20-6FF1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

20880

564

564

2320

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP20-6FF1152I by Xilinx

XC2VP20-6FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.4 mm;

FPGA

20880

564

564

2320

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No