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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC2VP4-5FG456C by Xilinx

XC2VP4-5FG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

6768

248

248

752

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

752 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

456

S-PBGA-B456

e0

No

XC2VP4-5FG456I by Xilinx

XC2VP4-5FG456I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 248;

FPGA

6768

248

248

752

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

752 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

456

S-PBGA-B456

e0

No

XC2VP40-5FF1148C by Xilinx

XC2VP40-5FF1148C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1148; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

804

804

4848

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1148,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1148

S-PBGA-B1148

e0

No

XC2VP40-5FF1148I by Xilinx

XC2VP40-5FF1148I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1148; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 804;

FPGA

43632

804

804

4848

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1148,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1148

S-PBGA-B1148

e0

No

XC2VP40-5FF1152C by Xilinx

XC2VP40-5FF1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

692

644

4848

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP40-5FF1152I by Xilinx

XC2VP40-5FF1152I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

43632

692

644

4848

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP40-6FF1148C by Xilinx

XC2VP40-6FF1148C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1148; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

804

804

4848

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1148,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1148

S-PBGA-B1148

e0

No

XC2VP40-6FF1152C by Xilinx

XC2VP40-6FF1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

692

644

4848

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP40-6FF1152I by Xilinx

XC2VP40-6FF1152I

Xilinx

Xilinx XC2VP40-6FF1152I FPGA features 43632 logic cells, 4848 CLBs, and 692 inputs. With a max clock frequency of 1200 MHz, it's ideal for high-performance applications like signal processing and data acceleration. The package style is grid array with a square shape and ball terminals for easy mounting.

FPGA

43632

692

644

4848

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP40-7FF1152C by Xilinx

XC2VP40-7FF1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

692

644

4848

1350 MHz

0.28 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP50-5FF1148C by Xilinx

XC2VP50-5FF1148C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1148; Package Code: BGA; Package Shape: SQUARE;

FPGA

53136

812

812

5904

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

5904 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1148,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1148

S-PBGA-B1148

e0

No

XC2VP50-5FF1152C by Xilinx

XC2VP50-5FF1152C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE;

FPGA

53136

692

644

5904

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

5904 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP50-5FF1152I by Xilinx

XC2VP50-5FF1152I

Xilinx

Xilinx XC2VP50-5FF1152I FPGA features 53136 logic cells, 5904 CLBs, and a max clock frequency of 1050 MHz. Ideal for high-performance applications requiring fast processing speeds and extensive logic capabilities in a compact GRID ARRAY package with PLASTIC/EPOXY body material.

FPGA

53136

692

644

5904

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

5904 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.4 mm

BGA1152,34X34,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1152

S-PBGA-B1152

e0

No

XC2VP50-5FF1517C by Xilinx

XC2VP50-5FF1517C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

53136

852

852

5904

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

5904 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1517

S-PBGA-B1517

e0

No

XC2VP50-5FF1517I by Xilinx

XC2VP50-5FF1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.4 mm;

FPGA

53136

852

852

5904

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

5904 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1517

S-PBGA-B1517

e0

No

XC2VP7-5FF672C by Xilinx

XC2VP7-5FF672C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;

FPGA

11088

396

396

1232

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

1232 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

672

S-PBGA-B672

e0

No

XC2VP7-5FF672I by Xilinx

XC2VP7-5FF672I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 396;

FPGA

11088

396

396

1232

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

1232 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.65 mm

BGA672,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

672

S-PBGA-B672

e0

No

XC2VP7-5FF896C by Xilinx

XC2VP7-5FF896C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 896; Package Code: BGA; Package Shape: SQUARE;

FPGA

11088

396

396

1232

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

1232 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

31 mm

31 mm

3.4 mm

BGA896,30X30,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

896

S-PBGA-B896

e0

No

XC2VP7-5FG456C by Xilinx

XC2VP7-5FG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

11088

248

248

1232

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

1232 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

456

S-PBGA-B456

e0

No

XC2VP7-5FG456I by Xilinx

XC2VP7-5FG456I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA456,22X22,40;

FPGA

11088

248

248

1232

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

1232 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

456

S-PBGA-B456

e0

No

XC2VP70-5FF1517C by Xilinx

XC2VP70-5FF1517C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

74448

964

964

8272

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

8272 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1517

S-PBGA-B1517

e0

No

XC2VP70-5FF1517I by Xilinx

XC2VP70-5FF1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 1050 MHz;

FPGA

74448

964

964

8272

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

8272 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1517

S-PBGA-B1517

e0

No

XC2VP70-5FF1704C by Xilinx

XC2VP70-5FF1704C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1704; Package Code: BGA; Package Shape: SQUARE;

FPGA

74448

996

996

8272

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

8272 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.45 mm

BGA1704,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1704

S-PBGA-B1704

e0

No

XC2VP70-5FF1704I by Xilinx

XC2VP70-5FF1704I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1704; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 996;

FPGA

74448

996

996

8272

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

8272 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.45 mm

BGA1704,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1704

S-PBGA-B1704

e0

No

XC2VP70-6FF1517C by Xilinx

XC2VP70-6FF1517C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

74448

964

964

8272

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

8272 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1517

S-PBGA-B1517

e0

No

XC2VP70-6FF1517I by Xilinx

XC2VP70-6FF1517I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

74448

964

964

8272

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

8272 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1517

S-PBGA-B1517

e0

No

XC2VP70-6FF1704C by Xilinx

XC2VP70-6FF1704C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1704; Package Code: BGA; Package Shape: SQUARE;

FPGA

74448

996

996

8272

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

8272 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.45 mm

BGA1704,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1704

S-PBGA-B1704

e0

No

XC2VP70-6FF1704I by Xilinx

XC2VP70-6FF1704I

Xilinx

Xilinx XC2VP70-6FF1704I FPGA features 74448 logic cells, 8272 CLBs, and 996 inputs/outputs. Utilized in applications requiring high clock frequencies up to 1200 MHz, such as telecommunications and signal processing due to its advanced CMOS technology. Package style is a grid array with a square shape and ball terminals for surface mounting.

FPGA

74448

996

996

8272

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

8272 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.45 mm

BGA1704,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1704

S-PBGA-B1704

e0

No

XC2VP70-7FF1517C by Xilinx

XC2VP70-7FF1517C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

FPGA

74448

964

964

8272

1350 MHz

0.28 ns

CMOS

Field Programmable Gate Arrays

8272 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

40 mm

40 mm

3.4 mm

BGA1517,39X39,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1517

S-PBGA-B1517

e0

No

XC2VP70-7FF1704C by Xilinx

XC2VP70-7FF1704C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1704; Package Code: BGA; Package Shape: SQUARE;

FPGA

74448

996

996

8272

1350 MHz

0.28 ns

CMOS

Field Programmable Gate Arrays

8272 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.45 mm

BGA1704,42X42,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

1704

S-PBGA-B1704

e0

No

XC2S400E-6FT256C by Xilinx

XC2S400E-6FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

10800

410

410

2400

145000

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 145000 Gates

Maximum usable gates = 400000

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

OR4E02-1BA352C by Lattice Semiconductor

OR4E02-1BA352C

Lattice Semiconductor

OR4E02-1BA352C by Lattice Semiconductor is a FPGA with 4992 logic cells, 624 CLBs, and 201000 gates. It operates at a max frequency of 420 MHz and has 262 inputs/outputs. Ideal for applications requiring high-speed processing in commercial environments.

FPGA

4992

262

262

624

201000

420 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

624 CLBS, 201000 Gates

Maximum no of usable gates is 397000

1.5

1.425 V

1.575 V

1.5/3.3 V

0 °C (32 °F)

70 °C (158 °F)

Commercial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

2.54 mm

BGA352,26X26,50

Bottom

Ball

1.27 mm

352

S-PBGA-B352

No

XC3S1000-4FG456C by Xilinx

XC3S1000-4FG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

17280

333

333

1920

1000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Lead

1 mm

456

S-PBGA-B456

e0

No

XC3S1000-4FG456I by Xilinx

XC3S1000-4FG456I

Xilinx

XC3S1000-4FG456I by Xilinx is a FPGA with 17280 logic cells, 1920 CLBs, and 1000000 gates. It operates at max frequency of 630 MHz and has 333 inputs/outputs. Ideal for industrial applications requiring high-speed processing in compact designs.

FPGA

17280

333

333

1920

1000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Lead

1 mm

456

S-PBGA-B456

e0

No

XC3S1000-4FG676C by Xilinx

XC3S1000-4FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

17280

391

391

1920

1000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC3S1000-4FG676I by Xilinx

XC3S1000-4FG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.14 V;

FPGA

17280

391

391

1920

1000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC3S1000-4FT256C by Xilinx

XC3S1000-4FT256C

Xilinx

The Xilinx XC3S1000-4FT256C FPGA features 17280 logic cells, 1920 CLBs, and 1000000 equivalent gates. With a max clock frequency of 630 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

17280

173

173

1920

1000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S1000-4FT256I by Xilinx

XC3S1000-4FT256I

Xilinx

The Xilinx XC3S1000-4FT256I is a FPGA with 17280 logic cells, 1920 CLBs, and 1000000 equivalent gates. It operates at a max clock frequency of 630 MHz and has a combinatorial delay of 0.61 ns per CLB. Ideal for applications requiring high-speed processing and complex logic functions in compact designs.

FPGA

17280

173

173

1920

1000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S1000-5FG456C by Xilinx

XC3S1000-5FG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

17280

333

333

1920

1000000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Lead

1 mm

456

S-PBGA-B456

e0

No

XC3S1000-5FG676C by Xilinx

XC3S1000-5FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

17280

391

391

1920

1000000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC3S1000-5FT256C by Xilinx

XC3S1000-5FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

17280

173

173

1920

1000000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S1500-4FG456C by Xilinx

XC3S1500-4FG456C

Xilinx

Xilinx XC3S1500-4FG456C FPGA features 29952 logic cells, 3328 CLBs, and 1500000 gates. With a max clock frequency of 630 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

29952

333

333

3328

1500000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

3328 CLBS, 1500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Lead

1 mm

456

S-PBGA-B456

e0

No

XC3S1500-4FG456I by Xilinx

XC3S1500-4FG456I

Xilinx

Xilinx XC3S1500-4FG456I FPGA features 29952 logic cells, 3328 CLBs, and 1500000 equivalent gates. With a max clock frequency of 630 MHz, it is ideal for high-performance applications requiring fast processing speeds in fields like telecommunications and signal processing.

FPGA

29952

333

333

3328

1500000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

3328 CLBS, 1500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Lead

1 mm

456

S-PBGA-B456

e0

No

XC3S1500-4FG676C by Xilinx

XC3S1500-4FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

29952

487

487

3328

1500000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

3328 CLBS, 1500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC3S1500-4FG676I by Xilinx

XC3S1500-4FG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; No. of CLBs: 3328;

FPGA

29952

487

487

3328

1500000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

3328 CLBS, 1500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC3S1500-5FG456C by Xilinx

XC3S1500-5FG456C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;

FPGA

29952

333

333

3328

1500000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

3328 CLBS, 1500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA456,22X22,40

Bottom

Ball

Tin Lead

1 mm

456

S-PBGA-B456

e0

No

XC3S1500-5FG676C by Xilinx

XC3S1500-5FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

29952

487

487

3328

1500000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

3328 CLBS, 1500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC3S200-4FT256C by Xilinx

XC3S200-4FT256C

Xilinx

The Xilinx XC3S200-4FT256C FPGA features 4320 logic cells, 480 CLBs, and 200000 equivalent gates. With a max clock frequency of 630 MHz, it is ideal for applications requiring high-speed processing such as telecommunications and signal processing. The package style is grid array with low profile design for compact integration in electronic systems.

FPGA

4320

173

173

480

200000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

480 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No