Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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Xilinx XC3S1500-4FG456C FPGA features 29952 logic cells, 3328 CLBs, and 1500000 gates. With a max clock frequency of 630 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.
Median Price
$87.270
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VNN
$53.850
Component Electronics Inc.
$40.380
$35.000
Component Sense
$81.452
DF Sales Co.
$100.000
Vyrian
Bristol Electronics
Nova Conductors
Atlantic Semiconductor
Chip Stock
Digiode
Lantek
ComSIT Distribution GmbH
ComSIT USA
Semi Source
Beltway Electronics Company
A&K Electronics
Electronics Depot
Rotakorn
Cyclops Electronics Ltd
Carlin Systems, Inc.
ACDS - Activité Composants Distribution Service
Connector Distribution Corp
Right Parts Inc.
J & M Industries LLC
AZTECH Wire
$15.670
Modulus Dynamics
$20.650
MARBEL Systems
$23.923
Semicontronic
$24.000
$23.400
$23.280
One Stop Electronics
$26.000
Texas Native Microelectronics
$27.498
$24.198
Ampacity Inc.
$30.000
Kenton Components
$32.998
$29.038
Qasali Group International
$74.245
$65.335
Vigor
$109.180
Corohmni
$198.939
Microchip USA
$231.900
A-Z Elektronik GmbH
Authorized Procurement Solutions
Argo Parts USA
Continental Prestige Electronics
Supply Digital
Corphita
Kepictronics
Perfect Parts
Benley Electronics
Aranea Global
GreenTree Electronics
Cyclops Electronics Ltd (Excess)
Glotronic Ltd.
Plastic/Epoxy material makes the package lightweight and durable, suitable for a variety of applications.
Large number of logic cells allow for complex logic operations and designs to be implemented efficiently.
Surface mount technology simplifies the assembly process and reduces production costs.
Operates within a low maximum supply voltage range, making it energy efficient.
CMOS technology offers low power consumption and high noise immunity, ideal for digital circuits.
Large number of inputs allow for versatile input configurations and connectivity options.
Square package shape helps in efficient utilization of PCB space and allows for easy placement on the board.
Large number of equivalent gates enable complex digital processing and high-density designs.
Stable nominal supply voltage ensures consistent performance and reliability of the FPGA.
Multiple power supply options allow for flexibility in voltage configurations based on specific requirements.
Abundant terminals facilitate easy interfacing with external components and peripherals.
Being a field programmable device, it offers flexibility to reconfigure and optimize the logic functions as needed.
Grid array package style enables reliable connections and efficient thermal management.
Low minimum supply voltage ensures operational stability even under low voltage conditions.
High maximum operating temperature tolerance makes it suitable for demanding industrial environments.
Optimal terminal pitch allows for easy and precise soldering during assembly.
Low combinatorial delay ensures fast processing and high-speed operation of the logic blocks.
Well-organized structure with a large number of CLBs and gates provides scalability and design flexibility.
Wide operating temperature range ensures reliable performance across different environmental conditions.
Tin lead finishing on terminals enhances solderability and reliability of the connections.
Bottom positioning of terminals simplifies PCB layout and ensures easy access for soldering.
MSL 3 indicates moderate sensitivity to moisture, requiring standard handling procedures during storage and assembly.
Low profile design with maximum seated height allows for compact and space-efficient PCB layouts.
Narrow width facilitates easy integration into different system designs without occupying excess space.
High maximum clock frequency enables rapid data processing and high-speed operation of the FPGA.
Abundant outputs support versatile output configurations and facilitate connectivity with external devices.
30-second maximum reflow time at peak temperature ensures reliable solder joints during the assembly process.
High peak reflow temperature tolerance ensures proper soldering and robust connections for the FPGA.
Compact length allows for space-efficient placement on the PCB and easy integration into system designs.
Field Programmable Gate Arrays (FPGA) XC3S1500-4FG456C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
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XC3S1500-4FG456C Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
LL4148
TDK
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); No. of Phases: 1; No. of Elements: 1; Maximum Output Current: .2 A;
SS14
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Non Repetitive Peak Forward Current: 40 A; Technology: SCHOTTKY; No. of Elements: 1;
1N4148WS
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Cristek Interconnects
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; No. of Rows Loaded: 2; Shell Size: 1/E; Filter Feature: NO;
2N2222A
New Jersey Semiconductor Products
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Philips Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Texas Instruments
2N2222A by Texas Instruments is a small signal NPN bipolar junction transistor (BJT) with a max collector-emitter voltage of 40V and a max collector current of 0.8A. It is commonly used for switching applications due to its fast turn on/off times (35ns/285ns) and high transition frequency (300MHz).
BSS138PS,115
NXP Semiconductors
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
2N7002
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
NE555DR
NE555DR by Texas Instruments is an Analog Waveform Generation IC with 8 terminals, operating voltage of 5V, and power supplies ranging from 5-15V. It is a versatile component for pulse generation applications due to its small outline package and commercial temperature grade suitability.
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
1N4148
Toshiba
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
CL31B104KBCNNNC
Samsung Electro-mechanics
Samsung Electro-mechanics CL31B104KBCNNNC is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It features X7R temperature characteristics, -55 to 125 °C operating range, and compact SMT package style. Ideal for applications requiring high reliability in compact electronic devices.
ULN2803A
STMicroelectronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; No. of Elements: 8; Minimum DC Current Gain (hFE): 1000;
FSMLF327
Fox Electronics
FSMLF327 by Fox Electronics is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing such as communication systems, industrial automation, and consumer electronics. Operating temperature range from -40 to 85 °C.
General Semiconductor
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; JESD-30 Code: R-PDSO-G3;
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; No. of Elements: 1; Transistor Application: SWITCHING;
BAV99
Sprague Electric
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1.3 V; Maximum Output Current: .1 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel;
XC7K160T-2FFG676I
Xilinx
Xilinx XC7K160T-2FFG676I FPGA features 162240 logic cells, 12675 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with CMOS technology.
XC7K325T-2FFG900C
Xilinx XC7K325T-2FFG900C FPGA features 326080 logic cells, 25475 CLBs, and max clock frequency of 1818 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.
5CEBA2F23C8N
Intel
5CEBA2F23C8N by Intel is a FPGA with 25000 logic cells, 224 inputs/outputs, and operates at a max temp of 85°C. It is used in applications requiring high-speed processing and programmable ICs for various industries. The package style is grid array with a square shape and measures 23mm x 23mm.
XC6SLX45T-3FGG484C
Xilinx XC6SLX45T-3FGG484C FPGA features 43661 logic cells, 3411 CLBs, and 296 inputs/outputs. Utilized in applications requiring high clock frequencies up to 862 MHz, with a max operating temperature of 85°C. Ideal for projects demanding programmable ICs with advanced CMOS technology.
M2GL005-TQG144I
Microchip Technology
M2GL005-TQG144I by Microchip Technology is a Field Programmable Gate Array (FPGA) with a max supply voltage of 1.26V and min operating temperature of -40°C. Its package style is flatpack, low profile, fine pitch making it suitable for industrial applications requiring high performance in compact spaces. With 144 terminals and matte tin finishing, this FPGA offers versatility and reliability in electronic designs.
EP3C25F256C8NES
Altera
EP3C25F256C8NES by Altera is a plastic/epoxy FPGA with 24624 CLBs. It operates at a supply voltage range of 1.15V to 1.25V and supports a maximum clock frequency of 472.5 MHz. It has a low-profile, grid array package with 256 terminals.
M2GL005-VF256I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;
ICE40HX1K-CB132
Siliconblue Technologies
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: FBGA; Package Shape: SQUARE;
10M04DCU324I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
A3PE1500-PQG208I
A3PE1500-PQG208I by Microchip Technology is a CMOS FPGA with 38400 logic cells and 1500000 equivalent gates. It operates at a supply voltage of 1.5V, suitable for industrial applications requiring high-speed processing and programmable logic capabilities in a compact 28mm square package.
10M08SCE144I7G
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; Pitch Of Terminal: .5 mm;
XC7A200T-2SBG484C
Xilinx XC7A200T-2SBG484C FPGA offers 215360 logic cells, 16825 CLBs, and a max clock frequency of 1286 MHz. Ideal for high-performance applications requiring advanced programmable IC technology in a compact grid array package with fine pitch terminals.
LCMXO3LF-4300E-5MG256C
Lattice Semiconductor
LCMXO3LF-4300E-5MG256C by Lattice Semiconductor is a 540 CLB FPGA with max supply voltage of 1.26V, suitable for applications requiring high performance in a compact form factor. With a package style of GRID ARRAY and very thin profile, it operates b/w 0 to 85°C temperatures, making it ideal for various industrial and consumer electronics projects.
EP3C10M164C8N
EP3C10M164C8N by Intel is a FPGA with 10320 logic cells, 106 inputs/outputs, and max clock frequency of 472.5 MHz. It operates at temperatures b/w 0-85°C and has a package style of grid array for applications requiring high-speed data processing in compact spaces.
XC7S6-1FTGB196C
The Xilinx XC7S6-1FTGB196C is a FPGA with 6000 logic cells, 469 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
10M16SAU169C8G
The Intel 10M16SAU169C8G is a FPGA with 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. It operates b/w -40 to 85°C and has a supply voltage range of 2.85V to 3.15V. Ideal for applications requiring high-speed processing and programmable logic in compact designs.
LCMXO2-1200HC-4TG100IR1
LCMXO2-1200HC-4TG100IR1 by Lattice Semiconductor is a CMOS FPGA with 1280 logic cells, 80 inputs/outputs, and 133 MHz clock frequency. Ideal for applications requiring high-speed processing in fields like telecommunications and industrial automation.
ICE40LP1K-CM121
ICE40LP1K-CM121 by Lattice Semiconductor is a 1280 logic cell FPGA with 160 CLBs, operating at max 133 MHz. Ideal for industrial applications, it features a max supply voltage of 1.26 V and can withstand temperatures from -40 to 100 °C.
10M02SCU169C8G
The Intel 10M02SCU169C8G FPGA features 2000 logic cells, 125 CLBs, and 246 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for applications requiring high-performance programmable ICs in a compact square package with ball terminals.
XC7A100T-1CSG324C
Xilinx XC7A100T-1CSG324C FPGA features 101440 logic cells, 7925 CLBs, and a max clock frequency of 1098 MHz. Ideal for high-performance applications requiring fast processing speeds in compact designs with low power consumption.
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XC3S50AN-4TQG144C
XC3S50AN-4TQG144C by Xilinx is a CMOS-based FPGA with 1584 logic cells and 176 CLBs. It operates at a max clock frequency of 667 MHz and is commonly used in applications requiring high-speed data processing and programmable logic capabilities.
XC3S200AN-4FTG256C
Xilinx XC3S200AN-4FTG256C is a FPGA with 4032 logic cells, 448 CLBs, and 195 inputs. It operates at max frequency of 667 MHz and has 160 outputs. Ideal for applications requiring high-speed processing in electronics and telecommunications industries.
XC3S50AN-4TQG144CES
XC3S50AN-4TQG144CES by Xilinx is a 176 CLB, 50000 gates FPGA with max clock freq of 280 MHz. Operating at 3.3V nominal voltage, it's ideal for applications requiring high-speed processing and programmable logic in compact form factors. Package style: Flatpack, low profile, fine pitch.
XC3S50A-4VQG100C
The Xilinx XC3S50A-4VQG100C is a FPGA with 1584 logic cells, 176 CLBs, and 50000 equivalent gates. It operates at a max frequency of 667 MHz and has a combinatorial delay of 0.71 ns. Ideal for applications requiring high-speed processing and programmable logic capabilities in compact designs.
XC3S50AN-4TQG144I
The Xilinx XC3S50AN-4TQG144I is a FPGA with 1584 logic cells, 176 CLBs, and 50000 equivalent gates. It operates at max frequency of 667 MHz, suitable for industrial applications requiring high-speed processing in compact designs. With a wide temperature range (-40 to 100°C) and low profile package style, it's ideal for diverse electronic systems.
XC3SD1800A-4FGG676I
Xilinx XC3SD1800A-4FGG676I FPGA offers 37440 logic cells, 4160 CLBs, and 1800000 equivalent gates. Ideal for applications requiring high-speed processing with a max clock frequency of 250 MHz. Package style: Grid Array, technology: CMOS, suitable for various electronic designs.
XC3S50A-4TQG144C
Xilinx XC3S50A-4TQG144C FPGA features 1584 logic cells, 176 CLBs, and 50000 equivalent gates. Operating at a max frequency of 667 MHz, it's ideal for applications requiring high-speed processing like telecommunications and industrial automation. With a compact square package and low profile design, it offers versatile integration options in various electronic systems.
XC3S200AN-4FTG256I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
XC3S400-4TQG144I
The Xilinx XC3S400-4TQG144I is a FPGA with 8064 logic cells, 896 CLBs, and 400000 equivalent gates. It operates at a max clock frequency of 630 MHz and has a combinatorial delay of 0.61 ns per CLB. Ideal for applications requiring high-speed processing and complex logic functions in compact designs.
XC3S200A-4VQG100I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XC3S400-4FTG256C
The Xilinx XC3S400-4FTG256C FPGA features 8064 logic cells, 896 CLBs, and a max clock frequency of 630 MHz. Ideal for applications requiring high-speed processing and programmable logic capabilities in a compact package.
XC3S250E-4FTG256C
Xilinx XC3S250E-4FTG256C FPGA features 5508 logic cells, 612 CLBs, and 250000 gates. With a max clock frequency of 572 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.
XC3S200-4TQG144C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XC3S400A-4FTG256C
Xilinx XC3S400A-4FTG256C FPGA offers 8064 logic cells, 896 CLBs, and 400000 gates. With a max clock frequency of 667 MHz, it is ideal for high-speed applications like telecommunications and networking. Operating temperature ranges from 0 to 85°C with a low profile grid array package style.
XC3S250E-4VQG100I
Xilinx XC3S250E-4VQG100I FPGA offers 5508 logic cells, 612 CLBs, and 250000 gates. With a max clock frequency of 572 MHz, it is ideal for industrial applications requiring high-speed processing in compact designs. The package style includes flatpack, thin profile, and fine pitch options for versatile integration.
XC3S500E-4FGG320C
Xilinx XC3S500E-4FGG320C FPGA offers 10476 logic cells, 1164 CLBs, and 500000 gates. With a max clock frequency of 572 MHz, it is ideal for high-speed applications in industries like telecommunications and aerospace. Operating temperature ranges from 0 to 85°C with a package style of grid array.
XC3SD1800A-4CSG484C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
XC3S200A-4VQG100C
The Xilinx XC3S200A-4VQG100C is a FPGA with 4032 logic cells, 448 CLBs, and 200000 equivalent gates. It operates at a max frequency of 667 MHz and has a combinatorial delay of 0.71 ns. Ideal for applications requiring high-speed processing in electronics and telecommunications industries.
XC3S400A-4FTG256I
XC3S1200E-4FGG400C
XC3S1200E-4FGG400C by Xilinx is a CMOS-based FPGA with 19512 logic cells and 1200000 equivalent gates. It operates at a max clock frequency of 572 MHz and is commonly used in applications requiring high-speed data processing and programmable logic capabilities.
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