Loading...
Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC6VCX195T-1FFG1156I by Xilinx

XC6VCX195T-1FFG1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;

FPGA

199680

600

600

15600

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC6VCX195T-1FFG784I by Xilinx

XC6VCX195T-1FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER;

FPGA

199680

400

400

15600

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VCX195T-2FF784I by Xilinx

XC6VCX195T-2FF784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

199680

400

400

15600

1098 MHz

0.91 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Lead

1 mm

784

S-PBGA-B784

e0

No

XC6VCX195T-2FFG1156C by Xilinx

XC6VCX195T-2FFG1156C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE;

FPGA

199680

600

600

15600

1098 MHz

0.91 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC6VCX195T-2FFG784C by Xilinx

XC6VCX195T-2FFG784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

199680

400

400

15600

1098 MHz

0.91 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VCX240T-1FFG784I by Xilinx

XC6VCX240T-1FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;

FPGA

241152

400

400

18840

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VCX240T-2FFG1156I by Xilinx

XC6VCX240T-2FFG1156I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1,1.2/2.5,2.5;

FPGA

241152

600

600

18840

1098 MHz

0.91 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.5 mm

BGA1156,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1156

S-PBGA-B1156

e1

No

XC6VCX75T-1FFG784C by Xilinx

XC6VCX75T-1FFG784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

360

360

5820

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VCX75T-1FFG784I by Xilinx

XC6VCX75T-1FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;

FPGA

74496

360

360

5820

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VCX75T-2FFG784I by Xilinx

XC6VCX75T-2FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 1098 MHz;

FPGA

74496

360

360

5820

1098 MHz

0.91 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XA7A100T-1FGG484Q by Xilinx

XA7A100T-1FGG484Q

Xilinx

XA7A100T-1FGG484Q by Xilinx is a FPGA with 101440 logic cells, 7925 CLBs, and 285 inputs/outputs. It operates at max frequency of 1098 MHz, suitable for automotive applications due to AEC-Q100 screening and HKMG technology. With a compact form factor (23mm x 23mm), it's ideal for high-performance computing in harsh environments.

FPGA

101440

285

285

7925

1098 MHz

1.27 ns

HKMG

Field Programmable Gate Arrays

7925 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

LCMXO1200C-3BN256C by Lattice Semiconductor

LCMXO1200C-3BN256C

Lattice Semiconductor

LCMXO1200C-3BN256C by Lattice Semiconductor is a Field Programmable Gate Array (FPGA) with 1200 logic cells, 150 CLBs, and 211 inputs/outputs. It is used for applications requiring programmable ICs in various industries.

FPGA

1200

211

211

150

Field Programmable Gate Arrays

150 CLBS

1.8

1.71 V

3.465 V

1.8/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

No

LCMXO1200C-3BN256I by Lattice Semiconductor

LCMXO1200C-3BN256I

Lattice Semiconductor

LCMXO1200C-3BN256I by Lattice Semiconductor is a 1200 Logic Cells FPGA with 150 CLBs and 211 Inputs/Outputs. Operating at max 100°C, it's ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

FPGA

1200

211

211

150

Field Programmable Gate Arrays

150 CLBS

1.8

1.71 V

3.465 V

1.8/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

No

LCMXO2280C-3BN256C by Lattice Semiconductor

LCMXO2280C-3BN256C

Lattice Semiconductor

LCMXO2280C-3BN256C by Lattice Semiconductor is a Field Programmable Gate Array (FPGA) with 2280 logic cells. It has a max supply voltage of 3.465V and can operate at temperatures up to 85°C. This FPGA is commonly used in applications requiring programmable ICs for various electronic systems.

FPGA

2280

211

211

285

Field Programmable Gate Arrays

285 CLBS

1.8

1.71 V

3.465 V

1.8/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

No

LCMXO2280C-3BN256I by Lattice Semiconductor

LCMXO2280C-3BN256I

Lattice Semiconductor

LCMXO2280C-3BN256I by Lattice Semiconductor is a Field Programmable Gate Array (FPGA) with 2280 logic cells. It has a max supply voltage of 3.465V and can operate in temperatures ranging from -40 to 100°C. This FPGA is suitable for industrial applications requiring programmable ICs with high logic cell count and versatile input/output capabilities.

FPGA

2280

211

211

285

Field Programmable Gate Arrays

285 CLBS

1.8

1.71 V

3.465 V

1.8/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

No

LCMXO2280C-4BN256I by Lattice Semiconductor

LCMXO2280C-4BN256I

Lattice Semiconductor

LCMXO2280C-4BN256I by Lattice Semiconductor is a FPGA with 2280 logic cells, 285 CLBs, and 211 inputs/outputs. It operates at a max voltage of 3.465V and supports supply voltages of 1.8V/3.3V. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

FPGA

2280

211

211

285

Field Programmable Gate Arrays

285 CLBS

1.8

1.71 V

3.465 V

1.8/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

No

LCMXO640C-3BN256I by Lattice Semiconductor

LCMXO640C-3BN256I

Lattice Semiconductor

LCMXO640C-3BN256I by Lattice Semiconductor is a 640 Logic Cells FPGA with 80 CLBs and 159 Inputs/Outputs. Operating at 1.8V, it's ideal for industrial applications requiring high performance in a compact form factor. With a low profile grid array package, it offers flexibility and reliability in demanding environments.

FPGA

640

159

159

80

Field Programmable Gate Arrays

80 CLBS

1.8

1.71 V

3.465 V

1.8/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

No

LAXP2-8E-5MN132E by Lattice Semiconductor

LAXP2-8E-5MN132E

Lattice Semiconductor

Lattice Semiconductor's LAXP2-8E-5MN132E is an FPGA with 8000 logic cells, 86 inputs/outputs, and a max clock frequency of 435 MHz. Ideal for applications requiring high-speed processing in automotive electronics, it operates at temperatures ranging from -40 to 125°C and has a low-profile grid array package style.

FPGA

8000

86

86

8000

435 MHz

Field Programmable Gate Arrays

8000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

8 mm

8 mm

1.35 mm

BGA132,14X14,20

Bottom

Ball

Tin Silver Copper

.5 mm

132

S-PBGA-B132

e1

No

AEC-Q100

XA6SLX45-2FGG484Q by Xilinx

XA6SLX45-2FGG484Q

Xilinx

XA6SLX45-2FGG484Q by Xilinx is a 1.2V FPGA with 43661 logic cells, 316 inputs/outputs, and max clock frequency of 62.5MHz. Ideal for automotive applications due to AEC-Q100 screening level and operating temperature range of -40 to 125°C.

FPGA

43661

316

316

62.5 MHz

Field Programmable Gate Arrays

1.2

1.2,2.5/3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

23 mm

23 mm

2.6 mm

BGA484,22X22,40

Bottom

Ball

Tin Silver Copper

1 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XC5VLX155T-1FF1136I by Xilinx

XC5VLX155T-1FF1136I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

155648

640

640

12160

0.9 ns

Field Programmable Gate Arrays

12160 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Lead

1 mm

1136

S-PBGA-B1136

e0

No

XC5VFX100T-1FF1136I by Xilinx

XC5VFX100T-1FF1136I

Xilinx

Xilinx XC5VFX100T-1FF1136I FPGA features 102400 logic cells, 8000 CLBs, and 640 inputs/outputs. Ideal for industrial applications with a max operating temperature of 100°C. Utilizes CMOS technology with a supply voltage range of 0.95V to 2.5V for versatile performance in various electronic systems.

FPGA

102400

640

640

8000

0.9 ns

CMOS

Field Programmable Gate Arrays

8000 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Lead

1 mm

1136

S-PBGA-B1136

e0

No

XC5VFX100T-1FF1738C by Xilinx

XC5VFX100T-1FF1738C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

102400

680

680

8000

0.9 ns

CMOS

Field Programmable Gate Arrays

8000 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin Lead

1 mm

1738

S-PBGA-B1738

e0

No

XC5VFX100T-1FF1738I by Xilinx

XC5VFX100T-1FF1738I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

102400

680

680

8000

0.9 ns

CMOS

Field Programmable Gate Arrays

8000 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin Lead

1 mm

1738

S-PBGA-B1738

e0

No

XC5VFX100T-1FFG1136C by Xilinx

XC5VFX100T-1FFG1136C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

102400

640

640

8000

0.9 ns

CMOS

Field Programmable Gate Arrays

8000 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1136

S-PBGA-B1136

e1

No

XC5VFX100T-1FFG1136I by Xilinx

XC5VFX100T-1FFG1136I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

102400

640

640

8000

0.9 ns

CMOS

Field Programmable Gate Arrays

8000 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1136

S-PBGA-B1136

e1

No

XC5VFX100T-1FFG1738C by Xilinx

XC5VFX100T-1FFG1738C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

102400

680

680

8000

0.9 ns

CMOS

Field Programmable Gate Arrays

8000 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1738

S-PBGA-B1738

e1

No

XC5VFX100T-1FFG1738I by Xilinx

XC5VFX100T-1FFG1738I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

102400

680

680

8000

0.9 ns

CMOS

Field Programmable Gate Arrays

8000 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1738

S-PBGA-B1738

e1

No

XC5VFX100T-2FF1136I by Xilinx

XC5VFX100T-2FF1136I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

102400

640

640

8000

0.77 ns

CMOS

Field Programmable Gate Arrays

8000 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Lead

1 mm

1136

S-PBGA-B1136

e0

No

XC5VFX100T-2FF1738C by Xilinx

XC5VFX100T-2FF1738C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

102400

680

680

8000

0.77 ns

CMOS

Field Programmable Gate Arrays

8000 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin Lead

1 mm

1738

S-PBGA-B1738

e0

No

XC5VFX100T-2FF1738I by Xilinx

XC5VFX100T-2FF1738I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

102400

680

680

8000

0.77 ns

CMOS

Field Programmable Gate Arrays

8000 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin Lead

1 mm

1738

S-PBGA-B1738

e0

No

XC5VFX100T-2FFG1136C by Xilinx

XC5VFX100T-2FFG1136C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

102400

640

640

8000

0.77 ns

CMOS

Field Programmable Gate Arrays

8000 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1136

S-PBGA-B1136

e1

No

XC5VFX100T-2FFG1136I by Xilinx

XC5VFX100T-2FFG1136I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;

FPGA

102400

640

640

8000

0.77 ns

CMOS

Field Programmable Gate Arrays

8000 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

35 mm

35 mm

3.25 mm

BGA1136,34X34,40

Bottom

Ball

Tin Silver Copper

1 mm

1136

S-PBGA-B1136

e1

No

XC5VFX130T-1FF1738C by Xilinx

XC5VFX130T-1FF1738C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

13172

840

840

10240

0.9 ns

CMOS

Field Programmable Gate Arrays

10240 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin Lead

1 mm

1738

S-PBGA-B1738

e0

No

XC5VFX130T-1FF1738I by Xilinx

XC5VFX130T-1FF1738I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

13172

840

840

10240

0.9 ns

CMOS

Field Programmable Gate Arrays

10240 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin Lead

1 mm

1738

S-PBGA-B1738

e0

No

XC5VFX130T-1FFG1738C by Xilinx

XC5VFX130T-1FFG1738C

Xilinx

Xilinx XC5VFX130T-1FFG1738C is a FPGA with 13172 logic cells, 10240 CLBs, and 840 inputs/outputs. Operating at max 85°C, it uses CMOS tech with supply voltage of 0.95-1.05 V for applications like signal processing and embedded systems requiring high-speed data processing.

FPGA

13172

840

840

10240

0.9 ns

CMOS

Field Programmable Gate Arrays

10240 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1738

S-PBGA-B1738

e1

No

XC5VFX130T-1FFG1738I by Xilinx

XC5VFX130T-1FFG1738I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

13172

840

840

10240

0.9 ns

CMOS

Field Programmable Gate Arrays

10240 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1738

S-PBGA-B1738

e1

No

XC5VFX130T-2FF1738I by Xilinx

XC5VFX130T-2FF1738I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

13172

840

840

10240

0.77 ns

CMOS

Field Programmable Gate Arrays

10240 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin Lead

1 mm

1738

S-PBGA-B1738

e0

No

XC5VFX130T-2FFG1738C by Xilinx

XC5VFX130T-2FFG1738C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

13172

840

840

10240

0.77 ns

CMOS

Field Programmable Gate Arrays

10240 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1738

S-PBGA-B1738

e1

No

XC5VFX130T-2FFG1738I by Xilinx

XC5VFX130T-2FFG1738I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

13172

840

840

10240

0.77 ns

CMOS

Field Programmable Gate Arrays

10240 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1738

S-PBGA-B1738

e1

No

XC5VFX200T-1FFG1738C by Xilinx

XC5VFX200T-1FFG1738C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

196608

960

960

15360

0.9 ns

CMOS

Field Programmable Gate Arrays

15360 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1738

S-PBGA-B1738

e1

No

XC5VFX200T-1FFG1738I by Xilinx

XC5VFX200T-1FFG1738I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

196608

960

960

15360

0.9 ns

CMOS

Field Programmable Gate Arrays

15360 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1738

S-PBGA-B1738

e1

No

XC5VFX200T-2FF1738C by Xilinx

XC5VFX200T-2FF1738C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

196608

960

960

15360

0.77 ns

CMOS

Field Programmable Gate Arrays

15360 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin Lead

1 mm

1738

S-PBGA-B1738

e0

No

XC5VFX200T-2FFG1738C by Xilinx

XC5VFX200T-2FFG1738C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;

FPGA

196608

960

960

15360

0.77 ns

CMOS

Field Programmable Gate Arrays

15360 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

42.5 mm

42.5 mm

3.25 mm

BGA1738,42X42,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

1738

S-PBGA-B1738

e1

No

XC5VFX30T-1FF665I by Xilinx

XC5VFX30T-1FF665I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;

FPGA

32768

360

360

2560

0.9 ns

CMOS

Field Programmable Gate Arrays

2560 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Lead

1 mm

665

S-PBGA-B665

e0

No

XC5VFX30T-1FFG665C by Xilinx

XC5VFX30T-1FFG665C

Xilinx

The Xilinx XC5VFX30T-1FFG665C is a FPGA with 32768 logic cells, 2560 CLBs, and 360 inputs/outputs. It operates at voltages of 1-2.5V, with a max combinatorial delay of 0.9ns. Ideal for applications requiring high-speed processing in compact designs.

FPGA

32768

360

360

2560

0.9 ns

CMOS

Field Programmable Gate Arrays

2560 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

665

S-PBGA-B665

e1

No

XC5VFX30T-1FFG665I by Xilinx

XC5VFX30T-1FFG665I

Xilinx

The Xilinx XC5VFX30T-1FFG665I is a FPGA with 32768 logic cells, 2560 CLBs, and 360 inputs/outputs. Operating at 1.05 V, it offers 0.9 ns combinatorial delay per CLB. Ideal for industrial applications requiring high-speed processing in compact designs.

FPGA

32768

360

360

2560

0.9 ns

CMOS

Field Programmable Gate Arrays

2560 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

665

S-PBGA-B665

e1

No

XC5VFX30T-2FF665I by Xilinx

XC5VFX30T-2FF665I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;

FPGA

32768

360

360

2560

0.77 ns

CMOS

Field Programmable Gate Arrays

2560 CLBS

1

.95 V

1.05 V

1,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Lead

1 mm

665

S-PBGA-B665

e0

No

XC5VFX30T-2FFG665C by Xilinx

XC5VFX30T-2FFG665C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;

FPGA

32768

360

360

2560

0.77 ns

CMOS

Field Programmable Gate Arrays

2560 CLBS

1

.95 V

1.05 V

1,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.9 mm

BGA665,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

665

S-PBGA-B665

e1

No