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XC5VFX30T-1FFG665I

Xilinx

XC5VFX30T-1FFG665I by Xilinx

The Xilinx XC5VFX30T-1FFG665I is a FPGA with 32768 logic cells, 2560 CLBs, and 360 inputs/outputs. Operating at 1.05 V, it offers 0.9 ns combinatorial delay per CLB. Ideal for industrial applications requiring high-speed processing in compact designs.

Median Price

$1,142.770

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Mouser Electronics

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Overview

Unlock endless possibilities with the Xilinx XC5VFX30T-1FFG665I FPGA. Crafted by industry leader Xilinx, this cutting-edge device offers unmatched quality and reliability. Ideal for a wide range of applications, from telecommunications to industrial automation, this FPGA boasts 32768 logic cells and 2560 CLBs, providing unparalleled flexibility and performance. With a maximum operating temperature of 100°C and a compact design, the XC5VFX30T-1FFG665I is the perfect solution for your next project. Experience the power of Xilinx and revolutionize your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material for package body, ensuring reliability and longevity of the product.

No. of Logic Cells: 32768

High number of logic cells allows for complex programmable logic design implementations.

Surface Mount: YES

Easy integration onto PCBs for efficient manufacturing processes.

Maximum Supply Voltage: 1.05 V

Low power consumption with maximum supply voltage of 1.05V.

No. of CLBs: 2560

Abundance of Configurable Logic Blocks for versatile design possibilities.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity.

No. of Inputs: 360

Ample number of inputs for interfacing with external devices and components.

Package Shape: SQUARE

Compact package shape for efficient use of PCB space.

Form Of Terminal: BALL

Ball form terminal enables reliable connections during assembly.

Power Supplies (V): 1,2.5

Support for multiple power supply voltages for flexibility in design.

No. of Terminals: 665

Sufficient terminals for connectivity and integration in a circuit.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA provides reconfigurable logic which is ideal for prototyping and rapid development.

Package Style (Meter): GRID ARRAY

Grid array package style aids in easy mounting and soldering onto PCBs.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage for energy-efficient operation.

Maximum Operating Temperature: 100 °C

High maximum operating temperature for reliable performance in various environments.

Pitch Of Terminal: 1 mm

Optimal terminal pitch for ease of soldering and assembly.

Maximum Combinatorial Delay of a CLB: 0.9 ns

Low combinatorial delay for efficient signal processing within CLBs.

Organization: 2560 CLBS

Organized structure with 2560 CLBs for systematic logic implementation.

Minimum Operating Temperature: -40 °C

Wide temperature range for operation in extreme conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

Resilient terminal finishing for durable connections and reliability.

Position Of Terminal: BOTTOM

Bottom positioning of terminals for convenient PCB mounting.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates resistance to moisture, ensuring product durability.

Maximum Seated Height: 2.9 mm

Low seated height for compact designs and space-saving PCB layout.

Width: 27 mm

Moderate width for compatibility with standard PCB sizes.

No. of Outputs: 360

Wide range of outputs for driving external devices and components.

Maximum Time At Peak Reflow Temperature (s): 30

Allows sufficient time at peak reflow temperature for proper soldering.

Peak Reflow Temperature °C: 250

High peak reflow temperature for reliable solder joints.

Length: 27 mm

Moderate length for compatibility with standard PCB sizes.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature rating for robust performance in harsh environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC5VFX30T-1FFG665I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

32768

No. of Inputs:

360

No. of Outputs:

360

No. of CLBs:

2560

CLB Maximum Delay:

0.9 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

2560 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.9 mm

Package Equivalence Code:

BGA665,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

665

Standards

JESD-30 Code:

S-PBGA-B665

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC5VFX30T-1FFG665I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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