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LCMXO2280C-3BN256I

Lattice Semiconductor

LCMXO2280C-3BN256I by Lattice Semiconductor

LCMXO2280C-3BN256I by Lattice Semiconductor is a Field Programmable Gate Array (FPGA) with 2280 logic cells. It has a max supply voltage of 3.465V and can operate in temperatures ranging from -40 to 100°C. This FPGA is suitable for industrial applications requiring programmable ICs with high logic cell count and versatile input/output capabilities.

Median Price

$31.528

Lifecycle Status

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AZTECH Wire

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Overview

Unlock the potential of your designs with the LCMXO2280C-3BN256I by Lattice Semiconductor. As a leading manufacturer in the field, Lattice Semiconductor delivers exceptional quality and reliability. This FPGA offers unmatched flexibility and versatility in a wide range of applications. With its 2280 logic cells and 285 CLBs, you can create innovative solutions tailored to your specific needs. The LCMXO2280C-3BN256I is designed for ease of use and maximum performance, allowing you to bring your ideas to life quickly and efficiently. Experience the value, benefits, and advantages this product brings to your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the FPGA, making it suitable for various applications.

No. of Logic Cells: 2280

With a high number of logic cells, this FPGA offers extensive capacity for complex designs and allows for versatile programming.

Surface Mount: YES

The surface mount feature enables easy and efficient installation on PCBs, saving valuable time during assembly.

Maximum Supply Voltage: 3.465 V

With a high maximum supply voltage, this FPGA can handle a wide range of power requirements, making it adaptable to different projects.

No. of CLBs: 285

The large number of Configurable Logic Blocks (CLBs) allows for flexible circuit design and implementation, accommodating diverse functionalities.

No. of Inputs: 211

The numerous input channels provide ample connectivity options, enabling the FPGA to interface with a wide range of devices and systems.

Package Shape: SQUARE

The square shape of the package facilitates efficient utilization of space on PCBs, optimizing layout and arrangement of components.

Form Of Terminal: BALL

The ball terminal design ensures reliable electrical connections and aids in better heat dissipation, enhancing overall /formance and thermal management.

Nominal Supply Voltage (V): 1.8

The stable nominal supply voltage ensures consistent and reliable o/ation, reducing the risk of voltage-related issues in the FPGA.

Power Supplies (V): 1.8/3.3

With dual power supply compatibility, this FPGA can be powered by either 1.8V or 3.3V, allowing for greater flexibility with different system configurations.

No. of Terminals: 256

The ample number of terminals provides extensive connectivity options, accommodating various interface requirements and enabling versatile application integration.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device, this FPGA allows for customization and adaptability to specific application needs, making it suitable for a wide range of projects.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array package style offers high-density mounting with a low profile and fine pitch, enabling compact designs and saving valuable space.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage requirement allows for efficient power consumption and o/ation, making it suitable for low-power applications.

Maximum O/ating Tem/ature: 100 °C

With a high maximum o/ating tem/ature, this FPGA can withstand demanding environmental conditions, ensuring reliable /formance in various tem/ature-sensitive applications.

Pitch Of Terminal: 0.8 mm

The small terminal pitch provides precise and secure connections, minimizing signal distortion and ensuring optimal electrical /formance.

Organization: 285 CLBS

The organized structure of 285 configurable logic blocks allows for efficient logic implementation, making it easier to design and optimize complex circuits.

Minimum O/ating Tem/ature: -40 °C

The FPGA's capability to o/ate at low tem/atures enables its use in harsh, cold environments, expanding its range of application possibilities.

Finishing Of Terminal Used: TIN SILVER COP/

The use of a terminal finish comprising tin, silver, and cop/ enhances solderability and interconnect reliability, ensuring better overall /formance and longevity.

Position Of Terminal: BOTTOM

The terminal's bottom position facilitates easy PCB routing, improving signal integrity and reducing interference, leading to improved FPGA functionality.

Moisture Sensitivity Level (MSL): 3

With MSL 3 rating, this FPGA has a moderate level of sensitivity to moisture exposure, allowing it to be safely handled and stored under normal conditions.

Maximum Seated Height: 1.7 mm

The low-seated height ensures compatibility with compact designs, allowing for space-efficient integration into electronic systems.

Width: 14 mm

With a compact width, this FPGA provides flexibility in PCB layout and promotes efficient utilization of space, enabling design optimizations.

No. of Outputs: 211

The multiple output channels allow for signal distribution to various devices or systems, enhancing connectivity options and enabling efficient data transmission.

Peak Reflow Tem/ature °C: 260

The ability to withstand high peak reflow tem/atures ensures compatibility with lead-free soldering processes, making it suitable for modern assembly techniques.

Length: 14 mm

The FPGA's compact length enables space-saving integration into electronic systems, allowing more components to be placed within a limited area.

Grading Of Tem/ature: INDUSTRIAL

The industrial-grade tem/ature range signifies that this FPGA is designed to o/ate reliably across demanding industrial environments, making it suitable for robust applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LCMXO2280C-3BN256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

2280

No. of Inputs:

211

No. of Outputs:

211

No. of CLBs:

285

Sub-Category:

Field Programmable Gate Arrays

Organization:

285 CLBS

Power Characteristics

Nominal Supply Voltage:

1.8

Minimum Supply Voltage:

1.71 V

Maximum Supply Voltage:

3.465 V

Power Supplies:

1.8/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

14 mm

Width:

14 mm

Maximum Seated Height:

1.7 mm

Package Equivalence Code:

BGA256,16X16,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

LCMXO2280C-3BN256I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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