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LCMXO1200C-3BN256C

Lattice Semiconductor

LCMXO1200C-3BN256C by Lattice Semiconductor

LCMXO1200C-3BN256C by Lattice Semiconductor is a Field Programmable Gate Array (FPGA) with 1200 logic cells, 150 CLBs, and 211 inputs/outputs. It is used for applications requiring programmable ICs in various industries.

Median Price

$26.300

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Overview

Experience the power and versatility of the LCMXO1200C-3BN256C by Lattice Semiconductor, a leading manufacturer in the field of Field Programmable Gate Arrays (FPGA). With 1200 logic cells and 150 configurable logic blocks, this FPGA offers unmatched scalability and flexibility for a wide range of applications. Its low-profile, fine-pitch package shape ensures easy integration into any design. With a maximum supply voltage of 3.465V and multiple power supply options, it delivers reliable performance while minimizing power consumption. Whether you're working on IoT devices, industrial automation, or consumer electronics, the LCMXO1200C-3BN256C is your ultimate solution for cutting-edge designs. Unlock endless possibilities with Lattice Semiconductor and revolutionize your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides excellent durability and protection for the FPGA, making it suitable for a wide range of applications.

No. of Logic Cells: 1200

With 1200 logic cells, this FPGA offers a high level of programmable logic capacity, enabling complex designs and advanced applications to be implemented effectively.

Surface Mount: YES

The surface mount capability of this FPGA allows for easy and efficient integration onto circuit boards, saving valuable space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.465 V

The high maximum supply voltage of 3.465 V ensures reliable and robust operation, providing stable power delivery to the FPGA for consistent performance.

No. of CLBs: 150

Featuring 150 configurable logic blocks (CLBs), this FPGA offers a versatile architecture that enables flexible and customizable designs to meet specific requirements.

No. of Inputs: 211

With 211 inputs, this FPGA allows for ample connectivity options, facilitating the integration of multiple sources and enabling extensive data processing capabilities.

Package Shape: SQUARE

The square package shape enables efficient and compact placement of the FPGA on circuit boards, optimizing space utilization and enabling more streamlined system designs.

Form Of Terminal: BALL

The ball terminal form simplifies the soldering process and ensures secure electrical connections, enhancing the overall reliability and stability of the FPGA.

Nominal Supply Voltage (V): 1.8

The nominal supply voltage of 1.8 V provides a standard voltage level for compatibility with various other components, making integration and system design easier.

Power Supplies (V): 1.8/3.3

Supporting both 1.8 V and 3.3 V power supplies, this FPGA offers compatibility with a wide range of systems and enables seamless integration into diverse environments.

No. of Terminals: 256

With 256 terminals, this FPGA provides numerous connection points for various external devices and enhances the scalability and flexibility of the system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array, this IC type allows for on-the-fly reprogramming, enabling rapid prototyping and easy design iteration.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch design of the package style facilitates precise and compact placement of the FPGA, making it suitable for densely populated boards and miniaturized systems.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage requirement of 1.71 V promotes energy efficiency and helps to minimize power consumption in various applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this FPGA can withstand demanding and rugged environments, ensuring reliable operation even under challenging conditions.

Pitch Of Terminal: 0.8 mm

The 0.8 mm pitch of the terminal spacing allows for efficient routing and maneuverability of signals, simplifying board layout and optimizing signal integrity.

Organization: 150 CLBS

The organization of 150 configurable logic blocks (CLBs) provides a structured and adaptable architecture, enabling efficient design implementation and enhancing system flexibility.

Minimum Operating Temperature: 0 °C

The FPGA's ability to operate reliably at temperatures as low as 0°C makes it suitable for various industrial and outdoor applications where temperature fluctuations may occur.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin silver copper as the finishing material for the FPGA's terminals ensures excellent conductivity, corrosion resistance, and solderability, contributing to reliable and long-lasting electrical connections.

Position Of Terminal: BOTTOM

With the terminals positioned at the bottom of the FPGA, it facilitates easy and efficient PCB assembly and enables optimized board layouts for improved signal flow and thermal management.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the FPGA has a moderate level of sensitivity to moisture exposure, requiring appropriate handling and storage protocols for reliable operation.

Maximum Seated Height: 1.7 mm

The low maximum seated height of 1.7 mm allows for compact and low-profile installations, ensuring compatibility with space-constrained applications and simplifying system design.

Width: 14 mm

With a width of 14 mm, this FPGA offers a compact form factor, making it suitable for applications with size restrictions or where space optimization is crucial.

No. of Outputs: 211

With 211 outputs, this FPGA enables the driving of multiple devices and facilitates the transmission of signals to external components, enhancing system connectivity and versatility.

Peak Reflow Temperature °C: 260

The FPGA's high peak reflow temperature of 260°C ensures the integrity of solder joints during the manufacturing process, facilitating robust assembly and reliable operation.

Length: 14 mm

Featuring a length of 14 mm, this FPGA offers a compact footprint, enabling it to be integrated into various system designs without consuming excessive space.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LCMXO1200C-3BN256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

1200

No. of Inputs:

211

No. of Outputs:

211

No. of CLBs:

150

Sub-Category:

Field Programmable Gate Arrays

Organization:

150 CLBS

Power Characteristics

Nominal Supply Voltage:

1.8

Minimum Supply Voltage:

1.71 V

Maximum Supply Voltage:

3.465 V

Power Supplies:

1.8/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

14 mm

Width:

14 mm

Maximum Seated Height:

1.7 mm

Package Equivalence Code:

BGA256,16X16,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

LCMXO1200C-3BN256C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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