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XC6SLX75T-4CSG484C

Xilinx

XC6SLX75T-4CSG484C by Xilinx

Xilinx XC6SLX75T-4CSG484C is a CMOS FPGA with 74637 logic cells, 292 inputs/outputs, and operates at temperatures from 0 to 85°C. It features a grid array package style with 0.8mm terminal pitch, suitable for various applications requiring high-performance programmable ICs.

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Overview

Unlock limitless possibilities with the XC6SLX75T-4CSG484C by Xilinx, a cutting-edge Field Programmable Gate Array that promises unmatched performance and versatility. Manufactured by Xilinx, a leader in FPGA technology, this innovative product boasts 74637 logic cells and 292 inputs/outputs, making it ideal for a wide range of applications. Whether you're designing advanced electronics or creating complex algorithms, this FPGA delivers unparalleled value, efficiency, and reliability. Trust Xilinx to elevate your projects to new heights with the XC6SLX75T-4CSG484C.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a cost-effective and durable housing for the FPGA.

No. of Logic Cells: 74637

Offers a high level of programmable logic for versatile applications.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort.

Technology Used: CMOS

Ensures low power consumption and high-speed performance.

No. of Inputs: 292

Provides ample input options for connecting to external devices.

Package Shape: SQUARE

Optimizes space utilization on the PCB for efficient layout.

Form Of Terminal: BALL

Facilitates reliable connections and soldering during assembly.

Power Supplies (V): 1.2,2.5/3.3

Supports a wide range of voltage requirements for compatibility with various systems.

No. of Terminals: 484

Offers extensive pin options for versatile connectivity and functionality.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Enables customization and reprogramming of logic functions as needed.

Package Style (Meter): GRID ARRAY, FINE PITCH

Enhances thermal performance and signal integrity with efficient grid array design.

Maximum Operating Temperature: 85 °C

Ensures reliable operation even in high-temperature environments.

Pitch Of Terminal: 0.8 mm

Allows for close spacing and compact layout on the PCB.

Minimum Operating Temperature: 0 °C

Ensures functionality even in low-temperature conditions.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Provides a reliable and conductive surface for soldering connections.

Position Of Terminal: BOTTOM

Facilitates easy access and soldering during PCB assembly.

Moisture Sensitivity Level (MSL): 3

Indicates a moderate level of resistance to moisture-induced damage.

Maximum Seated Height: 1.8 mm

Maintains a low profile for space-constrained applications.

Width: 19 mm

Provides a compact form factor for integrating into various systems.

No. of Outputs: 292

Offers a balanced number of output options for diverse signal routing.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and thermal profile during assembly.

Peak Reflow Temperature °C: 260

Supports high-temperature soldering for reliable connections.

Length: 19 mm

Maintains a square form factor for consistent PCB layout.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX75T-4CSG484C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

74637

No. of Inputs:

292

No. of Outputs:

292

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Fine Pitch

Package Code:

Package Shape:

Length:

19 mm

Width:

19 mm

Maximum Seated Height:

1.8 mm

Package Equivalence Code:

BGA484,22X22,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Terminal Pitch:

.8 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX75T-4CSG484C Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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