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XC6SLX9-2CPG196C

Xilinx

XC6SLX9-2CPG196C by Xilinx

XC6SLX9-2CPG196C by Xilinx is a CMOS-based FPGA with 9152 logic cells and 715 CLBs. It operates at a max clock frequency of 667 MHz and is commonly used in applications requiring high-performance programmable ICs.

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$37.940

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Overview

Experience the power and versatility of the XC6SLX9-2CPG196C by Xilinx, the leading manufacturer in Field Programmable Gate Arrays (FPGA). With its cutting-edge technology and top-quality construction, this FPGA offers endless possibilities for your projects. Whether you're designing high-performance systems or creating innovative solutions, the XC6SLX9-2CPG196C's 9152 logic cells and 715 CLBs provide unmatched flexibility. Its compact size and surface mount package make it easy to integrate into any design. Plus, with a maximum clock frequency of 667 MHz, you can achieve lightning-fast performance. Discover the true potential of your designs with the XC6SLX9-2CPG196C from Xilinx.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and protection for the FPGA, making it suitable for various environments and applications.

No. of Logic Cells

9152 - With a high number of logic cells, this FPGA can handle complex computations and tasks efficiently, offering more flexibility and capability.

Surface Mount

YES - The surface mount capability enables easy and convenient installation of the FPGA on printed circuit boards, simplifying the manufacturing process.

Maximum Supply Voltage

1.26 V - The high maximum supply voltage allows the FPGA to operate reliably under demanding conditions, ensuring stable performance.

No. of CLBs

715 - The significant number of Configurable Logic Blocks (CLBs) allows for advanced customization and implementation of complex digital logic designs.

Technology Used

CMOS - The use of CMOS technology in this FPGA ensures low power consumption, high speed, and improved stability, making it an efficient choice.

No. of Inputs

100 - With a generous number of inputs, this FPGA can handle a wide range of input signals, enabling versatile integration and compatibility.

Package Shape

SQUARE - The square package shape provides ease of handling and installation, along with efficient use of space on circuit boards.

Form Of Terminal

BALL - The ball form terminals offer reliable electrical connections and enhanced solderability, ensuring secure and robust interconnection within the system.

Nominal Supply Voltage (V)

1.2 - The nominal supply voltage of 1.2V ensures stable and efficient operation, optimizing power consumption and facilitating compatibility with other components.

Power Supplies (V)

1.2,2.5/3.3 - The availability of multiple power supply options allows for flexibility in system design, accommodating different voltage requirements of various components.

No. of Terminals

196 - The numerous terminals enable easy connectivity with other devices or circuitry, facilitating integration and enhancing the versatility of the FPGA.

Programmable IC Type

FIELD PROGRAMMABLE GATE ARRAY - Being a field-programmable device, this FPGA offers the advantage of reconfigurability, allowing for easy updates and modifications without requiring replacement.

Package Style (Meter)

GRID ARRAY, THIN PROFILE, FINE PITCH - The grid array, thin profile, and fine pitch package style ensures efficient use of space on a circuit board and allows for high-density integration.

Minimum Supply Voltage

1.14 V - The low minimum supply voltage enhances power efficiency and enables operation in low-power applications, providing versatility in system design.

Maximum Operating Temperature

85 °C - With a high maximum operating temperature, this FPGA can withstand challenging conditions, ensuring reliability and robustness in various environments.

Pitch Of Terminal

0.5 mm - The small pitch distance between terminals allows for higher-density interconnections, enabling efficient integration in space-constrained designs.

Maximum Combinatorial Delay of a CLB

0.26 ns - The low maximum combinatorial delay of a Configurable Logic Block ensures fast and efficient processing of logic functions, enhancing overall system performance.

Organization

715 CLBS - The organized structure with 715 Configurable Logic Blocks facilitates easy implementation and management of complex logic designs, providing flexibility and scalability.

Minimum Operating Temperature

0 °C - The FPGA's ability to operate reliably in low-temperature environments makes it suitable for a wide range of applications and ensures versatility in system deployment.

Finishing Of Terminal Used

TIN SILVER COPPER - The use of Tin Silver Copper finishing on the terminal enhances conductivity, provides corrosion resistance, and ensures long-term durability of the FPGA.

Position Of Terminal

BOTTOM - The terminal's bottom positioning allows for convenient and efficient PCB layout and assembly, optimizing space utilization and simplifying integration.

Moisture Sensitivity Level (MSL)

3 - With a moisture sensitivity level of 3, this FPGA has moderate tolerance to moisture exposure during manufacturing, transportation, and storage, ensuring reliable performance.

Maximum Seated Height

1.1 mm - The compact maximum seated height allows for low-profile integration, making it suitable for applications with space constraints or weight considerations.

Width

8 mm - The narrow width of the FPGA contributes to efficient space utilization on PCBs, enabling compact designs and accommodating tight layouts.

Maximum Clock Frequency

667 MHz - With a high maximum clock frequency, this FPGA can perform rapid computations, enabling real-time processing and driving high-performance applications.

No. of Outputs

100 - Having a generous number of outputs facilitates versatile system integration and enables the FPGA to drive multiple external devices or components simultaneously.

Maximum Time At Peak Reflow Temperature (s)

30 - The ability to withstand a peak reflow temperature for up to 30 seconds enhances the FPGA's resilience during manufacturing processes, ensuring reliable soldering and overall product quality.

Peak Reflow Temperature °C

260 - The high peak reflow temperature capability allows for robust soldering and manufacturing processes, ensuring stable connections and improving the FPGA's overall durability.

Length

8 mm - The compact length of the FPGA contributes to efficient space utilization on printed circuit boards, enabling the design of compact and streamlined systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX9-2CPG196C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

9152

No. of Inputs:

100

No. of Outputs:

100

No. of CLBs:

715

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.26 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

715 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

8 mm

Width:

8 mm

Maximum Seated Height:

1.1 mm

Package Equivalence Code:

BGA196,14X14,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.5 mm

No. of Terminals:

196

Standards

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e8

Qualified:

No

Trade Compliance

XC6SLX9-2CPG196C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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