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XC6SLX9-3CPG196I

Xilinx

XC6SLX9-3CPG196I by Xilinx

The Xilinx XC6SLX9-3CPG196I is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 862 MHz. It operates at temperatures from -40 to 100 °C and is ideal for industrial applications requiring high-speed processing in compact designs.

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Overview

Looking for top-quality Field Programmable Gate Arrays? Look no further than the XC6SLX9-3CPG196I by Xilinx! With a reputation for excellence in FPGA technology, Xilinx delivers cutting-edge solutions for a wide range of applications. From industrial automation to telecommunications, this versatile FPGA offers unmatched performance and reliability. Trust Xilinx to provide you with the tools you need to take your projects to the next level. Elevate your designs with the XC6SLX9-3CPG196I today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and heat resistance for the package.

No. of Logic Cells: 9152

The high number of logic cells allows for complex designs and processing capabilities.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliability under various environmental conditions.

Maximum Clock Frequency: 862 MHz

The high clock frequency allows for fast processing speeds and efficient performance.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX9-3CPG196I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

9152

No. of Inputs:

106

No. of Outputs:

106

No. of CLBs:

715

Maximum Clock Frequency:

862 MHz

CLB Maximum Delay:

0.21 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

715 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

8 mm

Width:

8 mm

Maximum Seated Height:

1.1 mm

Package Equivalence Code:

BGA196,14X14,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.5 mm

No. of Terminals:

196

Standards

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e8

Qualified:

No

Trade Compliance

XC6SLX9-3CPG196I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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