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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
MPF300TS-FCG784NI by Microchip Technology

MPF300TS-FCG784NI

Microchip Technology

MPF300TS-FCG784NI by Microchip Technology is a 300000 logic cell FPGA with CMOS technology. Featuring 388 inputs and outputs, it operates b/w -40 to 100°C. This programmable IC in a grid array package is ideal for high-performance applications requiring precise voltage control.

FPGA

300000

388

388

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.47 mm

BGA784,28X28,40

Bottom

Ball

1 mm

784

S-PBGA-B784

MPF500T-1FCG784E by Microchip Technology

MPF500T-1FCG784E

Microchip Technology

MPF500T-1FCG784E by Microchip Technology is a CMOS-based FPGA with 481,000 logic cells. It has a package style of grid array and a max supply voltage of 1.03V. This FPGA is commonly used in applications requiring high-performance programmable logic solutions.

FPGA

481000

388

388

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.47 mm

BGA784,28X28,40

Bottom

Ball

1 mm

784

S-PBGA-B784

MPF500T-FCG784E by Microchip Technology

MPF500T-FCG784E

Microchip Technology

MPF500T-FCG784E by Microchip Technology is a FPGA with 481K logic cells, 388 inputs/outputs, CMOS technology, and operates b/w 0-100°C. It features a grid array package style, 784 ball terminals in a square shape, and surface mount capability. Ideal for applications requiring high-speed data processing and complex logic functions in electronic systems.

FPGA

481000

388

388

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.47 mm

BGA784,28X28,40

Bottom

Ball

1 mm

784

S-PBGA-B784

MPF500T-FCG784I by Microchip Technology

MPF500T-FCG784I

Microchip Technology

MPF500T-FCG784I by Microchip Technology is a CMOS FPGA with 481K logic cells, 388 inputs/outputs, and operates b/w -40 to 100°C. It features a grid array package style, square shape, and ball terminals. Ideal for applications requiring high-density programmable logic in compact designs.

FPGA

481000

388

388

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.47 mm

BGA784,28X28,40

Bottom

Ball

1 mm

784

S-PBGA-B784

MPF500TL-FCG784I by Microchip Technology

MPF500TL-FCG784I

Microchip Technology

MPF500TL-FCG784I by Microchip Tech is a FPGA with 481K logic cells, 388 inputs/outputs, CMOS tech, and operates b/w -40 to 100°C. It features a grid array package style, plastic body material, and ball terminals. Ideal for applications requiring high-speed data processing in compact electronic systems.

FPGA

481000

388

388

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.47 mm

BGA784,28X28,40

Bottom

Ball

1 mm

784

S-PBGA-B784

MPF500TLS-FCG784I by Microchip Technology

MPF500TLS-FCG784I

Microchip Technology

MPF500TLS-FCG784I by Microchip Technology is a FPGA with 481K logic cells, 388 inputs/outputs, CMOS technology, and operates b/w -40 to 100°C. It features a grid array package style, plastic/epoxy body material, and ball terminals. Ideal for applications requiring high-density programmable logic solutions.

FPGA

481000

388

388

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.47 mm

BGA784,28X28,40

Bottom

Ball

1 mm

784

S-PBGA-B784

MPF500TS-1FCG784I by Microchip Technology

MPF500TS-1FCG784I

Microchip Technology

MPF500TS-1FCG784I by Microchip Technology is a CMOS FPGA with 481K logic cells, 388 inputs/outputs. It operates b/w -40 to 100°C, has a package size of 29x29mm and uses a grid array style. Ideal for applications requiring high-density programmable logic in compact form factors.

FPGA

481000

388

388

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.47 mm

BGA784,28X28,40

Bottom

Ball

1 mm

784

S-PBGA-B784

MPF500TS-FCG784I by Microchip Technology

MPF500TS-FCG784I

Microchip Technology

MPF500TS-FCG784I by Microchip Tech is a FPGA with 481K logic cells, 388 inputs/outputs, CMOS tech, and operates b/w -40 to 100°C. It has a grid array package style, plastic body material, and uses ball terminals. Ideal for high-performance computing applications requiring programmable ICs in compact form factors.

FPGA

481000

388

388

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.47 mm

BGA784,28X28,40

Bottom

Ball

1 mm

784

S-PBGA-B784

XCKU040-3SFVA784E by Xilinx

XCKU040-3SFVA784E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

530250

520

520

30300

Field Programmable Gate Arrays

30300 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU035-1SFVA784I by Xilinx

XCKU035-1SFVA784I

Xilinx

Xilinx XCKU035-1SFVA784I FPGA features 444343 logic cells, 25391 CLBs, and 520 inputs/outputs. With a package style of grid array, fine pitch, it is ideal for industrial applications requiring high-performance programmable ICs in a compact form factor. Operating b/w -40 to 100°C, this FPGA offers versatility and reliability for various electronic designs.

FPGA

444343

520

520

25391

Field Programmable Gate Arrays

25391 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU035-3SFVA784E by Xilinx

XCKU035-3SFVA784E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

444343

520

520

25391

Field Programmable Gate Arrays

25391 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU040-L1SFVA784I by Xilinx

XCKU040-L1SFVA784I

Xilinx

XCKU040-L1SFVA784I by Xilinx is a PLASTIC/EPOXY FPGA with 530250 logic cells. It has 30300 CLBs, 520 inputs/outputs, and operates at a max temperature of 100°C. This FPGA is commonly used in industrial applications for its high performance and versatility.

FPGA

530250

520

520

30300

Field Programmable Gate Arrays

30300 CLBS

Also Operates at 0.95 V nominal supply

0.9

.88 V

.92 V

0.9 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU040-1SFVA784C by Xilinx

XCKU040-1SFVA784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

530250

520

520

30300

Field Programmable Gate Arrays

30300 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU035-2SFVA784E by Xilinx

XCKU035-2SFVA784E

Xilinx

Xilinx XCKU035-2SFVA784E FPGA features 444343 logic cells, 25391 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing with a max supply voltage of 0.979 V. Package style is grid array, fine pitch, suitable for various industrial uses.

FPGA

444343

520

520

25391

Field Programmable Gate Arrays

25391 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU040-2SFVA784E by Xilinx

XCKU040-2SFVA784E

Xilinx

Xilinx XCKU040-2SFVA784E FPGA offers 530250 logic cells, 30300 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates at supply voltages ranging from 0.922V to 0.979V with a temperature range of 0°C to 100°C.

FPGA

530250

520

520

30300

Field Programmable Gate Arrays

30300 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU035-2SFVA784I by Xilinx

XCKU035-2SFVA784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

444343

520

520

25391

Field Programmable Gate Arrays

25391 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU040-2SFVA784I by Xilinx

XCKU040-2SFVA784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

530250

520

520

30300

Field Programmable Gate Arrays

30300 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU040-1SFVA784I by Xilinx

XCKU040-1SFVA784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

530250

520

520

30300

Field Programmable Gate Arrays

30300 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU035-1SFVA784C by Xilinx

XCKU035-1SFVA784C

Xilinx

Xilinx XCKU035-1SFVA784C FPGA features 444343 logic cells, 25391 CLBs, and 520 inputs/outputs. With a package style of grid array, fine pitch, it's ideal for applications requiring high-performance programmable ICs in a compact form factor. Operating temperature ranges from 0 to 85°C with a max seated height of 3.52mm.

FPGA

444343

520

520

25391

Field Programmable Gate Arrays

25391 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU3P-1SFVB784E by Xilinx

XCKU3P-1SFVB784E

Xilinx

Xilinx XCKU3P-1SFVB784E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing and complex algorithms in industries like aerospace, telecommunications, and automotive. Operating temperature range from 0 to 100 °C with a max supply voltage of 0.876 V makes it versatile for various environments.

FPGA

355950

304

304

20340

20340 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

XCKU3P-1SFVB784I by Xilinx

XCKU3P-1SFVB784I

Xilinx

Xilinx XCKU3P-1SFVB784I FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. With a max supply voltage of 0.876 V and operating temperature range from -40 to 100 °C, it's ideal for industrial applications requiring high-performance programmable ICs in a grid array package style.

FPGA

355950

304

304

20340

20340 CLBS

.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

XCKU3P-2SFVB784I by Xilinx

XCKU3P-2SFVB784I

Xilinx

Xilinx XCKU3P-2SFVB784I FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor with a max operating temperature of 100°C.

FPGA

355950

304

304

20340

20340 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

XCKU3P-L1SFVB784I by Xilinx

XCKU3P-L1SFVB784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

355950

304

304

20340

20340 CLBS

0.72

.698 V

.742 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

XCKU3P-L2SFVB784E by Xilinx

XCKU3P-L2SFVB784E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

355950

304

304

20340

20340 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

XCKU5P-1SFVB784E by Xilinx

XCKU5P-1SFVB784E

Xilinx

Xilinx XCKU5P-1SFVB784E FPGA features 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-speed processing and complex algorithms in industries like telecommunications, aerospace, and automotive due to its fine-pitch grid array package style. Operating temperatures range from 0°C to 100°C with a max supply voltage of 0.876V.

FPGA

474600

304

304

27120

27120 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

XCKU5P-1SFVB784I by Xilinx

XCKU5P-1SFVB784I

Xilinx

Xilinx XCKU5P-1SFVB784I FPGA features 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. With a max supply voltage of 0.876 V, it is ideal for industrial applications requiring high-performance computing in a compact form factor. The package style is grid array with fine pitch terminals, suitable for surface mount assembly processes.

FPGA

474600

304

304

27120

27120 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

XCKU5P-2SFVB784I by Xilinx

XCKU5P-2SFVB784I

Xilinx

Xilinx XCKU5P-2SFVB784I FPGA offers 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a max operating temperature of 100°C. Package style: Grid Array, Fine Pitch; Nominal voltage: 0.85V.

FPGA

474600

304

304

27120

27120 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

XCKU5P-3SFVB784E by Xilinx

XCKU5P-3SFVB784E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

474600

304

304

27120

27120 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

XCKU5P-L1SFVB784I by Xilinx

XCKU5P-L1SFVB784I

Xilinx

Xilinx XCKU5P-L1SFVB784I FPGA features 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. Ideal for industrial applications requiring high-performance computing with a wide operating temperature range from -40 to 100°C. Utilizes a grid array package style with fine pitch terminals for compact designs.

FPGA

474600

304

304

27120

27120 CLBS

It also Operates at 0.85 V

.72

.698 V

.742 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

XCKU5P-L2SFVB784E by Xilinx

XCKU5P-L2SFVB784E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

474600

304

304

27120

27120 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

XCKU3P-2SFVB784E by Xilinx

XCKU3P-2SFVB784E

Xilinx

Xilinx XCKU3P-2SFVB784E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.825V to 0.876V.

FPGA

355950

304

304

20340

20340 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

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XCKU5P-2SFVB784E by Xilinx

XCKU5P-2SFVB784E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

474600

304

304

27120

27120 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

MPF500TS-FC784M by Microchip Technology

MPF500TS-FC784M

Microchip Technology

MPF500TS-FC784M by Microchip Technology is a CMOS FPGA with 481K logic cells, 388 inputs/outputs, and MILITARY-grade temperature rating. It features a GRID ARRAY package style, PLASTIC/EPOXY body material, and operates b/w -55 to 125 °C. Ideal for high-performance applications requiring advanced programmable ICs in compact form factors.

FPGA

481000

388

388

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-55 °C (-67 °F)

125 °C (257 °F)

Military

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.47 mm

BGA784,28X28,40

Bottom

Ball

1 mm

784

S-PBGA-B784

MPF300T-1FCG784I by Microchip Technology

MPF300T-1FCG784I

Microchip Technology

MPF300T-1FCG784I by Microchip Technology is a 300000 logic cell FPGA with CMOS technology. It features 388 inputs and outputs, operates b/w -40 to 100 °C, and has a package style of GRID ARRAY. Ideal for applications requiring high-density programmable logic in compact form factors.

FPGA

300000

388

388

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.47 mm

BGA784,28X28,40

Bottom

Ball

1 mm

784

S-PBGA-B784

MPF500T-1FCG784I by Microchip Technology

MPF500T-1FCG784I

Microchip Technology

MPF500T-1FCG784I by Microchip Tech is a 481K logic cell FPGA with CMOS tech. It has 388 inputs/outputs, operates b/w -40 to 100°C, and uses plastic/epoxy package for surface mount applications.

FPGA

481000

388

388

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.47 mm

BGA784,28X28,40

Bottom

Ball

1 mm

784

S-PBGA-B784

XCAU20P-1SFVB784E by Xilinx

XCAU20P-1SFVB784E

Xilinx

Xilinx XCAU20P-1SFVB784E is a FPGA with 238437 logic cells, 13625 CLBs, and 228 inputs/outputs. It operates b/w -40°C to 100°C, with supply voltage range of 0.825V to 0.876V. Ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

238437

228

228

13625

13625 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

.8 mm

784

S-PBGA-B784

XCAU20P-1SFVB784I by Xilinx

XCAU20P-1SFVB784I

Xilinx

Xilinx XCAU20P-1SFVB784I FPGA offers 238437 logic cells, 13625 CLBs, and 228 inputs/outputs. Ideal for applications requiring high-performance computing with a max operating temperature of 100°C. Package style: Grid Array, Fine Pitch.

FPGA

238437

228

228

13625

13625 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

.8 mm

784

S-PBGA-B784

XCAU20P-2SFVB784E by Xilinx

XCAU20P-2SFVB784E

Xilinx

Xilinx XCAU20P-2SFVB784E FPGA offers 238437 logic cells, 13625 CLBs, and 228 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor with a package style of grid array, fine pitch. Operating temperature range from 0 to 100°C makes it versatile for various industrial uses.

FPGA

238437

228

228

13625

13625 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

.8 mm

784

S-PBGA-B784

XCAU20P-2SFVB784I by Xilinx

XCAU20P-2SFVB784I

Xilinx

Xilinx XCAU20P-2SFVB784I FPGA features 238437 logic cells, 13625 CLBs, and 228 inputs/outputs. With a package style of GRID ARRAY, FINE PITCH, it is ideal for applications requiring high-performance computing in industrial automation and telecommunications sectors. Operating temperature ranges from -40 to 100°C with a low supply voltage of 0.825V.

FPGA

238437

228

228

13625

13625 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

.8 mm

784

S-PBGA-B784