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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC6VLX130T-3FFG784C by Xilinx

XC6VLX130T-3FFG784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS;

FPGA

128000

400

400

1412 MHz

CMOS

Field Programmable Gate Arrays

1,1.2/2.5 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX75T-3FFG784C by Xilinx

XC6VLX75T-3FFG784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

360

360

5820

1412 MHz

0.59 ns

CMOS

Field Programmable Gate Arrays

5820 CLBS

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

2.86 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX195T-3FFG784C by Xilinx

XC6VLX195T-3FFG784C

Xilinx

XC6VLX195T-3FFG784C by Xilinx is a CMOS FPGA with 199680 logic cells, 400 inputs/outputs, and 1412 MHz clock frequency. Ideal for high-performance applications requiring fast processing speeds in fields like telecommunications and aerospace.

FPGA

199680

400

400

1412 MHz

CMOS

Field Programmable Gate Arrays

1,1.2/2.5 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX240T-3FFG784C by Xilinx

XC6VLX240T-3FFG784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

241152

400

400

1412 MHz

CMOS

Field Programmable Gate Arrays

1,1.2/2.5 V

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX195T-3FF784C by Xilinx

XC6VLX195T-3FF784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

199680

400

400

1412 MHz

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

2.86 mm

BGA784,28X28,40

Bottom

Ball

Tin Lead

1 mm

784

S-PBGA-B784

e0

No

XC6VLX130T-1FF784C by Xilinx

XC6VLX130T-1FF784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

400

400

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

2.86 mm

BGA784,28X28,40

Bottom

Ball

Tin Lead

1 mm

784

S-PBGA-B784

e0

No

XC6VLX130T-1FFG784C by Xilinx

XC6VLX130T-1FFG784C

Xilinx

The Xilinx XC6VLX130T-1FFG784C is a FPGA with 128,000 logic cells and 400 inputs/outputs. Operating at a max frequency of 1098 MHz, it uses CMOS technology and has a max supply voltage of 1.05 V. Ideal for applications requiring high-speed processing and programmable ICs in various industries.

FPGA

128000

400

400

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX130T-1FFG784I by Xilinx

XC6VLX130T-1FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

400

400

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX130T-2FF784I by Xilinx

XC6VLX130T-2FF784I

Xilinx

Xilinx XC6VLX130T-2FF784I FPGA features 128000 logic cells, 400 inputs/outputs, and max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with CMOS technology.

FPGA

128000

400

400

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

2.86 mm

BGA784,28X28,40

Bottom

Ball

Tin Lead

1 mm

784

S-PBGA-B784

e0

No

XC6VLX130T-2FFG784C by Xilinx

XC6VLX130T-2FFG784C

Xilinx

Xilinx XC6VLX130T-2FFG784C is a 128000 logic cell FPGA with 400 inputs/outputs, operating at max frequency of 1286 MHz. It uses CMOS technology with supply voltage range of 0.95V to 1.2/2.5V. Ideal for applications requiring high-speed processing and programmable ICs in compact form factor.

FPGA

128000

400

400

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX130T-2FFG784I by Xilinx

XC6VLX130T-2FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

400

400

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX130T-L1FF784I by Xilinx

XC6VLX130T-L1FF784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

400

400

1098 MHz

5.87 ns

CMOS

Field Programmable Gate Arrays

.9

.87 V

.93 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Lead

1 mm

784

S-PBGA-B784

e0

No

XC6VLX130T-L1FFG784I by Xilinx

XC6VLX130T-L1FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

400

400

1098 MHz

5.87 ns

CMOS

Field Programmable Gate Arrays

.9

.87 V

.93 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX195T-1FFG784C by Xilinx

XC6VLX195T-1FFG784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

199680

400

400

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX195T-1FFG784I by Xilinx

XC6VLX195T-1FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

199680

400

400

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX195T-2FFG784C by Xilinx

XC6VLX195T-2FFG784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

199680

400

400

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX195T-2FFG784I by Xilinx

XC6VLX195T-2FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

199680

400

400

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX195T-L1FF784I by Xilinx

XC6VLX195T-L1FF784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

199680

400

400

1098 MHz

5.87 ns

CMOS

Field Programmable Gate Arrays

.9

.87 V

.93 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Lead

1 mm

784

S-PBGA-B784

e0

No

XC6VLX195T-L1FFG784C by Xilinx

XC6VLX195T-L1FFG784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

199680

400

400

1098 MHz

5.87 ns

CMOS

Field Programmable Gate Arrays

.9

.87 V

.93 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX195T-L1FFG784I by Xilinx

XC6VLX195T-L1FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

199680

400

400

1098 MHz

5.87 ns

CMOS

Field Programmable Gate Arrays

.9

.87 V

.93 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX240T-1FF784C by Xilinx

XC6VLX240T-1FF784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

241152

400

400

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

2.86 mm

BGA784,28X28,40

Bottom

Ball

Tin Lead

1 mm

784

S-PBGA-B784

e0

No

XC6VLX240T-1FF784I by Xilinx

XC6VLX240T-1FF784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

241152

400

400

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

2.86 mm

BGA784,28X28,40

Bottom

Ball

Tin Lead

1 mm

784

S-PBGA-B784

e0

No

XC6VLX240T-1FFG784C by Xilinx

XC6VLX240T-1FFG784C

Xilinx

The Xilinx XC6VLX240T-1FFG784C is a CMOS FPGA with 241152 logic cells, 400 inputs/outputs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs in a compact grid array package.

FPGA

241152

400

400

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX240T-1FFG784I by Xilinx

XC6VLX240T-1FFG784I

Xilinx

The Xilinx XC6VLX240T-1FFG784I is a FPGA with 241152 logic cells, 400 inputs/outputs, and max clock frequency of 1098 MHz. It operates at -40 to 100 °C and uses CMOS technology. Ideal for industrial applications requiring high-speed processing in compact designs.

FPGA

241152

400

400

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX240T-2FF784I by Xilinx

XC6VLX240T-2FF784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

241152

400

400

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

2.86 mm

BGA784,28X28,40

Bottom

Ball

Tin Lead

1 mm

784

S-PBGA-B784

e0

No

XC6VLX240T-2FFG784C by Xilinx

XC6VLX240T-2FFG784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

241152

400

400

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX240T-L1FFG784I by Xilinx

XC6VLX240T-L1FFG784I

Xilinx

The Xilinx XC6VLX240T-L1FFG784I is a FPGA with 241152 logic cells, 400 inputs/outputs, and max clock frequency of 1098 MHz. It operates at industrial temperatures and uses CMOS technology. Ideal for applications requiring high-speed processing and programmable logic in compact form factors.

FPGA

241152

400

400

1098 MHz

5.87 ns

CMOS

Field Programmable Gate Arrays

.9

.87 V

.93 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX75T-1FF784C by Xilinx

XC6VLX75T-1FF784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

360

360

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

2.86 mm

BGA784,28X28,40

Bottom

Ball

Tin Lead

1 mm

784

S-PBGA-B784

e0

No

XC6VLX75T-1FFG784C by Xilinx

XC6VLX75T-1FFG784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

360

360

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX75T-1FFG784I by Xilinx

XC6VLX75T-1FFG784I

Xilinx

Xilinx XC6VLX75T-1FFG784I FPGA features 74496 logic cells, 360 inputs/outputs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact 29mm square package with grid array style.

FPGA

74496

360

360

1098 MHz

5.08 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX75T-2FFG784C by Xilinx

XC6VLX75T-2FFG784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

360

360

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VLX75T-2FFG784I by Xilinx

XC6VLX75T-2FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

360

360

1286 MHz

4.29 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VCX130T-1FFG784C by Xilinx

XC6VCX130T-1FFG784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

128000

400

400

10000

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VCX130T-1FFG784I by Xilinx

XC6VCX130T-1FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Length: 29 mm;

FPGA

128000

400

400

10000

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VCX195T-1FFG784I by Xilinx

XC6VCX195T-1FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER;

FPGA

199680

400

400

15600

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VCX195T-2FF784I by Xilinx

XC6VCX195T-2FF784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

199680

400

400

15600

1098 MHz

0.91 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

220 °C (428 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Lead

1 mm

784

S-PBGA-B784

e0

No

XC6VCX195T-2FFG784C by Xilinx

XC6VCX195T-2FFG784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

199680

400

400

15600

1098 MHz

0.91 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VCX240T-1FFG784I by Xilinx

XC6VCX240T-1FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 100 Cel;

FPGA

241152

400

400

18840

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VCX75T-1FFG784C by Xilinx

XC6VCX75T-1FFG784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE;

FPGA

74496

360

360

5820

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VCX75T-1FFG784I by Xilinx

XC6VCX75T-1FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;

FPGA

74496

360

360

5820

1098 MHz

0.79 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

XC6VCX75T-2FFG784I by Xilinx

XC6VCX75T-2FFG784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 1098 MHz;

FPGA

74496

360

360

5820

1098 MHz

0.91 ns

CMOS

Field Programmable Gate Arrays

1

.95 V

1.05 V

1,1.2/2.5,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.1 mm

BGA784,28X28,40

Bottom

Ball

Tin Silver Copper

1 mm

784

S-PBGA-B784

e1

No

MPF200T-1FCG784I by Microchip Technology

MPF200T-1FCG784I

Microchip Technology

MPF200T-1FCG784I by Microchip Tech is a 192K logic cell FPGA with CMOS tech. It has 364 inputs/outputs, operates b/w -40 to 100°C, and uses plastic/epoxy package for SMT applications.

FPGA

192000

364

364

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.47 mm

BGA784,28X28,40

Bottom

Ball

1 mm

784

S-PBGA-B784

MPF300T-1FCG784E by Microchip Technology

MPF300T-1FCG784E

Microchip Technology

MPF300T-1FCG784E by Microchip Tech is a 300K logic cell FPGA with CMOS tech. It has 388 inputs/outputs, operates b/w 0-100°C, and uses plastic/epoxy package for surface mount applications.

FPGA

300000

388

388

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.47 mm

BGA784,28X28,40

Bottom

Ball

1 mm

784

S-PBGA-B784

MPF300T-1FCG784NI by Microchip Technology

MPF300T-1FCG784NI

Microchip Technology

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 388;

FPGA

300000

388

388

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.47 mm

BGA784,28X28,40

Bottom

Ball

1 mm

784

S-PBGA-B784

MPF300T-FCG784NI by Microchip Technology

MPF300T-FCG784NI

Microchip Technology

MPF300T-FCG784NI by Microchip: FPGA with 300K logic cells, 388 inputs/outputs, CMOS tech. Ideal for high-performance applications requiring low power consumption and compact design. Package style: grid array, suitable for surface mount assembly in various electronic devices.

FPGA

300000

388

388

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.47 mm

BGA784,28X28,40

Bottom

Ball

1 mm

784

S-PBGA-B784

MPF300TL-FCG784E by Microchip Technology

MPF300TL-FCG784E

Microchip Technology

MPF300TL-FCG784E by Microchip Technology is a 300000 logic cell FPGA with CMOS technology. It has 388 inputs and outputs, operates b/w 0-100°C, and uses a grid array package style. Ideal for applications requiring high-speed data processing in compact electronic devices.

FPGA

300000

388

388

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.47 mm

BGA784,28X28,40

Bottom

Ball

1 mm

784

S-PBGA-B784

MPF300TLS-FCG784I by Microchip Technology

MPF300TLS-FCG784I

Microchip Technology

MPF300TLS-FCG784I by Microchip is a 300K logic cell FPGA with CMOS tech. It has 388 inputs/outputs, operates b/w -40 to 100°C, and uses plastic/epoxy package for surface mount applications.

FPGA

300000

388

388

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.47 mm

BGA784,28X28,40

Bottom

Ball

1 mm

784

S-PBGA-B784

MPF300TS-1FCG784NI by Microchip Technology

MPF300TS-1FCG784NI

Microchip Technology

MPF300TS-1FCG784NI by Microchip is a CMOS FPGA with 300K logic cells, 388 inputs/outputs, and operates b/w -40 to 100°C. Its grid array package style makes it suitable for applications requiring high-density programmable ICs in compact spaces.

FPGA

300000

388

388

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

29 mm

29 mm

3.47 mm

BGA784,28X28,40

Bottom

Ball

1 mm

784

S-PBGA-B784