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XC6VLX130T-2FFG784C

Xilinx

XC6VLX130T-2FFG784C by Xilinx

Xilinx XC6VLX130T-2FFG784C is a 128000 logic cell FPGA with 400 inputs/outputs, operating at max frequency of 1286 MHz. It uses CMOS technology with supply voltage range of 0.95V to 1.2/2.5V. Ideal for applications requiring high-speed processing and programmable ICs in compact form factor.

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Vyrian

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Modulus Dynamics

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MARBEL Systems

Belgium . 260 parts In-Stock

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Corohmni

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Texas Native Microelectronics

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Kenton Components

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One Stop Electronics

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Overview

Unlock the power of innovation with the XC6VLX130T-2FFG784C by Xilinx. Built by a trusted industry leader, this Field Programmable Gate Array offers unparalleled flexibility and performance for a wide range of applications. With 128000 logic cells and 400 inputs/outputs, this FPGA provides endless possibilities for customization and optimization. Whether you're designing cutting-edge electronics or pushing the boundaries of technology, the XC6VLX130T-2FFG784C delivers unmatched value, reliability, and efficiency to bring your ideas to life. Elevate your projects to new heights with Xilinx's exceptional FPGA technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good mechanical strength and durability, making the FPGA suitable for various applications.

No. of Logic Cells: 128000

Large number of logic cells allow for complex logic designs to be implemented efficiently.

Surface Mount: YES

Surface mount packaging makes it easy to integrate the FPGA onto PCBs and saves space.

Maximum Supply Voltage: 1.05 V

Low maximum supply voltage helps in reducing power consumption and heat dissipation.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity.

No. of Inputs: 400

Abundance of input pins allows for flexible connectivity and input/output configurations.

Package Shape: SQUARE

Square package shape simplifies PCB layout and component placement.

Form Of Terminal: BALL

Ball terminals provide reliable electrical connections and facilitate easy soldering.

Power Supplies (V): 1,1.2/2.5

Multiple power supply options allow the FPGA to be used in various voltage environments.

No. of Terminals: 784

High number of terminals enable versatile connectivity options and signal routing.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, the IC can be reprogrammed and customized for different applications.

Package Style (Meter): GRID ARRAY

Grid array package style offers good thermal performance and signal integrity.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage allows for operation in low power scenarios.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in demanding environmental conditions.

Pitch Of Terminal: 1 mm

Compact terminal pitch enables high density mounting and efficient use of PCB space.

Maximum Combinatorial Delay of a CLB: 4.29 ns

Low combinatorial delay ensures fast logic processing and high performance.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows the FPGA to function in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Tin, silver, and copper finishing on terminals offer good conductivity and corrosion resistance.

Position Of Terminal: BOTTOM

Bottom position of terminals simplifies PCB assembly and routing of signals.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that the FPGA is moderately sensitive to moisture, requiring proper handling during assembly and storage.

Maximum Seated Height: 3.1 mm

Low seated height allows for compact design and integration in space-constrained applications.

Width: 29 mm

Moderate width allows for easy PCB integration and placement of the FPGA alongside other components.

Maximum Clock Frequency: 1286 MHz

High maximum clock frequency enables fast processing and execution of logic operations.

No. of Outputs: 400

Large number of output pins facilitate versatile output configurations and signal routing.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time at peak reflow temperature ensures proper soldering and bonding of the FPGA onto the PCB.

Peak Reflow Temperature °C: 245

High peak reflow temperature allows for reliable solder joints and secure attachment of the FPGA during assembly.

Length: 29 mm

Moderate length provides a balanced form factor for the FPGA and facilitates PCB layout.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6VLX130T-2FFG784C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

128000

No. of Inputs:

400

No. of Outputs:

400

Maximum Clock Frequency:

1286 MHz

CLB Maximum Delay:

4.29 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1,1.2/2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3.1 mm

Package Equivalence Code:

BGA784,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

784

Standards

JESD-30 Code:

S-PBGA-B784

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6VLX130T-2FFG784C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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