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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC6SLX9-2FTG256C by Xilinx

XC6SLX9-2FTG256C

Xilinx

XC6SLX9-2FTG256C by Xilinx is a CMOS-based FPGA with 9152 logic cells and 715 CLBs. It operates at a max clock frequency of 667 MHz and is commonly used in applications requiring programmable ICs for high-speed data processing.

FPGA

9152

186

186

715

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC6SLX9-2FTG256I by Xilinx

XC6SLX9-2FTG256I

Xilinx

Xilinx XC6SLX9-2FTG256I FPGA features 9152 logic cells, 715 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

FPGA

9152

186

186

715

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC6SLX9-3FT256I by Xilinx

XC6SLX9-3FT256I

Xilinx

The Xilinx XC6SLX9-3FT256I is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 862 MHz. It operates at industrial temperatures from -40 to 100°C, suitable for high-performance applications in various industries like telecommunications and automotive.

FPGA

9152

186

186

715

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC6SLX9-3FTG256C by Xilinx

XC6SLX9-3FTG256C

Xilinx

The Xilinx XC6SLX9-3FTG256C is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 862 MHz. It operates at 1.2V nominal voltage and is ideal for applications requiring high-speed processing in compact form factors.

FPGA

9152

186

186

715

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC6SLX9-3FTG256I by Xilinx

XC6SLX9-3FTG256I

Xilinx

Xilinx XC6SLX9-3FTG256I FPGA features 9152 logic cells, 715 CLBs, and max clock frequency of 862 MHz. Ideal for industrial applications requiring high-speed processing, it operates at temperatures ranging from -40 to 100°C with a low profile grid array package style.

FPGA

9152

186

186

715

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC6SLX9-L1FT256I by Xilinx

XC6SLX9-L1FT256I

Xilinx

XC6SLX9-L1FT256I by Xilinx is a FPGA with 9152 logic cells, 715 CLBs, and 186 inputs/outputs. Operating at 1.05V, it offers 0.46ns combinatorial delay per CLB. Ideal for industrial applications requiring high-speed processing in compact designs.

FPGA

9152

186

186

715

0.46 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC6SLX9-L1FTG256C by Xilinx

XC6SLX9-L1FTG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

9152

186

186

715

0.46 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC6SLX9-L1FTG256I by Xilinx

XC6SLX9-L1FTG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

9152

186

186

715

0.46 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XA3S1200E-4FTG256Q by Xilinx

XA3S1200E-4FTG256Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

19512

190

150

2168

1200000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

2168 CLBS, 1200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

XA3S250E-4FTG256Q by Xilinx

XA3S250E-4FTG256Q

Xilinx

XA3S250E-4FTG256Q by Xilinx is a FPGA with 5508 logic cells, 612 CLBs, and 250000 gates. It operates at max frequency of 572 MHz, suitable for automotive applications due to AEC-Q100 screening level. The package style is grid array with low profile, making it ideal for compact designs in harsh environments.

FPGA

5508

172

132

612

250000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

612 CLBS, 250000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

XA3S500E-4FTG256I by Xilinx

XA3S500E-4FTG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

10476

190

149

1164

500000

572 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

1164 CLBS, 500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

85 °C (185 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

LCMXO1200C-3BN256C by Lattice Semiconductor

LCMXO1200C-3BN256C

Lattice Semiconductor

LCMXO1200C-3BN256C by Lattice Semiconductor is a Field Programmable Gate Array (FPGA) with 1200 logic cells, 150 CLBs, and 211 inputs/outputs. It is used for applications requiring programmable ICs in various industries.

FPGA

1200

211

211

150

Field Programmable Gate Arrays

150 CLBS

1.8

1.71 V

3.465 V

1.8/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

No

LCMXO1200C-3BN256I by Lattice Semiconductor

LCMXO1200C-3BN256I

Lattice Semiconductor

LCMXO1200C-3BN256I by Lattice Semiconductor is a 1200 Logic Cells FPGA with 150 CLBs and 211 Inputs/Outputs. Operating at max 100°C, it's ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

FPGA

1200

211

211

150

Field Programmable Gate Arrays

150 CLBS

1.8

1.71 V

3.465 V

1.8/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

No

LCMXO2280C-3BN256C by Lattice Semiconductor

LCMXO2280C-3BN256C

Lattice Semiconductor

LCMXO2280C-3BN256C by Lattice Semiconductor is a Field Programmable Gate Array (FPGA) with 2280 logic cells. It has a max supply voltage of 3.465V and can operate at temperatures up to 85°C. This FPGA is commonly used in applications requiring programmable ICs for various electronic systems.

FPGA

2280

211

211

285

Field Programmable Gate Arrays

285 CLBS

1.8

1.71 V

3.465 V

1.8/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

No

LCMXO2280C-3BN256I by Lattice Semiconductor

LCMXO2280C-3BN256I

Lattice Semiconductor

LCMXO2280C-3BN256I by Lattice Semiconductor is a Field Programmable Gate Array (FPGA) with 2280 logic cells. It has a max supply voltage of 3.465V and can operate in temperatures ranging from -40 to 100°C. This FPGA is suitable for industrial applications requiring programmable ICs with high logic cell count and versatile input/output capabilities.

FPGA

2280

211

211

285

Field Programmable Gate Arrays

285 CLBS

1.8

1.71 V

3.465 V

1.8/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

No

LCMXO2280C-4BN256I by Lattice Semiconductor

LCMXO2280C-4BN256I

Lattice Semiconductor

LCMXO2280C-4BN256I by Lattice Semiconductor is a FPGA with 2280 logic cells, 285 CLBs, and 211 inputs/outputs. It operates at a max voltage of 3.465V and supports supply voltages of 1.8V/3.3V. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

FPGA

2280

211

211

285

Field Programmable Gate Arrays

285 CLBS

1.8

1.71 V

3.465 V

1.8/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

No

LCMXO640C-3BN256I by Lattice Semiconductor

LCMXO640C-3BN256I

Lattice Semiconductor

LCMXO640C-3BN256I by Lattice Semiconductor is a 640 Logic Cells FPGA with 80 CLBs and 159 Inputs/Outputs. Operating at 1.8V, it's ideal for industrial applications requiring high performance in a compact form factor. With a low profile grid array package, it offers flexibility and reliability in demanding environments.

FPGA

640

159

159

80

Field Programmable Gate Arrays

80 CLBS

1.8

1.71 V

3.465 V

1.8/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

BGA256,16X16,32

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

No

XA3S200A-4FTG256I by Xilinx

XA3S200A-4FTG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

4032

195

160

448

200000

667 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

448 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

XA3S200A-4FTG256Q by Xilinx

XA3S200A-4FTG256Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

4032

195

160

448

200000

667 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

448 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

XA3S400A-4FTG256I by Xilinx

XA3S400A-4FTG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

8064

195

160

896

400000

667 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

XA3S400A-4FTG256Q by Xilinx

XA3S400A-4FTG256Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

8064

195

160

896

400000

667 MHz

4.88 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

AEC-Q100

A54SX32-CQ256B by Microsemi

A54SX32-CQ256B

Microsemi

A54SX32-CQ256B by Microsemi is a MIL-STD-883 Class B rated FPGA with 2880 CLBs and 32000 gates. Operating at a max frequency of 205 MHz, it has 246 inputs/outputs and can handle combinatorial delays as low as 1 ns. Ideal for military applications due to its ceramic-metal package body material and wide temperature range from -55°C to 125°C.

FPGA

2880

246

246

2880

32000

205 MHz

1 ns

CMOS

Field Programmable Gate Arrays

2880 CLBS, 32000 Gates

48000 system gates avaiable

3.3

2.97 V

3.63 V

3.3,5 V

-55 °C (-67 °F)

125 °C (257 °F)

Military

Ceramic, Metal-Sealed Cofired

Yes

Flatpack

QFF

Square

36 mm

36 mm

3.06 mm

TPAK256,3SQ,20

Quad

Flat

Tin Lead

.5 mm

256

S-CQFP-F256

e0

No

MIL-STD-883 Class B

A54SX32-CQ256M by Microsemi

A54SX32-CQ256M

Microsemi

A54SX32-CQ256M by Microsemi is a CMOS FPGA with 2880 logic cells and 32000 gates. Operating at up to 205 MHz, it has a max supply voltage of 3.63 V and can withstand temperatures from -55 to 125 °C. Ideal for military applications requiring high-speed processing in compact spaces.

FPGA

2880

246

246

2880

32000

205 MHz

1 ns

CMOS

Field Programmable Gate Arrays

2880 CLBS, 32000 Gates

48000 system gates avaiable

3.3

2.97 V

3.63 V

3.3,5 V

-55 °C (-67 °F)

125 °C (257 °F)

Military

225 °C (437 °F)

20 s

Ceramic, Metal-Sealed Cofired

Yes

Flatpack

QFF

Square

36 mm

36 mm

3.06 mm

TPAK256,3SQ,20

Quad

Flat

Tin/Lead

.5 mm

256

S-CQFP-F256

e0

No

LCMXO3L-1300E-5MG256C by Lattice Semiconductor

LCMXO3L-1300E-5MG256C

Lattice Semiconductor

LCMXO3L-1300E-5MG256C by Lattice Semiconductor is a 160 CLBs FPGA with 256 terminals. It operates b/w 0 to 85 °C and has a supply voltage range of 1.14V to 1.26V. This GRID ARRAY package is ideal for applications requiring fine pitch and low profile components.

FPGA

160

160 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

9 mm

9 mm

1 mm

Bottom

Ball

Tin Silver Copper

.5 mm

256

S-PBGA-B256

e1

LCMXO3L-1300E-5MG256I by Lattice Semiconductor

LCMXO3L-1300E-5MG256I

Lattice Semiconductor

LCMXO3L-1300E-5MG256I by Lattice Semiconductor is a 1300 Logic Cells FPGA with 160 CLBs, 206 Inputs/Outputs. Operating at 1.2V, it's ideal for applications requiring high-density programmable ICs in compact spaces with temp range -40 to +100°C.

FPGA

1300

206

206

160

160 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

9 mm

9 mm

1 mm

Bottom

Ball

Tin Silver Copper

.5 mm

256

S-PBGA-B256

e1

LCMXO3L-1300E-6MG256I by Lattice Semiconductor

LCMXO3L-1300E-6MG256I

Lattice Semiconductor

LCMXO3L-1300E-6MG256I by Lattice Semiconductor is a 1300 Logic Cells FPGA with 160 CLBs and 206 Inputs/Outputs. It operates at 1.2V, has a package style of Grid Array, and is suitable for applications requiring high-density programmable logic solutions in industrial environments.

FPGA

1300

206

206

160

160 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

9 mm

9 mm

1 mm

Bottom

Ball

Tin Silver Copper

.5 mm

256

S-PBGA-B256

e1

LCMXO3L-2100E-5MG256I by Lattice Semiconductor

LCMXO3L-2100E-5MG256I

Lattice Semiconductor

LCMXO3L-2100E-5MG256I by Lattice Semiconductor is a 2100 Logic Cells FPGA with 264 CLBs and 206 Inputs. It operates at a voltage range of 1.14V to 1.26V, suitable for applications requiring high-density programmable logic solutions in compact form factors like IoT devices and industrial automation systems.

FPGA

2100

206

206

264

264 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

9 mm

9 mm

1 mm

Bottom

Ball

Tin Silver Copper

.5 mm

256

S-PBGA-B256

e1

LCMXO3L-4300E-5MG256C by Lattice Semiconductor

LCMXO3L-4300E-5MG256C

Lattice Semiconductor

LCMXO3L-4300E-5MG256C by Lattice Semiconductor is a FPGA with 540 CLBs, operating voltage of 1.14V to 1.26V, and temp range of 0-85°C. Ideal for applications requiring high-density programmable logic in compact form factors like IoT devices and industrial automation systems.

FPGA

540

540 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

9 mm

9 mm

1 mm

Bottom

Ball

Tin Silver Copper

.5 mm

256

S-PBGA-B256

e1

LCMXO3L-4300E-5MG256I by Lattice Semiconductor

LCMXO3L-4300E-5MG256I

Lattice Semiconductor

LCMXO3L-4300E-5MG256I by Lattice Semiconductor is a 4300 Logic Cells FPGA with 540 CLBs, 206 Inputs/Outputs. Operating b/w -40 to 100 °C, it has a supply voltage range of 1.14V to 1.26V. Ideal for applications requiring high-density programmable logic in compact form factors.

FPGA

4300

206

206

540

540 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

9 mm

9 mm

1 mm

Bottom

Ball

Tin Silver Copper

.5 mm

256

S-PBGA-B256

e1

LCMXO3L-4300E-6MG256C by Lattice Semiconductor

LCMXO3L-4300E-6MG256C

Lattice Semiconductor

LCMXO3L-4300E-6MG256C by Lattice Semiconductor is a 540 CLB FPGA with max supply voltage of 1.26V, operating temp up to 85°C, and 0.5mm terminal pitch. Ideal for applications requiring high-density programmable logic in compact form factors like IoT devices and industrial automation systems.

FPGA

540

540 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

9 mm

9 mm

1 mm

Bottom

Ball

Tin Silver Copper

.5 mm

256

S-PBGA-B256

e1

LCMXO3L-4300E-6MG256I by Lattice Semiconductor

LCMXO3L-4300E-6MG256I

Lattice Semiconductor

LCMXO3L-4300E-6MG256I by Lattice Semiconductor is a 4300 Logic Cells FPGA with 540 CLBs, 206 Inputs/Outputs. Operating at -40 to 100 °C, it's ideal for applications requiring high-density programmable ICs in compact form factors. The package features a very thin profile grid array with fine pitch terminals for efficient PCB integration.

FPGA

4300

206

206

540

540 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

9 mm

9 mm

1 mm

Bottom

Ball

Tin Silver Copper

.5 mm

256

S-PBGA-B256

e1

LFXP2-30E-5FTN256I by Lattice Semiconductor

LFXP2-30E-5FTN256I

Lattice Semiconductor

LFXP2-30E-5FTN256I by Lattice Semiconductor is a 29000 logic cell FPGA with 3625 CLBs, operating at max clock frequency of 435 MHz. It uses CMOS technology, has 201 inputs/outputs, and supports supply voltages of 1.14V to 1.26V. Ideal for applications requiring high-speed processing in compact designs.

FPGA

29000

201

201

3625

435 MHz

0.494 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFXP2-30E-6FTN256I by Lattice Semiconductor

LFXP2-30E-6FTN256I

Lattice Semiconductor

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

29000

201

201

3625

435 MHz

0.399 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

40 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFXP2-30E-7FTN256C by Lattice Semiconductor

LFXP2-30E-7FTN256C

Lattice Semiconductor

LFXP2-30E-7FTN256C by Lattice Semiconductor is a 29000 logic cell FPGA with 3625 CLBs, operating at max 435 MHz clock frequency. It uses CMOS technology, has 201 inputs/outputs, and supports supply voltages of 1.14V to 1.26V. Ideal for applications requiring high-speed processing in compact designs.

FPGA

29000

201

201

3625

435 MHz

0.304 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFXP2-5E-5FT256C by Lattice Semiconductor

LFXP2-5E-5FT256C

Lattice Semiconductor

LFXP2-5E-5FT256C by Lattice Semiconductor is a 5000 logic cell FPGA with 172 inputs/outputs, operating at max 435 MHz. It uses CMOS technology, has a package style of grid array, and is suitable for applications requiring high-speed processing in compact designs.

FPGA

5000

172

172

435 MHz

0.494 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

LFXP2-5E-5FTN256C by Lattice Semiconductor

LFXP2-5E-5FTN256C

Lattice Semiconductor

LFXP2-5E-5FTN256C by Lattice Semiconductor is a 5000 logic cell FPGA with 625 CLBs, operating at max 435 MHz. It has 172 inputs/outputs, uses CMOS tech, and supports supply voltages of 1.14V to 1.26V. Ideal for applications requiring high-speed processing in compact designs like IoT devices or communication systems.

FPGA

5000

172

172

625

435 MHz

0.494 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFXP2-5E-6FTN256C by Lattice Semiconductor

LFXP2-5E-6FTN256C

Lattice Semiconductor

LFXP2-5E-6FTN256C by Lattice Semiconductor is a 5000 logic cell FPGA with 625 CLBs, operating at max 1.26V. Ideal for applications requiring high clock frequency up to 435MHz, it features 172 inputs/outputs and uses CMOS technology in a square grid array package.

FPGA

5000

172

172

625

435 MHz

0.399 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFXP2-5E-6FTN256I by Lattice Semiconductor

LFXP2-5E-6FTN256I

Lattice Semiconductor

LFXP2-5E-6FTN256I by Lattice Semiconductor is a 5000 logic cell FPGA with 625 CLBs, operating at max 435 MHz clock frequency. It uses CMOS technology, has 172 inputs/outputs, and supports supply voltages of 1.14V to 1.26V. Ideal for applications requiring high-speed processing in compact designs like IoT devices and communication systems.

FPGA

5000

172

172

625

435 MHz

0.399 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFXP2-8E-5FT256C by Lattice Semiconductor

LFXP2-8E-5FT256C

Lattice Semiconductor

LFXP2-8E-5FT256C by Lattice Semiconductor is a 8000 logic cell FPGA with max. clock freq. of 435MHz, operating temp. up to 85°C, and 201 inputs/outputs for versatile applications in electronics design requiring high-speed processing and programmable ICs in compact form factors.

FPGA

8000

201

201

435 MHz

0.494 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

LFXP2-8E-5FTN256I by Lattice Semiconductor

LFXP2-8E-5FTN256I

Lattice Semiconductor

LFXP2-8E-5FTN256I by Lattice Semiconductor is a 1.2V FPGA with 8000 logic cells, 1000 CLBs, and max clock freq of 435MHz. Ideal for applications requiring high-speed processing in compact designs due to its small form factor and low power consumption.

FPGA

8000

201

201

1000

435 MHz

0.494 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFXP2-8E-6FT256I by Lattice Semiconductor

LFXP2-8E-6FT256I

Lattice Semiconductor

LFXP2-8E-6FT256I by Lattice Semiconductor is a 8000 logic cell FPGA with max. clock freq. of 435MHz, 201 inputs/outputs, and 0.399ns combinatorial delay. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems due to its advanced CMOS technology and low power consumption at 1.2V nominal voltage.

FPGA

8000

201

201

435 MHz

0.399 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

LFXP2-8E-6FTN256C by Lattice Semiconductor

LFXP2-8E-6FTN256C

Lattice Semiconductor

LFXP2-8E-6FTN256C by Lattice Semiconductor is a 8000 logic cell FPGA with 1000 CLBs, 201 inputs/outputs, and max clock freq of 435 MHz. It operates at 1.2V, CMOS tech, in a plastic package suitable for various applications requiring high-speed processing and programmable ICs.

FPGA

8000

201

201

1000

435 MHz

0.399 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFXP2-8E-6FTN256I by Lattice Semiconductor

LFXP2-8E-6FTN256I

Lattice Semiconductor

LFXP2-8E-6FTN256I by Lattice Semiconductor is a 8000 Logic Cells FPGA with 1000 CLBs, operating at max 435 MHz clock frequency. It uses CMOS technology and has 201 inputs/outputs, suitable for applications requiring high-speed processing in industrial automation and telecommunications.

FPGA

8000

201

201

1000

435 MHz

0.399 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

LFXP2-8E-7FTN256C by Lattice Semiconductor

LFXP2-8E-7FTN256C

Lattice Semiconductor

LFXP2-8E-7FTN256C by Lattice Semiconductor is a 8000 logic cell FPGA with a max clock frequency of 435 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities.

FPGA

8000

201

201

1000

435 MHz

0.304 ns

CMOS

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2.1 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC2V1000-4FG256I by Xilinx

XC2V1000-4FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 2 mm;

FPGA

11520

172

172

1280

1000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2V1000-5FG256C by Xilinx

XC2V1000-5FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

11520

172

172

1280

1000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2V1000-5FG256I by Xilinx

XC2V1000-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

11520

172

172

1280

1000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2V250-4FG256I by Xilinx

XC2V250-4FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Pitch Of Terminal: 1 mm;

FPGA

3456

172

172

384

250000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 250000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No