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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC2V250-5FG256I by Xilinx

XC2V250-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: .39 ns;

FPGA

3456

172

172

384

250000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 250000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2V250-6FG256C by Xilinx

XC2V250-6FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

3456

172

172

384

250000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 250000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2V40-4FG256I by Xilinx

XC2V40-4FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

576

88

88

64

40000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

64 CLBS, 40000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2V40-5FG256I by Xilinx

XC2V40-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of Outputs: 88;

FPGA

576

88

88

64

40000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

64 CLBS, 40000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2V500-4FG256I by Xilinx

XC2V500-4FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Organization: 768 CLBS, 500000 GATES;

FPGA

6912

172

172

768

500000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

768 CLBS, 500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2V500-5FG256I by Xilinx

XC2V500-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.425 V;

FPGA

6912

172

172

768

500000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

768 CLBS, 500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2V80-4FG256I by Xilinx

XC2V80-4FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 120;

FPGA

1152

120

120

128

80000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

128 CLBS, 80000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2V80-5FG256I by Xilinx

XC2V80-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1.5,1.5/3.3,3.3;

FPGA

1152

120

120

128

80000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

128 CLBS, 80000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2VP2-6FG256C by Xilinx

XC2VP2-6FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

3168

140

140

352

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

352 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2VP2-6FG256I by Xilinx

XC2VP2-6FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 225;

FPGA

3168

140

140

352

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

352 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2VP4-6FG256I by Xilinx

XC2VP4-6FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Width: 17 mm;

FPGA

6768

140

140

752

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

752 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2S100E-6FT256C by Xilinx

XC2S100E-6FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

2700

202

202

600

37000

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

600 CLBS, 37000 Gates

Maximum usable gates = 100000

1.8

1.71 V

1.89 V

1.5/3.3,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Commercial Extended

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2S150E-6FT256I by Xilinx

XC2S150E-6FT256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;

FPGA

3888

263

263

864

52000

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

864 CLBS, 52000 Gates

Maximum usable gates = 150000

1.8

1.71 V

1.89 V

1.5/3.3,1.8 V

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XCS40XL-4BG256I by Xilinx

XCS40XL-4BG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

1862

205

205

784

13000

217 MHz

1.1 ns

CMOS

Field Programmable Gate Arrays

784 CLBS, 13000 Gates

Maximum usable gates 40000

3.3

3 V

3.6 V

3.3 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.55 mm

BGA256,20X20,50

Bottom

Ball

Tin/Lead (Sn63Pb37)

1.27 mm

256

S-PBGA-B256

e0

No

XC2VP2-5FG256C by Xilinx

XC2VP2-5FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

3168

140

140

352

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

352 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2VP2-5FG256I by Xilinx

XC2VP2-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Technology Used: CMOS;

FPGA

3168

140

140

352

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

352 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2VP4-5FG256C by Xilinx

XC2VP4-5FG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

6768

140

140

752

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

752 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2VP4-5FG256I by Xilinx

XC2VP4-5FG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.575 V;

FPGA

6768

140

140

752

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

752 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC2S400E-6FT256C by Xilinx

XC2S400E-6FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

10800

410

410

2400

145000

357 MHz

0.47 ns

CMOS

Field Programmable Gate Arrays

2400 CLBS, 145000 Gates

Maximum usable gates = 400000

1.8

1.71 V

1.89 V

1.2/3.6,1.8 V

0 °C (32 °F)

85 °C (185 °F)

Other

240 °C (464 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

256

S-PBGA-B256

e0

No

XC3S1000-4FT256C by Xilinx

XC3S1000-4FT256C

Xilinx

The Xilinx XC3S1000-4FT256C FPGA features 17280 logic cells, 1920 CLBs, and 1000000 equivalent gates. With a max clock frequency of 630 MHz, it is ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.

FPGA

17280

173

173

1920

1000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S1000-4FT256I by Xilinx

XC3S1000-4FT256I

Xilinx

The Xilinx XC3S1000-4FT256I is a FPGA with 17280 logic cells, 1920 CLBs, and 1000000 equivalent gates. It operates at a max clock frequency of 630 MHz and has a combinatorial delay of 0.61 ns per CLB. Ideal for applications requiring high-speed processing and complex logic functions in compact designs.

FPGA

17280

173

173

1920

1000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S1000-5FT256C by Xilinx

XC3S1000-5FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

17280

173

173

1920

1000000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S200-4FT256C by Xilinx

XC3S200-4FT256C

Xilinx

The Xilinx XC3S200-4FT256C FPGA features 4320 logic cells, 480 CLBs, and 200000 equivalent gates. With a max clock frequency of 630 MHz, it is ideal for applications requiring high-speed processing such as telecommunications and signal processing. The package style is grid array with low profile design for compact integration in electronic systems.

FPGA

4320

173

173

480

200000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

480 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S200-4FT256I by Xilinx

XC3S200-4FT256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Width: 17 mm;

FPGA

4320

173

173

480

200000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

480 CLBS, 200000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S400-4FT256C by Xilinx

XC3S400-4FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

8064

173

173

896

400000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S400-4FT256I by Xilinx

XC3S400-4FT256I

Xilinx

Xilinx XC3S400-4FT256I FPGA features 8064 logic cells, 896 CLBs, and 400000 equivalent gates. With a max clock frequency of 630 MHz, it is ideal for industrial applications requiring high-speed processing in a compact package. Operating temperature ranges from -40 to 100°C with low profile grid array packaging.

FPGA

8064

173

173

896

400000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S400-5FT256C by Xilinx

XC3S400-5FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

8064

173

173

896

400000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

896 CLBS, 400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S1400A-4FT256I by Xilinx

XC3S1400A-4FT256I

Xilinx

Xilinx XC3S1400A-4FT256I FPGA offers 25344 logic cells, 2816 CLBs, and 1400000 gates. With a max clock frequency of 667 MHz, it's ideal for industrial applications requiring high-speed processing in a compact form factor. Operating b/w -40 to 100°C, this FPGA is suitable for various electronic systems.

FPGA

25344

161

148

2816

1400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S1400A-4FTG256I by Xilinx

XC3S1400A-4FTG256I

Xilinx

Xilinx XC3S1400A-4FTG256I is a FPGA with 25344 logic cells, 2816 CLBs, and 1400000 gates. Operating at max frequency of 667 MHz, it's ideal for industrial applications requiring high-speed processing in a temperature range of -40 to 100°C. Package style: Grid Array, Low Profile.

FPGA

25344

161

148

2816

1400000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S1400A-5FTG256C by Xilinx

XC3S1400A-5FTG256C

Xilinx

The Xilinx XC3S1400A-5FTG256C is a FPGA with 25344 logic cells, 2816 CLBs, and 1400000 gates. It operates at max frequency of 770 MHz, ideal for high-speed applications like signal processing and telecommunications due to its low profile grid array package style. With a combinatorial delay of 0.62 ns per CLB, it offers efficient performance in various electronic systems.

FPGA

25344

161

148

2816

1400000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

2816 CLBS, 1400000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC3S700A-4FT256I by Xilinx

XC3S700A-4FT256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

13248

161

148

1472

700000

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC3S700A-5FTG256C by Xilinx

XC3S700A-5FTG256C

Xilinx

Xilinx XC3S700A-5FTG256C FPGA offers 13248 logic cells, 1472 CLBs, and 700000 gates. Ideal for applications requiring high clock frequency up to 770 MHz, with a max operating temperature of 85°C. Package style: Grid Array, low profile; technology: CMOS; suitable for various electronic designs.

FPGA

13248

161

148

1472

700000

770 MHz

0.62 ns

CMOS

Field Programmable Gate Arrays

1472 CLBS, 700000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC2V1000-4FGG256C by Xilinx

XC2V1000-4FGG256C

Xilinx

The Xilinx XC2V1000-4FGG256C is a FPGA with 11520 logic cells, 1280 CLBs, and 1000000 equivalent gates. It operates at a max clock frequency of 650 MHz and has a combinatorial delay of 0.44 ns per CLB. Ideal for applications requiring high-speed processing and complex logic functions in electronic systems.

FPGA

11520

172

172

1280

1000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

XC2V1000-4FGG256I by Xilinx

XC2V1000-4FGG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;

FPGA

11520

172

172

1280

1000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

XC2V1000-5FGG256C by Xilinx

XC2V1000-5FGG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

11520

172

172

1280

1000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

XC2V1000-5FGG256I by Xilinx

XC2V1000-5FGG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.425 V;

FPGA

11520

172

172

1280

1000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

XC2V1000-6FGG256C by Xilinx

XC2V1000-6FGG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

11520

172

172

1280

1000000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

1280 CLBS, 1000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

XC2V250-4FGG256C by Xilinx

XC2V250-4FGG256C

Xilinx

XC2V250-4FGG256C by Xilinx is a FPGA with 3456 logic cells, 384 CLBs, and 250000 equivalent gates. It operates at max frequency of 650 MHz and has 172 inputs/outputs. Ideal for applications requiring high-speed processing in electronics and telecommunications industries.

FPGA

3456

172

172

384

250000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 250000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

XC2V250-4FGG256I by Xilinx

XC2V250-4FGG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;

FPGA

3456

172

172

384

250000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 250000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

XC2V250-5FGG256C by Xilinx

XC2V250-5FGG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

3456

172

172

384

250000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 250000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

XC2V250-5FGG256I by Xilinx

XC2V250-5FGG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Length: 17 mm;

FPGA

3456

172

172

384

250000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 250000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

XC2V250-6FGG256C by Xilinx

XC2V250-6FGG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

3456

172

172

384

250000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

384 CLBS, 250000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

XC2V40-4FGG256C by Xilinx

XC2V40-4FGG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

576

88

88

64

40000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

64 CLBS, 40000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

XC2V40-4FGG256I by Xilinx

XC2V40-4FGG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; No. of Equivalent Gates: 40000;

FPGA

576

88

88

64

40000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

64 CLBS, 40000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

XC2V40-5FGG256C by Xilinx

XC2V40-5FGG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

576

88

88

64

40000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

64 CLBS, 40000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

XC2V40-5FGG256I by Xilinx

XC2V40-5FGG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FPGA

576

88

88

64

40000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

64 CLBS, 40000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

XC2V40-6FGG256C by Xilinx

XC2V40-6FGG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

576

88

88

64

40000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

64 CLBS, 40000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No

XC2V500-4FGG256C by Xilinx

XC2V500-4FGG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FPGA

6912

172

172

768

500000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

768 CLBS, 500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

17 mm

17 mm

2 mm

BGA256,16X16,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

256

S-PBGA-B256

e1

No