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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC6SLX25-N3FTG256I by Xilinx

XC6SLX25-N3FTG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

24051

186

186

1879

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

1879 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC6SLX9-N3FT256C by Xilinx

XC6SLX9-N3FT256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

9152

186

186

715

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC6SLX9-N3FT256I by Xilinx

XC6SLX9-N3FT256I

Xilinx

Xilinx XC6SLX9-N3FT256I FPGA features 9152 logic cells, 715 CLBs, and max clock frequency of 806 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

FPGA

9152

186

186

715

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

No

XC6SLX9-N3FTG256C by Xilinx

XC6SLX9-N3FTG256C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;

FPGA

9152

186

186

715

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

715 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

No

XC7A100T-L1FTG256I by Xilinx

XC7A100T-L1FTG256I

Xilinx

Xilinx XC7A100T-L1FTG256I is a FPGA with 101440 logic cells, 7925 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

FPGA

101440

300

300

7925

1098 MHz

1.27 ns

7925 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

XC7A15T-1FTG256I by Xilinx

XC7A15T-1FTG256I

Xilinx

Xilinx XC7A15T-1FTG256I is a FPGA with 16640 logic cells, 1300 CLBs, and 250 inputs/outputs. Operating at up to 1098 MHz, it's ideal for industrial applications requiring high-speed processing in a compact form factor. With a low profile grid array package and wide temperature range (-40 to 100°C), it offers versatility in various environments.

FPGA

16640

250

250

1300

1098 MHz

1.27 ns

1300 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

XC7A15T-2FTG256C by Xilinx

XC7A15T-2FTG256C

Xilinx

The Xilinx XC7A15T-2FTG256C is a FPGA with 16640 logic cells, 1300 CLBs, and operates at a max frequency of 1286 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact form factor. With a low profile grid array package style, it offers versatility in various electronic designs.

FPGA

16640

250

250

1300

1286 MHz

1.05 ns

1300 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

XC7A15T-2FTG256I by Xilinx

XC7A15T-2FTG256I

Xilinx

Xilinx XC7A15T-2FTG256I FPGA offers 16640 logic cells, 1300 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and low power consumption. Package style: Grid Array, Low Profile, Fine Pitch.

FPGA

16640

250

250

1300

1286 MHz

1.05 ns

1300 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

XC7A15T-3FTG256E by Xilinx

XC7A15T-3FTG256E

Xilinx

The Xilinx XC7A15T-3FTG256E is a FPGA with 16640 logic cells, 1300 CLBs, and max clock frequency of 1412 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

16640

250

250

1300

1412 MHz

0.94 ns

1300 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

XC7A15T-L1FTG256I by Xilinx

XC7A15T-L1FTG256I

Xilinx

Xilinx XC7A15T-L1FTG256I is a FPGA with 16640 logic cells, 1300 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in compact designs due to its low profile grid array package and fine pitch terminals.

FPGA

16640

250

250

1300

1098 MHz

1.27 ns

1300 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

XC7A15T-L2FTG256E by Xilinx

XC7A15T-L2FTG256E

Xilinx

The Xilinx XC7A15T-L2FTG256E is a FPGA with 16640 logic cells, 1300 CLBs, and max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation due to its low profile grid array package style.

FPGA

16640

250

250

1300

1098 MHz

1.51 ns

1300 CLBS

Also Operates at 1 V nominal supply

0.9

.87 V

.93 V

0 °C (32 °F)

100 °C (212 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

XC7A35T-L1FTG256I by Xilinx

XC7A35T-L1FTG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

33280

250

250

2600

1098 MHz

1.27 ns

2600 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

XC7A50T-L1FTG256I by Xilinx

XC7A50T-L1FTG256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;

FPGA

52160

250

250

4075

1098 MHz

1.27 ns

4075 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

17 mm

17 mm

1.55 mm

BGA256,16X16,40

Bottom

Ball

Tin Silver Copper

1 mm

256

S-PBGA-B256

e1

XC7A100T-2FT256I by Xilinx

XC7A100T-2FT256I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

101440

170

170

7925

1.05 ns

7925 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile

LBGA

Square

17 mm

17 mm

1.55 mm

Bottom

Ball

Tin Lead

1 mm

256

S-PBGA-B256

e0

LCMXO3LF-1300C-6BG256C by Lattice Semiconductor

LCMXO3LF-1300C-6BG256C

Lattice Semiconductor

LCMXO3LF-1300C-6BG256C by Lattice Semiconductor is a 160 CLBs FPGA with max supply voltage of 3.465V and package style GRID ARRAY, ideal for applications requiring low profile, fine pitch solutions in electronics design.

FPGA

160

160 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3LF-1300C-6BG256I by Lattice Semiconductor

LCMXO3LF-1300C-6BG256I

Lattice Semiconductor

LCMXO3LF-1300C-6BG256I by Lattice Semiconductor is a 1300 Logic Cells FPGA with 160 CLBs, 206 Inputs/Outputs. It operates at 2.375-3.465V, -40 to 100°C, in PLASTIC/EPOXY package. Ideal for applications requiring high-performance and low-profile grid array FPGAs.

FPGA

1300

206

206

160

160 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3LF-1300E-5MG256C by Lattice Semiconductor

LCMXO3LF-1300E-5MG256C

Lattice Semiconductor

LCMXO3LF-1300E-5MG256C by Lattice Semiconductor is a 160 CLBs FPGA with 1.2V nominal voltage, 0.5mm terminal pitch, and 85°C max operating temp. Ideal for applications requiring high-density programmable logic in compact form factors like IoT devices and industrial automation systems.

FPGA

160

160 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

9 mm

9 mm

1 mm

Bottom

Ball

Tin Silver Copper

.5 mm

256

S-PBGA-B256

e1

LCMXO3LF-2100C-5BG256C by Lattice Semiconductor

LCMXO3LF-2100C-5BG256C

Lattice Semiconductor

LCMXO3LF-2100C-5BG256C by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 264 CLBs. It operates at a voltage range of 2.375V to 3.465V and has a temperature range of 0°C to 85°C. This FPGA is suitable for applications requiring low power consumption and high flexibility in circuit design.

FPGA

264

264 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3LF-2100C-5BG256I by Lattice Semiconductor

LCMXO3LF-2100C-5BG256I

Lattice Semiconductor

LCMXO3LF-2100C-5BG256I by Lattice Semiconductor is a 2100 Logic Cell FPGA with 264 CLBs and 206 Inputs/Outputs. It operates at a voltage range of 2.375V to 3.465V, suitable for applications requiring high-speed processing and low power consumption in industrial automation and telecommunications sectors.

FPGA

2100

206

206

264

264 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3LF-2100C-6BG256C by Lattice Semiconductor

LCMXO3LF-2100C-6BG256C

Lattice Semiconductor

LCMXO3LF-2100C-6BG256C by Lattice Semiconductor is a FPGA with 264 CLBs, operating voltage range of 2.375V to 3.465V, and temp range of 0-85°C. Ideal for applications requiring low profile, fine pitch grid array packages like IoT devices and industrial automation systems.

FPGA

264

264 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3LF-2100C-6BG256I by Lattice Semiconductor

LCMXO3LF-2100C-6BG256I

Lattice Semiconductor

LCMXO3LF-2100C-6BG256I by Lattice Semiconductor is a 2100 Logic Cells FPGA with 264 CLBs and 206 Inputs/Outputs. It operates b/w -40 to 100 °C, has a supply voltage range of 2.375V to 3.465V, and is ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

2100

206

206

264

264 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3LF-4300C-6BG256C by Lattice Semiconductor

LCMXO3LF-4300C-6BG256C

Lattice Semiconductor

LCMXO3LF-4300C-6BG256C by Lattice Semiconductor is a 540 CLBs FPGA with max supply voltage of 3.465V and min operating temp of 0°C. Ideal for applications requiring low profile, fine pitch grid array packages in electronics industry.

FPGA

540

540 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3LF-4300C-6BG256I by Lattice Semiconductor

LCMXO3LF-4300C-6BG256I

Lattice Semiconductor

LCMXO3LF-4300C-6BG256I by Lattice Semiconductor is a 540 CLBs FPGA with max supply voltage of 3.465V and min operating temp of -40°C. Ideal for industrial applications, it features a grid array package style with 0.8mm terminal pitch for high-performance electronic designs.

FPGA

540

540 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3LF-4300E-5MG256C by Lattice Semiconductor

LCMXO3LF-4300E-5MG256C

Lattice Semiconductor

LCMXO3LF-4300E-5MG256C by Lattice Semiconductor is a 540 CLB FPGA with max supply voltage of 1.26V, suitable for applications requiring high performance in a compact form factor. With a package style of GRID ARRAY and very thin profile, it operates b/w 0 to 85°C temperatures, making it ideal for various industrial and consumer electronics projects.

FPGA

540

540 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

9 mm

9 mm

1 mm

Bottom

Ball

Tin Silver Copper

.5 mm

256

S-PBGA-B256

e1

LCMXO3LF-6900C-5BG256C by Lattice Semiconductor

LCMXO3LF-6900C-5BG256C

Lattice Semiconductor

LCMXO3LF-6900C-5BG256C by Lattice Semiconductor is a 2.5V FPGA with 858 CLBs, 0.8mm terminal pitch, and 85°C max operating temp. Ideal for applications requiring low profile, fine pitch grid arrays like IoT devices and industrial automation systems.

FPGA

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3LF-6900C-5BG256I by Lattice Semiconductor

LCMXO3LF-6900C-5BG256I

Lattice Semiconductor

LCMXO3LF-6900C-5BG256I by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 6900 logic cells, 858 CLBs, and 206 inputs/outputs. It operates b/w -40 to 100 °C and has a low profile grid array package suitable for various electronic applications.

FPGA

6900

206

206

858

858 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3LF-6900E-5MG256C by Lattice Semiconductor

LCMXO3LF-6900E-5MG256C

Lattice Semiconductor

LCMXO3LF-6900E-5MG256C by Lattice Semiconductor is a 1.2V FPGA with 858 CLBs, 0.5mm terminal pitch, and 85°C max operating temp. Ideal for applications requiring high-density programmable logic in compact form factors like IoT devices and industrial automation systems.

FPGA

858

858 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

9 mm

9 mm

1 mm

Bottom

Ball

Tin Silver Copper

.5 mm

256

S-PBGA-B256

e1

LCMXO3LF-6900E-5MG256I by Lattice Semiconductor

LCMXO3LF-6900E-5MG256I

Lattice Semiconductor

LCMXO3LF-6900E-5MG256I by Lattice Semiconductor is a 6900 Logic Cells FPGA with 858 CLBs and 206 Inputs/Outputs. It operates b/w -40 to 100 °C, has a supply voltage range of 1.14V to 1.26V, and features a GRID ARRAY package suitable for various applications in electronics design.

FPGA

6900

206

206

858

858 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

9 mm

9 mm

1 mm

Bottom

Ball

Tin Silver Copper

.5 mm

256

S-PBGA-B256

e1

LCMXO3LF-6900E-6MG256C by Lattice Semiconductor

LCMXO3LF-6900E-6MG256C

Lattice Semiconductor

LCMXO3LF-6900E-6MG256C by Lattice Semiconductor is a 1.2V FPGA with 858 CLBs, 0.5mm terminal pitch, and 85°C max operating temp. Ideal for applications requiring high-density programmable logic in compact form factors like IoT devices and industrial automation systems.

FPGA

858

858 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

9 mm

9 mm

1 mm

Bottom

Ball

Tin Silver Copper

.5 mm

256

S-PBGA-B256

e1

LCMXO3L-9400C-5BG256C by Lattice Semiconductor

LCMXO3L-9400C-5BG256C

Lattice Semiconductor

LCMXO3L-9400C-5BG256C by Lattice Semiconductor is a 1175 CLB FPGA with max supply voltage of 3.465V and operating temp up to 85°C. Ideal for applications requiring low profile, fine pitch grid arrays in plastic/epoxy packages.

FPGA

1175

1175 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3LF-9400C-5BG256I by Lattice Semiconductor

LCMXO3LF-9400C-5BG256I

Lattice Semiconductor

LCMXO3LF-9400C-5BG256I by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 9400 logic cells, 1175 CLBs, and 206 inputs/outputs. It operates b/w -40 to 100 °C and has a max supply voltage of 3.465 V. Ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

9400

206

206

1175

1175 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3LF-9400C-6BG256I by Lattice Semiconductor

LCMXO3LF-9400C-6BG256I

Lattice Semiconductor

LCMXO3LF-9400C-6BG256I by Lattice Semiconductor is a 9400 Logic Cells FPGA with 1175 CLBs and 206 Inputs/Outputs. It operates b/w -40 to 100°C, has a supply voltage range of 2.375V to 3.465V, and uses a GRID ARRAY package style. Ideal for applications requiring high-performance programmable ICs in compact form factors.

FPGA

9400

206

206

1175

1175 CLBS

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.7 mm

Bottom

Ball

Tin Silver Copper

.8 mm

256

S-PBGA-B256

e1

LCMXO3LF-9400E-5MG256I by Lattice Semiconductor

LCMXO3LF-9400E-5MG256I

Lattice Semiconductor

LCMXO3LF-9400E-5MG256I by Lattice Semiconductor is a 9400 Logic Cells FPGA with 1175 CLBs and 206 Inputs/Outputs. Operating at 1.2V, it's ideal for applications requiring high-density programmable ICs in compact spaces with temperatures ranging from -40 to 100°C.

FPGA

9400

206

206

1175

1175 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

9 mm

9 mm

1 mm

Bottom

Ball

Tin Silver Copper

.5 mm

256

S-PBGA-B256

e1

LCMXO3LF-9400E-6MG256I by Lattice Semiconductor

LCMXO3LF-9400E-6MG256I

Lattice Semiconductor

LCMXO3LF-9400E-6MG256I by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 9400 logic cells, 1175 CLBs, and 206 inputs/outputs. It operates b/w -40 to 100 °C and has a supply voltage range of 1.14V to 1.26V. Ideal for applications requiring high-density programmable logic solutions in compact spaces.

FPGA

9400

206

206

1175

1175 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Very Thin Profile, Fine Pitch

VFBGA

Square

9 mm

9 mm

1 mm

Bottom

Ball

Tin Silver Copper

.5 mm

256

S-PBGA-B256

e1

10CL006YU256C8G by Intel

10CL006YU256C8G

Intel

Intel 10CL006YU256C8G is a FPGA with 392 CLBs, operating voltage range of 1.15V to 1.25V, and max temp of 85°C. Ideal for applications requiring high-speed data processing like telecommunications, automotive systems, and industrial automation due to its programmable nature and grid array package style.

FPGA

392

392 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

Bottom

Ball

256

S-PBGA-B256

10CL006YU256A7G by Intel

10CL006YU256A7G

Intel

The Intel 10CL006YU256A7G is a FPGA with 392 CLBs, operating voltage of 1.15-1.25V, and temp range -40 to 125°C. Ideal for automotive applications due to its low profile grid array package style and fine pitch terminals.

FPGA

392

392 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL006YU256C6G by Intel

10CL006YU256C6G

Intel

The Intel 10CL006YU256C6G is a field programmable gate array (FPGA) with 392 configurable logic blocks (CLBs). It operates at a nominal voltage of 1.2V and has a max operating temperature of 85°C. This FPGA is commonly used in applications that require high-performance and flexible digital circuitry design.

FPGA

392

392 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL006YU256I7G by Intel

10CL006YU256I7G

Intel

The Intel 10CL006YU256I7G is a FPGA with 392 CLBs, operating voltage range of 1.15V to 1.25V, and temperature range of -40°C to 100°C. It is used in industrial applications requiring high performance computing and programmable logic capabilities.

FPGA

392

392 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL006ZU256I8G by Intel

10CL006ZU256I8G

Intel

Intel's 10CL006ZU256I8G FPGA features 6272 logic cells, 392 CLBs, and 176 inputs/outputs. With a package style of grid array and low profile, it is ideal for industrial applications requiring high-performance programmable ICs in a compact form factor. Operating temperature ranges from -40 to 100°C, making it suitable for various environments.

FPGA

6272

176

176

392

392 CLBS

-40 to 125 °C range is available as extended industrial

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

BGA256,16X16,32

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL010YU256A7G by Intel

10CL010YU256A7G

Intel

The Intel 10CL010YU256A7G is a Field Programmable Gate Array (FPGA) with 645 CLBs. It operates at a nominal voltage of 1.2V and has a max supply voltage of 1.25V, making it suitable for automotive applications due to its low profile and fine pitch package style.

FPGA

645

645 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL010YU256C6G by Intel

10CL010YU256C6G

Intel

Intel's 10CL010YU256C6G FPGA features 645 CLBs, operates at 1.2V, and has a max supply voltage of 1.25V. Ideal for applications requiring high-performance computing in a compact form factor with a package style of GRID ARRAY, LOW PROFILE, FINE PITCH.

FPGA

645

645 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL010YU256C8G by Intel

10CL010YU256C8G

Intel

Intel's 10CL010YU256C8G FPGA features 645 CLBs, operates at 1.2V, and has a max supply voltage of 1.25V. Ideal for applications requiring high performance and flexibility in electronic circuit design with its grid array package style and low profile design.

FPGA

645

645 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL010YU256I7G by Intel

10CL010YU256I7G

Intel

The Intel 10CL010YU256I7G is a field programmable gate array (FPGA) with 645 CLBs. It has a max supply voltage of 1.25V and operates in temperatures ranging from -40 to 100°C. This FPGA is commonly used in industrial applications for its versatility and compact size (14mm x 14mm).

FPGA

645

645 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL010ZU256I8G by Intel

10CL010ZU256I8G

Intel

Intel's 10CL010ZU256I8G FPGA features 10320 logic cells, 645 CLBs, and 176 inputs/outputs. With a package style of grid array, it is ideal for industrial applications requiring high-performance programmable ICs in a compact form factor.

FPGA

10320

176

176

645

645 CLBS

-40 to 125 °C range is available as extended industrial

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

BGA256,16X16,32

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL016YU256A7G by Intel

10CL016YU256A7G

Intel

Intel's 10CL016YU256A7G is a FPGA with 963 CLBs, operating voltage of 1.15-1.25V, and temp range of -40 to 125°C. Ideal for automotive applications due to its low profile grid array package style and fine pitch terminals.

FPGA

963

963 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL016YU256C6G by Intel

10CL016YU256C6G

Intel

The Intel 10CL016YU256C6G is a Field Programmable Gate Array with 963 CLBs, operating voltage range of 1.15V to 1.25V, and temperature range of 0°C to 85°C. It is suitable for applications requiring high-density programmable logic solutions in a compact form factor with a grid array package style.

FPGA

963

963 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL016YU256C8G by Intel

10CL016YU256C8G

Intel

Intel's 10CL016YU256C8G FPGA features 963 CLBs, operates at 1.15-1.25V, and has a package style of GRID ARRAY. Ideal for applications requiring low profile, fine pitch components in a square shape with bottom terminal position.

FPGA

963

963 CLBS

1.2

1.15 V

1.25 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256

10CL016YU256I7G by Intel

10CL016YU256I7G

Intel

The Intel 10CL016YU256I7G is a Field Programmable Gate Array with 963 CLBs, operating voltage range of 1.15V to 1.25V, and temperature range of -40°C to 100°C. It features a grid array package style with low profile and fine pitch terminals, suitable for industrial applications requiring high performance and flexibility in electronic circuit design.

FPGA

963

963 CLBS

1.2

1.15 V

1.25 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Low Profile, Fine Pitch

LFBGA

Square

14 mm

14 mm

1.5 mm

Bottom

Ball

.8 mm

256

S-PBGA-B256