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XC6SLX9-N3FT256I

Xilinx

XC6SLX9-N3FT256I by Xilinx

Xilinx XC6SLX9-N3FT256I FPGA features 9152 logic cells, 715 CLBs, and max clock frequency of 806 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

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Overview

Experience the power of Xilinx with the XC6SLX9-N3FT256I, a top-of-the-line Field Programmable Gate Array (FPGA) that boasts over 9000 logic cells and advanced CMOS technology. With Xilinx's reputation for excellence in the industry, this FPGA delivers unparalleled performance and versatility for a wide range of applications. Whether you're designing cutting-edge electronics or pushing the boundaries of innovation, the XC6SLX9-N3FT256I offers unbeatable value, benefits, and advantages that will take your projects to new heights. Elevate your creations with Xilinx today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resilience to the package, ensuring long-term reliability.

No. of Logic Cells: 9152

Offers a high level of programmable logic for complex designs and applications.

Maximum Supply Voltage: 1.26 V

Allows for efficient power consumption and compatibility with various voltage levels.

Technology Used: CMOS

Utilizes CMOS technology for low power consumption and high speed operation.

Nominal Supply Voltage (V): 1.2

Provides a stable voltage supply for consistent performance.

Maximum Operating Temperature: 100 °C

Can operate in high temperature environments, increasing versatility and reliability.

Maximum Clock Frequency: 806 MHz

Supports high-speed processing and performance for demanding applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX9-N3FT256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

9152

No. of Inputs:

186

No. of Outputs:

186

No. of CLBs:

715

Maximum Clock Frequency:

806 MHz

CLB Maximum Delay:

0.26 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

715 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

XC6SLX9-N3FT256I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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