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LCMXO3LF-6900C-5BG256I

Lattice Semiconductor

LCMXO3LF-6900C-5BG256I by Lattice Semiconductor

LCMXO3LF-6900C-5BG256I by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 6900 logic cells, 858 CLBs, and 206 inputs/outputs. It operates b/w -40 to 100 °C and has a low profile grid array package suitable for various electronic applications.

Median Price

$22.050

Lifecycle Status

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11

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Chip1Stop

Japan . 117 parts In-Stock

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$19.900

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Verical

USA . 357 parts In-Stock

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$24.500

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$21.916

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Nova Conductors

Japan . 55 parts In-Stock

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Vyrian

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Chip Stock

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Sensible Micro Corp

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ComSIT Distribution GmbH

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Continental Prestige Electronics

USA . 3,954 parts In-Stock

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$18.218

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Netroflash

USA . 100 parts In-Stock

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$17.661

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$17.289

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Ampacity Inc.

Singapore . 932 parts In-Stock

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$18.740

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Microchip USA

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Semicontronic

India . 983 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,953 parts In-Stock

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Advanced Electronics

New Zealand . 2,548 parts In-Stock

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Corohmni

South Africa . 208 parts In-Stock

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Argo Parts USA

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Overview

Unlock endless possibilities with the LCMXO3LF-6900C-5BG256I by Lattice Semiconductor, a cutting-edge Field Programmable Gate Array with 6900 logic cells. This innovative FPGA, encased in a durable plastic/epoxy package, offers unparalleled flexibility and performance for a wide range of applications. From aerospace to telecommunications, this versatile device empowers you to create customized solutions tailored to your unique needs. Trust in Lattice Semiconductor's reputation for excellence and elevate your projects to new heights with the LCMXO3LF-6900C-5BG256I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FPGA.

No. of Logic Cells: 6900

Offers a high capacity for implementing complex logic functions and designs.

Surface Mount: YES

Enables easy and efficient mounting on a PCB for streamlined manufacturing processes.

Maximum Supply Voltage: 3.465 V

Allows for stable and reliable operation within specified voltage limits.

No. of CLBs: 858

Provides a sufficient number of configurable logic blocks for versatile design implementation.

No. of Inputs: 206

Facilitates connectivity with external devices and signals for processing input data.

Package Shape: SQUARE

Optimizes space utilization and PCB layout efficiency.

Form Of Terminal: BALL

Ensures secure and reliable connections for electrical signals.

Nominal Supply Voltage (V): 2.5

Maintains a stable operating voltage for consistent performance.

No. of Terminals: 256

Provides ample connectivity options for interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Allows for flexible reprogramming of logic functions and configurations as needed.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enhances thermal performance and PCB layout compatibility.

Minimum Supply Voltage: 2.375 V

Supports a wide operating voltage range, ensuring compatibility with various voltage levels.

Maximum Operating Temperature: 100 °C

Can operate reliably in high-temperature environments without performance degradation.

Pitch Of Terminal: 0.8 mm

Enables compact design integration and efficient signal routing on the PCB.

Organization: 858 CLBS

Organized structure of logic blocks simplifies design implementation and troubleshooting.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold environments without loss of functionality.

Finishing Of Terminal Used: TIN SILVER COPPER

Enhances conductivity and corrosion resistance for long-term reliability.

Position Of Terminal: BOTTOM

Facilitates easy and secure soldering connections during PCB assembly.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate levels of moisture exposure without damaging the internal components.

Maximum Seated Height: 1.7 mm

Allows for low-profile integration in space-constrained electronic systems.

Width: 14 mm

Compact form factor enables versatile placement and mounting options on the PCB.

No. of Outputs: 206

Delivers ample output options for transmitting processed data or signals to external devices.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time for the soldering process during PCB assembly, ensuring secure connections.

Peak Reflow Temperature °C: 260

Appropriate temperature for solder reflow process, enabling reliable solder joints.

Length: 14 mm

Balanced dimensions for compact design integration and compatibility with standard PCB sizes.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LCMXO3LF-6900C-5BG256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

6900

No. of Inputs:

206

No. of Outputs:

206

No. of CLBs:

858

Organization:

858 CLBS

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

3.465 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

14 mm

Width:

14 mm

Maximum Seated Height:

1.7 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Trade Compliance

LCMXO3LF-6900C-5BG256I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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