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LCMXO3LF-2100C-6BG256I

Lattice Semiconductor

LCMXO3LF-2100C-6BG256I by Lattice Semiconductor

LCMXO3LF-2100C-6BG256I by Lattice Semiconductor is a 2100 Logic Cells FPGA with 264 CLBs and 206 Inputs/Outputs. It operates b/w -40 to 100 °C, has a supply voltage range of 2.375V to 3.465V, and is ideal for applications requiring high-performance programmable ICs in compact form factors.

Median Price

$16.510

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Overview

Unlock limitless possibilities with the LCMXO3LF-2100C-6BG256I by Lattice Semiconductor. This cutting-edge Field Programmable Gate Array (FPGA) boasts 2100 logic cells, 264 CLBs, and 206 inputs and outputs - perfect for a wide range of applications. With a maximum supply voltage of 3.465V and a nominal supply voltage of 2.5V, this FPGA delivers unparalleled performance and reliability. Whether you're designing IoT devices, automotive systems, or industrial equipment, the LCMXO3LF-2100C-6BG256I offers unmatched value, flexibility, and efficiency. Elevate your projects to new heights with Lattice Semiconductor's top-of-the-line technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the product.

No. of Logic Cells: 2100

With 2100 logic cells, this FPGA has sufficient capacity for complex designs and processing tasks.

Surface Mount: YES

Surface mount capability makes it easy to integrate this FPGA onto circuit boards.

Maximum Supply Voltage: 3.465 V

Operating at a maximum supply voltage of 3.465 V ensures compatibility in a variety of applications.

No. of CLBs: 264

264 CLBs provide flexibility and scalability for implementing logic functions.

No. of Inputs: 206

Having 206 inputs allows for extensive connectivity and input options for data processing.

Package Shape: SQUARE

Square package shape enables easy handling and integration into circuit designs.

Form Of Terminal: BALL

Ball terminals offer a reliable and secure connection for the FPGA.

Nominal Supply Voltage (V): 2.5

Operating at a nominal supply voltage of 2.5V provides stable performance and power efficiency.

No. of Terminals: 256

Having 256 terminals allows for versatile connectivity options in circuit design.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array, this product allows for customization and reconfiguration of logic functions.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array package style with low profile and fine pitch offers compact integration and efficient layout on circuit boards.

Minimum Supply Voltage: 2.375 V

Operating at a minimum supply voltage of 2.375 V ensures compatibility with low-power applications.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, this FPGA can withstand high-temperature environments.

Pitch Of Terminal: 0.8 mm

Terminal pitch of 0.8 mm allows for precise and compact connections in circuit designs.

Organization: 264 CLBS

With an organization of 264 CLBs, this FPGA provides a structured and efficient logic implementation.

Minimum Operating Temperature: -40 °C

Capable of operating at temperatures as low as -40°C, making it suitable for a wide range of environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Using tin, silver, and copper for terminal finishing ensures durable and reliable connections.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom facilitates easy integration into circuit designs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates the level of protection against moisture, ensuring reliability in various conditions.

Maximum Seated Height: 1.7 mm

With a maximum seated height of 1.7 mm, this FPGA offers a compact form factor for space-constrained designs.

Width: 14 mm

Having a width of 14 mm provides a balance between size and connectivity options in circuit layouts.

No. of Outputs: 206

With 206 outputs, this FPGA can handle a diverse range of output signals for data processing.

Maximum Time At Peak Reflow Temperature (s): 30

Maximum time of 30 seconds at peak reflow temperature ensures secure soldering and connection reliability during manufacturing.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this FPGA can withstand the soldering process without compromising its integrity.

Length: 14 mm

Having a length of 14 mm offers a compact yet functional form factor for easy integration into circuit designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LCMXO3LF-2100C-6BG256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

2100

No. of Inputs:

206

No. of Outputs:

206

No. of CLBs:

264

Organization:

264 CLBS

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

3.465 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

14 mm

Width:

14 mm

Maximum Seated Height:

1.7 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Trade Compliance

LCMXO3LF-2100C-6BG256I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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