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LFXP2-8E-6FT256I

Lattice Semiconductor

LFXP2-8E-6FT256I by Lattice Semiconductor

LFXP2-8E-6FT256I by Lattice Semiconductor is a 8000 logic cell FPGA with max. clock freq. of 435MHz, 201 inputs/outputs, and 0.399ns combinatorial delay. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems due to its advanced CMOS technology and low power consumption at 1.2V nominal voltage.

Median Price

$5.060

Lifecycle Status

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1k+

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Nova Conductors

Japan . 10 parts In-Stock

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Continental Prestige Electronics

USA . 5,221 parts In-Stock

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AZTECH Wire

Italy . 855 parts In-Stock

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Ampacity Inc.

Singapore . 436 parts In-Stock

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Aztec Data Supply Inc.

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Corohmni

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Argo Parts USA

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Netroflash

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Overview

Unlock limitless possibilities with the LFXP2-8E-6FT256I by Lattice Semiconductor. As a leader in Field Programmable Gate Arrays (FPGA), Lattice Semiconductor delivers top-quality products that push boundaries and drive innovation. This FPGA offers 8000 logic cells, 201 inputs/outputs, and a maximum clock frequency of 435 MHz, perfect for a wide range of applications. Whether you're designing cutting-edge electronics or creating advanced automation systems, the LFXP2-8E-6FT256I provides unmatched flexibility, performance, and reliability. Embrace the future of technology with Lattice Semiconductor's exceptional FPGA solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package material provides good protection for the FPGA, ensuring durability and reliability.

No. of Logic Cells: 8000

Having a high number of logic cells allows for complex and advanced programming capabilities in the FPGA.

Surface Mount: YES

Surface mount capability makes it easy to integrate the FPGA onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.26 V

Low maximum supply voltage helps in reducing power consumption and heat generation in the system.

Technology Used: CMOS

CMOS technology offers low power consumption, high noise immunity, and high integration density for efficient FPGA performance.

No. of Inputs: 201

Having a large number of inputs allows for multiple data sources to be processed simultaneously, enhancing overall performance.

Package Shape: SQUARE

Square package shape provides an efficient use of space on the PCB, contributing to a compact and streamlined design.

Form Of Terminal: BALL

Ball terminal form enables easy and reliable connections to other components on the PCB, ensuring secure signal transmission.

Nominal Supply Voltage (V): 1.2

Stable nominal supply voltage of 1.2V ensures consistent and reliable operation of the FPGA.

Power Supplies (V): 1.2,1.2/3.3,3.3

Multiple power supply options cater to different voltage requirements, making the FPGA versatile and compatible with various systems.

No. of Terminals: 256

Having a sufficient number of terminals allows for easy and secure connections within the system, ensuring reliable signal transmission.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array allows for flexibility in reprogramming the device for different applications, making it adaptable and versatile.

Package Style (Meter): GRID ARRAY

Grid array package style provides a high terminal count in a compact layout, enabling efficient signal routing and connectivity.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage ensures that the FPGA can operate reliably even under varying voltage conditions, enhancing system stability.

Pitch Of Terminal: 1 mm

Having a small terminal pitch of 1mm allows for high-density mounting on the PCB, enabling efficient use of available space.

Maximum Combinatorial Delay of a CLB: 0.399 ns

Low combinatorial delay in CLB (Configurable Logic Block) ensures fast processing and response times in the FPGA.

Finishing Of Terminal Used: TIN LEAD

Tin lead terminal finishing provides good solderability and conductivity, ensuring strong and reliable connections for the FPGA.

Position Of Terminal: BOTTOM

Bottom terminal position facilitates easy and efficient PCB layout, allowing for optimal signal routing and connection management.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates that the FPGA can withstand moderate levels of humidity during storage and operation.

Maximum Seated Height: 2.1 mm

Low maximum seated height allows for slim and compact designs in electronic systems using the FPGA.

Width: 17 mm

Having a width of 17mm provides a compact form factor for the FPGA, enabling efficient placement on the PCB.

Maximum Clock Frequency: 435 MHz

High maximum clock frequency of 435MHz allows for fast data processing and high-speed operations in the FPGA.

No. of Outputs: 201

The large number of outputs allows for simultaneous data transmission to multiple destinations, enhancing system performance.

Maximum Time At Peak Reflow Temperature (s): 30

Being able to withstand the peak reflow temperature for 30 seconds indicates the FPGA's durability and reliability during assembly processes.

Peak Reflow Temperature °C: 225

High peak reflow temperature of 225°C ensures proper soldering of the FPGA onto the PCB, contributing to a robust and stable connection.

Length: 17 mm

Having a length of 17mm contributes to the overall compactness and efficiency of the FPGA design, enabling space-saving integration in electronic systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LFXP2-8E-6FT256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

8000

No. of Inputs:

201

No. of Outputs:

201

Maximum Clock Frequency:

435 MHz

CLB Maximum Delay:

0.399 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,3.3 V

Temperature and Environmental Ratings

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

2.1 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

LFXP2-8E-6FT256I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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