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LFXP2-8E-6FTN256C

Lattice Semiconductor

LFXP2-8E-6FTN256C by Lattice Semiconductor

LFXP2-8E-6FTN256C by Lattice Semiconductor is a 8000 logic cell FPGA with 1000 CLBs, 201 inputs/outputs, and max clock freq of 435 MHz. It operates at 1.2V, CMOS tech, in a plastic package suitable for various applications requiring high-speed processing and programmable ICs.

Median Price

$41.655

Lifecycle Status

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Mouser Electronics

USA . 20 parts In-Stock

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Nova Conductors

Japan . 86 parts In-Stock

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AZTECH Wire

Italy . 682 parts In-Stock

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Ampacity Inc.

Singapore . 122 parts In-Stock

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Continental Prestige Electronics

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Netroflash

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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Microchip USA

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Corohmni

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Aztec Data Supply Inc.

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Overview

Unlock endless possibilities with the LFXP2-8E-6FTN256C by Lattice Semiconductor, a cutting-edge Field Programmable Gate Array designed to revolutionize your projects. From its 8000 logic cells to its advanced CMOS technology, this FPGA offers unparalleled flexibility and performance. Perfect for a wide range of applications, this product is a game-changer in the world of electronics. Experience top-notch quality, reliability, and innovation with Lattice Semiconductor - the industry leader in programmable IC solutions. Elevate your designs and unleash your creativity with the LFXP2-8E-6FTN256C today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FPGA lightweight and durable, suitable for portable and rugged applications.

No. of Logic Cells: 8000

With a high number of logic cells, this FPGA offers ample flexibility and capacity for complex designs in various industries.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation onto circuit boards, saving time and effort during the assembly process.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and heat generation, leading to improved energy efficiency and reliability.

No. of CLBs: 1000

The large number of Configurable Logic Blocks (CLBs) provides the ability to implement a wide range of logic functions, enhancing the versatility of this FPGA.

Technology Used: CMOS

The adoption of CMOS technology ensures high performance, low power consumption, and compatibility with a wide range of applications.

No. of Inputs: 201

With a high number of inputs, this FPGA can accommodate a large number of signals, making it suitable for data-intensive processing tasks.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the circuit board, optimizing the layout and design of the overall system.

Form Of Terminal: BALL

The ball terminal form enables reliable connections and facilitates automated assembly processes, making it easier to integrate this FPGA into electronic systems.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V ensures compatibility with standard power sources and offers stable operation for various applications.

Power Supplies (V): 1.2,1.2/3.3,3.3

The multiple power supply options cater to different voltage requirements, offering flexibility in design and compatibility with various system components.

No. of Terminals: 256

The high number of terminals provides ample connection points for interfacing with other components, allowing for versatile and scalable system integration.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

The programmable nature of this FPGA allows for customization and reconfiguration of logic functions, offering adaptability and versatility for changing requirements.

Package Style (Meter): GRID ARRAY

The grid array package style simplifies the placement and connection of this FPGA on the circuit board, ensuring a secure and reliable assembly.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures stable operation even under varying power conditions, enhancing the overall reliability of this FPGA.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can withstand elevated environmental conditions, making it suitable for industrial and automotive applications.

Pitch Of Terminal: 1 mm

The narrow pitch of the terminal spacing allows for compact designs and high-density packaging, enabling space-efficient integration in electronic systems.

Maximum Combinatorial Delay of a CLB: 0.399 ns

The low maximum combinatorial delay of a Configurable Logic Block ensures quick response times and high-speed processing of logic operations.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature rating ensures reliable performance even in cold environments, making this FPGA suitable for a wide range of applications.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on the terminal enhances conductivity, reliability, and resistance to corrosion, ensuring long-term performance of this FPGA.

Position Of Terminal: BOTTOM

The bottom position of the terminal simplifies the routing of connections and allows for efficient heat dissipation, optimizing the performance and reliability of the FPGA.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the level of protection against moisture exposure, ensuring the long-term reliability and durability of this FPGA in varied environmental conditions.

Maximum Seated Height: 2.1 mm

With a low maximum seated height, this FPGA offers a compact form factor and efficient use of space in electronic systems, ideal for applications with size constraints.

Width: 17 mm

The width dimension of 17mm enables easy integration of this FPGA into standard-sized electronic assemblies, allowing for seamless compatibility and installation.

Maximum Clock Frequency: 435 MHz

With a high maximum clock frequency, this FPGA can perform fast data processing and meet the demands of high-performance computing applications, offering efficient and reliable operation.

No. of Outputs: 201

The high number of outputs provides ample flexibility for routing signals and enables the FPGA to drive multiple components simultaneously, enhancing the functionality and performance of the system.

Peak Reflow Temperature °C: 260

The high peak reflow temperature rating allows for robust soldering and assembly processes, ensuring secure connections and reliable operation of this FPGA.

Length: 17 mm

The length dimension of 17mm offers a compact footprint for this FPGA, enabling easy integration into space-constrained applications while maintaining high performance and functionality.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LFXP2-8E-6FTN256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

8000

No. of Inputs:

201

No. of Outputs:

201

No. of CLBs:

1000

Maximum Clock Frequency:

435 MHz

CLB Maximum Delay:

0.399 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

2.1 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

LFXP2-8E-6FTN256C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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