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LFXP2-8E-6FTN256I

Lattice Semiconductor

LFXP2-8E-6FTN256I by Lattice Semiconductor

LFXP2-8E-6FTN256I by Lattice Semiconductor is a 8000 Logic Cells FPGA with 1000 CLBs, operating at max 435 MHz clock frequency. It uses CMOS technology and has 201 inputs/outputs, suitable for applications requiring high-speed processing in industrial automation and telecommunications.

Median Price

$58.650

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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Arrow

USA . 10 parts In-Stock

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$58.340

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$45.250

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Verical

USA . 10 parts In-Stock

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$58.650

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$45.250

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Mouser Electronics

USA . 3 parts In-Stock

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$58.650

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$47.350

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DigiKey

USA . 120 parts In-Stock

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$64.520

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$52.085

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Future Electronics

Canada . 810 parts In-Stock

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$42.060

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Nova Conductors

Japan . 450 parts In-Stock

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$44.720

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Vyrian

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Chip Stock

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Electronics Depot

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Ampacity Inc.

Singapore . 270 parts In-Stock

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$35.750

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Semicontronic

India . 270 parts In-Stock

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$35.750

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$34.856

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$34.678

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Aranea Global

USA . 1,000 parts In-Stock

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$43.826

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$42.073

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Continental Prestige Electronics

USA . 2,496 parts In-Stock

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$44.720

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$43.826

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$51.875

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$47.725

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Microchip USA

USA . 3,314 parts In-Stock

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$53.800

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$52.800

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$52.300

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Corohmni

South Africa . 167 parts In-Stock

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$130.765

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Aztec Data Supply Inc.

USA . 921 parts In-Stock

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Argo Parts USA

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Authorized Procurement Solutions

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Perfect Parts

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Overview

Unlock the power of innovation with the LFXP2-8E-6FTN256I by Lattice Semiconductor, a cutting-edge Field Programmable Gate Array (FPGA) that provides unmatched flexibility and performance. With 8000 logic cells and 1000 CLBs, this FPGA offers endless possibilities for customization and optimization. Whether you are designing advanced electronics, industrial automation systems, or high-speed communication networks, this versatile device delivers the high-quality results you need. Trust in Lattice Semiconductor's reputation for excellence and revolutionize your projects with the LFXP2-8E-6FTN256I FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, making it suitable for portable and rugged applications.

No. of Logic Cells: 8000

With a high number of logic cells, this FPGA offers increased flexibility and capability to implement complex digital circuits and algorithms.

Surface Mount: YES

Being surface mountable simplifies the assembly process and allows for compact designs, making it ideal for space-constrained applications.

Maximum Supply Voltage: 1.26V

The higher maximum supply voltage allows for flexibility in interfacing with other components while staying within safe operating limits.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance and reliability of the FPGA.

No. of Inputs: 201

Having a high number of inputs enables the FPGA to interface with a wide range of external devices and sensors, making it versatile for various applications.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and easy layout in PCB designs.

Nominal Supply Voltage (V): 1.2

The consistent nominal supply voltage ensures stable operation and compatibility with standard power sources.

Power Supplies (V): 1.2,1.2/3.3,3.3

Support for multiple power supply voltages offers flexibility in system integration and optimization for specific power requirements.

No. of Terminals: 256

The large number of terminals provides ample connectivity options for interfacing with external devices and peripherals.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array allows for reconfigurability and adaptability, making it suitable for prototyping and rapid development cycles.

Package Style (Meter): GRID ARRAY

The grid array package style enables high-density mounting and efficient routing of signals, enhancing performance in complex designs.

Minimum Supply Voltage: 1.14V

The low minimum supply voltage ensures efficient power consumption and operation in low-power scenarios.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions and extended operation in demanding applications.

Pitch Of Terminal: 1 mm

The fine pitch of the terminals allows for high-density mounting and compact layouts, saving board space.

Maximum Combinatorial Delay of a CLB: 0.399 ns

The low combinatorial delay of the configurable logic block ensures high-speed performance and efficient signal processing.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows for operation in extreme cold environments, making it suitable for aerospace and industrial applications.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on the terminals ensures good conductivity, corrosion resistance, and reliable connections.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom simplifies PCB layout and soldering processes, improving manufacturing efficiency.

Moisture Sensitivity Level (MSL): 3

The MSL 3 indicates moderate moisture sensitivity, requiring standard handling procedures to prevent damage during storage and assembly.

Maximum Seated Height: 2.1 mm

The low seated height of the package allows for slim and compact designs, suitable for applications with space constraints.

Width: 17 mm

The compact width of the package enables efficient board space utilization and allows for dense packing in system layouts.

Maximum Clock Frequency: 435 MHz

The high maximum clock frequency offers fast signal processing and high-performance capabilities for real-time applications and data processing.

No. of Outputs: 201

With a high number of outputs, the FPGA can drive multiple external devices and provide flexible output configurations for diverse applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable soldering during assembly processes and prevents thermal damage to the FPGA.

Length: 17 mm

The compact length of the package contributes to overall space savings and allows for efficient placement on PCBs, especially in constrained layouts.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LFXP2-8E-6FTN256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of Logic Cells:

8000

No. of Inputs:

201

No. of Outputs:

201

No. of CLBs:

1000

Maximum Clock Frequency:

435 MHz

CLB Maximum Delay:

0.399 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

2.1 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

LFXP2-8E-6FTN256I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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