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AUTOMOTIVE Microprocessors 39

Microprocessors
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
AM1707DZKBT3 by Texas Instruments

AM1707DZKBT3

Texas Instruments

AM1707DZKBT3 by Texas Instruments is a 32-bit microprocessor with integrated cache, operating at speeds up to 30 MHz. It features an address bus width of 13 bits and external data bus width of 16 bits, suitable for automotive applications requiring low power consumption. With a package style of grid array and fine pitch, it offers high performance in a compact form factor.

13

32

YES

30 MHz

16

FIXED POINT

YES

S-PBGA-B256

17 mm

YES

256

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, FINE PITCH

NOT SPECIFIED

1.2,1.8/3.3

Not Qualified

2.05 mm

375 rpm

Microprocessors

1.32 V

1.14 V

1.2 V

YES

CMOS

AUTOMOTIVE

BALL

.5 mm

BOTTOM

NOT SPECIFIED

17 mm

MICROPROCESSOR, RISC

AM3352BZCZT60R by Texas Instruments

AM3352BZCZT60R

Texas Instruments

AM3352BZCZT60R by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 16-bit external data bus width, and max clock frequency of 26 MHz. Ideal for automotive applications due to its low power mode, it features a temperature grade of AUTOMOTIVE and boundary scan capability.

28

32

YES

26 MHz

16

FIXED POINT

YES

S-PBGA-B324

e1

15 mm

YES

3

64

324

8

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

131072

1.4 mm

600 rpm

400 mA

1.248 V

1.152 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

15 mm

MICROPROCESSOR, RISC

AM3352BZCZT60 by Texas Instruments

AM3352BZCZT60

Texas Instruments

AM3352BZCZT60 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for automotive applications requiring low power mode and boundary scan capability. With a temperature range from -40 to 125 °C, it offers high performance in compact square package style.

28

32

YES

26 MHz

16

FIXED POINT

YES

S-PBGA-B324

e1

15 mm

YES

3

64

324

8

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

131072

1.4 mm

600 rpm

400 mA

1.248 V

1.152 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

15 mm

MICROPROCESSOR, RISC

MCIMX6D6AVT10ADR by NXP Semiconductors

MCIMX6D6AVT10ADR

NXP Semiconductors

MCIMX6D6AVT10ADR by NXP Semiconductors is a 32-bit microprocessor with integrated cache, suitable for automotive applications. It features a grid array package style with 624 terminals and operates b/w -40 to 125°C. The processor utilizes RISC technology, has a terminal pitch of 0.8mm, and supports boundary scan testing.

64-BIT BUS WIDTH AVAILABLE

32

YES

FIXED POINT

YES

S-PBGA-B624

e1

21 mm

NO

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1000 rpm

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6DP4AVT1AA by NXP Semiconductors

MCIMX6DP4AVT1AA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

26

32

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1000 rpm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6DP6AVT1AA by NXP Semiconductors

MCIMX6DP6AVT1AA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

26

32

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1000 rpm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6QP4AVT1AA by NXP Semiconductors

MCIMX6QP4AVT1AA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

26

32

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1000 rpm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6QP4AVT8AA by NXP Semiconductors

MCIMX6QP4AVT8AA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

26

32

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

852 rpm

1.5 V

1.225 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6QP6AVT1AA by NXP Semiconductors

MCIMX6QP6AVT1AA

NXP Semiconductors

MCIMX6QP6AVT1AA by NXP Semiconductors is a 32-bit microprocessor with integrated cache and a max supply voltage of 1.5V. It is commonly used in automotive applications due to its temperature grade, low power mode, and boundary scan capability.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

26

32

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1000 rpm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6S1AVM10AC by NXP Semiconductors

MCIMX6S1AVM10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6S4AVM10AC by NXP Semiconductors

MCIMX6S4AVM10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6S6AVM10AC by NXP Semiconductors

MCIMX6S6AVM10AC

NXP Semiconductors

MCIMX6S6AVM10AC by NXP Semiconductors is a MICROPROCESSOR with CMOS technology, operating at -40 to 125 °C. It has 624 terminals in a GRID ARRAY package style, suitable for automotive applications due to its low profile design and tin silver copper terminal finish.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6U1AVM10AC by NXP Semiconductors

MCIMX6U1AVM10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6U4AVM10AC by NXP Semiconductors

MCIMX6U4AVM10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6U6AVM10AC by NXP Semiconductors

MCIMX6U6AVM10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6Q4AVT10ADR by NXP Semiconductors

MCIMX6Q4AVT10ADR

NXP Semiconductors

MCIMX6Q4AVT10ADR by NXP is a 32-bit microprocessor with 64-bit external data bus width. It operates at speeds up to 1000 rpm, suitable for automotive applications. Featuring integrated cache and low power mode, it has a temperature range of -40 to 125 °C and boundary scan capability.

PKG DETAIL: HTTP://CACHE.FREESCALE.COM/FILES/SHARED/DOC/PACKAGE_INFO/98ASA00330D.

16

32

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1000 rpm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6DP4AVT1AB by NXP Semiconductors

MCIMX6DP4AVT1AB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6QP4AVT1AB by NXP Semiconductors

MCIMX6QP4AVT1AB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6QP4AVT8AB by NXP Semiconductors

MCIMX6QP4AVT8AB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6QP6AVT1AB by NXP Semiconductors

MCIMX6QP6AVT1AB

NXP Semiconductors

MCIMX6QP6AVT1AB by NXP Semiconductors is a microprocessor with a max supply voltage of 1.5V and operating temperature range of -40 to 125°C. It is commonly used in automotive applications due to its CMOS technology and fine pitch grid array package style.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6QP6AVT8AB by NXP Semiconductors

MCIMX6QP6AVT8AB

NXP Semiconductors

MCIMX6QP6AVT8AB by NXP Semiconductors is a MICROPROCESSOR with CMOS technology. It operates b/w -40 to 125 °C and has a max supply voltage of 1.5 V. Ideal for automotive applications due to its fine pitch GRID ARRAY package style.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1.5 V

1.225 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6S1AVM08AD by NXP Semiconductors

MCIMX6S1AVM08AD

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

16

YES

32

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

800 rpm

1.5 V

1.275 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6S1AVM10AD by NXP Semiconductors

MCIMX6S1AVM10AD

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

16

YES

32

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1000 rpm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6S4AVM08AD by NXP Semiconductors

MCIMX6S4AVM08AD

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

16

YES

32

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

800 rpm

1.5 V

1.275 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6S4AVM10AD by NXP Semiconductors

MCIMX6S4AVM10AD

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

16

YES

32

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1000 rpm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6S6AVM08AD by NXP Semiconductors

MCIMX6S6AVM08AD

NXP Semiconductors

MCIMX6S6AVM08AD by NXP Semiconductors is a Microprocessor with 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for automotive applications due to its low power mode, operating temperature range of -40 to 125 °C, and boundary scan feature.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

16

YES

32

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

800 rpm

1.5 V

1.275 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6S6AVM10AD by NXP Semiconductors

MCIMX6S6AVM10AD

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

16

YES

32

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1000 rpm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6U1AVM08AD by NXP Semiconductors

MCIMX6U1AVM08AD

NXP Semiconductors

MCIMX6U1AVM08AD by NXP is a microprocessor with 64-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for automotive applications due to its low power mode, operating temperature range of -40 to 125 °C, and boundary scan capability.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

16

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

800 rpm

1.5 V

1.275 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6U1AVM10AD by NXP Semiconductors

MCIMX6U1AVM10AD

NXP Semiconductors

MCIMX6U1AVM10AD by NXP is a Microprocessor with 64-bit External Data Bus, 16-bit Address Bus, and integrated cache. Ideal for automotive applications due to its low power mode, CMOS technology, and operating temperature range of -40 to 125 °C. Features boundary scan capability and a compact package style with 624 terminals in a square shape.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

16

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1000 rpm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6U4AVM08AD by NXP Semiconductors

MCIMX6U4AVM08AD

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

16

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

800 rpm

1.5 V

1.275 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6U4AVM10AD by NXP Semiconductors

MCIMX6U4AVM10AD

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

16

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1000 rpm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6U6AVM08AD by NXP Semiconductors

MCIMX6U6AVM08AD

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

16

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

800 rpm

1.5 V

1.275 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6U6AVM10AD by NXP Semiconductors

MCIMX6U6AVM10AD

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

16

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1000 rpm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

STM32MP151AAD3T by STMicroelectronics

STM32MP151AAD3T

STMicroelectronics

STM32MP151AAD3T by STMicroelectronics is a 32-bit microprocessor with a max clock frequency of 48 MHz and operates b/w -40 °C to 125 °C. It features integrated cache, low power mode, and supports automotive applications. Ideal for advanced embedded systems requiring efficiency and reliability.

"TERM PITCH-MAX"

32

YES

48 MHz

FLOATING-POINT

YES

S-PBGA-B257

10 mm

YES

48

8

257

8

125 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

BGA257,19X19,25/20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

724992

1.2 mm

650 rpm

100 mA

1.25 V

1.18 V

1.2 V

YES

CMOS

AUTOMOTIVE

BALL

.65 mm

BOTTOM

NOT SPECIFIED

10 mm

MICROPROCESSOR, RISC

MIMXRT1171AVM8A by NXP Semiconductors

MIMXRT1171AVM8A

NXP Semiconductors

NXP's MIMXRT1171AVM8A microprocessor features integrated cache, 32 DMA channels, and 48 MHz clock frequency. Ideal for automotive applications due to its low power mode, CMOS technology, and wide temperature range (-40 to 125 °C).

YES

48 MHz

FLOATING-POINT

YES

S-PBGA-B289

14 mm

YES

3

32

1

289

8

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

2097152

1.52 mm

800 rpm

850 mA

1.95 V

1.71 V

1.8 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

MICROPROCESSOR, RISC

MIMXRT1172AVM8A by NXP Semiconductors

MIMXRT1172AVM8A

NXP Semiconductors

NXP Semiconductors' MIMXRT1172AVM8A microprocessor features integrated cache, 32 DMA channels, and a max clock frequency of 48 MHz. Ideal for automotive applications, this CMOS technology-based chip operates at temperatures ranging from -40 to 125 °C and supports low power mode.

YES

48 MHz

FLOATING-POINT

YES

S-PBGA-B289

14 mm

YES

3

32

1

289

8

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

2097152

1.52 mm

800 rpm

850 mA

1.95 V

1.71 V

1.8 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

MICROPROCESSOR, RISC

MIMXRT1175AVM8A by NXP Semiconductors

MIMXRT1175AVM8A

NXP Semiconductors

The NXP MIMXRT1175AVM8A microprocessor features integrated cache, 32 DMA channels, and a max clock frequency of 48 MHz. Ideal for automotive applications, it operates in a temperature range from -40 to 125°C with low power mode support.

YES

48 MHz

FLOATING-POINT

YES

S-PBGA-B289

14 mm

YES

3

32

1

289

8

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

2097152

1.52 mm

800 rpm

850 mA

1.95 V

1.71 V

1.8 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

MICROPROCESSOR, RISC

MCIMX537CVP8C2 by NXP Semiconductors

MCIMX537CVP8C2

NXP Semiconductors

MCIMX537CVP8C2 by NXP Semiconductors is a 32-bit microprocessor with 147456 RAM words, 27 MHz clock frequency, and 1.15 V max supply voltage. Ideal for automotive applications due to its RISC technology, floating-point format, and low power mode capabilities.

26

32

YES

27 MHz

32

FLOATING POINT

YES

S-PBGA-B529

19 mm

YES

3

32

52

529

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

147456

1.85 mm

800 rpm

800 mA

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

TDA4VM88TGBALFRQ1 by Texas Instruments

TDA4VM88TGBALFRQ1

Texas Instruments

TDA4VM88TGBALFRQ1 by Texas Instruments is a microprocessor with 64-bit architecture, 32-bit external data bus width, and integrated cache. Ideal for automotive applications, it operates b/w -40 to 125°C, features boundary scan capability, and has a max clock frequency of 27 MHz.

0

64

YES

27 MHz

32

FLOATING-POINT

YES

S-PBGA-B827

e1

24 mm

YES

3

1

26

827

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA827,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

250

9961472

AEC-Q100

2.8 mm

2000 rpm

.84 V

.76 V

.8 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

24 mm

MICROPROCESSOR, RISC