Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;
Median Price
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$32.600
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$32.300
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Rochester
$35.850
$32.080
$30.190
Verical
$44.813
$40.100
$37.737
Avnet
Digiode
$37.838
Flip Electronics
Vyrian
Anansix
Chip Stock
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$49.340
Corphita
$35.847
Microchip USA
$100.426
Formix International (Excess)
UNI Independent Distributors
Microprocessors MCIMX6U6AVM08AD attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Additional Features:
Address Bus Width:
Boundary Scan:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
MCIMX6U6AVM08AD Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A992.C
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Assembly/Origin - Mult Dev A/T Site 28/Apr/2021
PCN Packaging - All Dev Label Update 15/Dec/2020 Mult Dev Pkg Seal 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
LM358N
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N7002
Supertex
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 5 pF;
STM32F407VGT6
STMicroelectronics
STM32F407VGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 196608 bytes RAM, and 16-Ch 12-Bit ADC channels. It is ideal for industrial applications requiring CAN, ETHERNET, I2C(3), SPI(3), UART(2), USB(2) connectivity and features DMA(16) for efficient data transfer. With a max clock frequency of 50 MHz and operating temperature range of -40 to 85 °C, it offers high performance in a compact package style (14mm x 14mm).
IRLML6402TRPBF
Infineon Technologies
IRLML6402TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 20V DS Breakdown Voltage, 22A IDM, and 0.065 ohm RDS(on). With a small outline package and matte tin finish, it operates in temperatures from -55 to 150 °C.
EU2B-YS2J03C
Idec
ROTARY SWITCH;
BAV99
MICRODIODE ELECTRONICS SHENZHEN CO LTD
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99WT1G
Fairchild Semiconductor
BSS138
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Operating Mode: ENHANCEMENT MODE;
Silicon Standard
DS18B20U+
Analog Devices
DS18B20U+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
NUP2105LT1G
Onsemi
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
LL4148
Secos
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
IRLML6401TRPBF
IRLML6401TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 12V DS Breakdown Voltage, 34A IDM, and 0.05ohm RDS(on). With a small outline package style, it operates in an ambient temperature range of -55 to 150 °C.
LM7805CT
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
LM78L05ACMX/NOPB
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
M39029/58-360
Itt Cannon
CONNECTOR ACCESSORY; Alternate Contacts: 030-2042-000; DIN Conformity: NO; Contact Gender: MALE; Terminal Type: WIRE; MIL-Connector Accessory Name: CONTACT;
Temic Semiconductors
SS14
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Taiwan Semiconductor
SMBJ18CA
Vishay Intertechnology
Vishay Intertechnology's SMBJ18CA is a bidirectional TRANS VOLTAGE SUPPRESSOR DIODE with a max clamping voltage of 29.2 V and a breakdown voltage of 21.05 V. It is surface mountable and commonly used in transient suppression applications.
DRA829VMTGBALFR
Texas Instruments
DRA829VMTGBALFR by Texas Instruments is a 64-bit microprocessor with integrated cache and 32-bit external data bus width. It operates at a max clock frequency of 27 MHz, making it suitable for high-speed computing applications. With low power mode and boundary scan capabilities, this CMOS technology-based processor offers efficient performance in various industrial settings.
DM3730CBPD100
Texas Instruments DM3730CBPD100 microprocessor features 32-bit architecture, 1.2V supply voltage, and 54MHz clock frequency. Ideal for industrial applications requiring high-speed processing with low power consumption.
MCF5207CVM166
Freescale Semiconductor
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 144; Package Code: LBGA; Package Shape: SQUARE;
MIMXRT595SFFOC
NXP Semiconductors
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
ATSAMA5D35A-CNR
Atmel
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;
MCF54453CVR200
The NXP Semiconductors MCF54453CVR200 microprocessor features a 32-bit address and external data bus width, with integrated cache and low power mode. It operates at a max clock frequency of 66 MHz, suitable for industrial applications requiring high-speed processing in a compact square package.
MPC8245LVV266D
NXP Semiconductors' MPC8245LVV266D is a 32-bit microprocessor with integrated cache and low power mode. It operates at a max clock frequency of 66 MHz, suitable for applications requiring high-speed processing such as networking equipment and industrial automation systems. The processor features a CMOS technology, with a terminal pitch of 1.27 mm and a package style of grid array, making it ideal for compact designs.
MCF5307AI90B
The NXP Semiconductors MCF5307AI90B microprocessor features a 32-bit address and external data bus width, with a max clock frequency of 45.45 MHz. It is suitable for applications requiring low power mode operation, such as embedded systems and industrial automation.
MC6809EP
Motorola
MC6809EP by Motorola is an 8-bit microprocessor with 16-bit address bus, operating at max frequency of 1 MHz. It has a supply voltage range of 4.75V to 5.25V and offers three external interrupts. Widely used in commercial applications due to its NMOS technology and fixed point format for processing tasks efficiently.
MCF5270CVM150R2
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LBGA; Package Shape: SQUARE;
14305R-500
Echelon
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
FH8065301487717SR3UT
Intel
Intel FH8065301487717SR3UT is a 64-bit microprocessor with 1170 terminals, operating at speeds up to 1910 rpm. Suitable for industrial applications, it features integrated cache, CMOS technology, and a rectangular grid array package shape.
CP3BT26Y98ADKX/NOPB
CP3BT26Y98ADKX/NOPB by Texas Instruments is a 16-bit microprocessor with 23-bit address bus width, operating at -40 to 85 °C. It features ROM words of 262144, RAM bytes of 32768, and operates at a max supply voltage of 2.75 V. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.
MCF5328CVM240J
MCF5328CVM240J by Freescale Semiconductor is a 32-bit microprocessor with integrated cache, operating at max 80 MHz. It features a 24-bit address bus width and low power mode, suitable for industrial applications requiring high-speed processing in compact devices. The package style is grid array with dimensions of 17mm x 17mm and terminal pitch of 1mm.
FS32R372SCK0MMMT
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
MCIMX6S1AVM08AB
MCIMX6S1AVM08AB by NXP Semiconductors is a 64-bit microprocessor with 32-bit external data bus width, operating at a max clock frequency of 24 MHz. Ideal for automotive applications, it features low power mode and integrated cache, with a temperature range from -40 to 125 °C.
MPC860ENCZQ50D4
The NXP Semiconductors MPC860ENCZQ50D4 is a 32-bit microprocessor with integrated cache and 3.3V power supply, suitable for low power mode applications. With a max clock frequency of 50 MHz, it features boundary scan and external data bus width of 32 bits, making it ideal for high-speed computing tasks in various electronic devices.
MPC7410HX500LE
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: HBGA; Package Shape: SQUARE; JESD-30 Code: S-CBGA-B360;
AM3352BZCZA80
AM3352BZCZA80 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 64 DMA channels. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and fixed point format processing. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.8 mm.
P1014NXE5HFB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE; Maximum Clock Frequency: 100 MHz;
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MCIMX537CVP8C2
MCIMX537CVP8C2 by NXP Semiconductors is a 32-bit microprocessor with 147456 RAM words, 27 MHz clock frequency, and 1.15 V max supply voltage. Ideal for automotive applications due to its RISC technology, floating-point format, and low power mode capabilities.
MCIMX535DVP1C2
MCIMX535DVP1C2 by NXP Semiconductors is a 32-bit microprocessor with 147456 RAM words, 27 MHz clock frequency, and 529 terminals. It is ideal for applications requiring high-speed processing and low power consumption, such as embedded systems and IoT devices.
MCIMX537CVV8CR2
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE;
MCIMX537CVV8CR2 by NXP Semiconductors is a 32-bit microprocessor with integrated cache and 16-bit address bus width. Ideal for automotive applications, it operates at speeds up to 27 MHz with low power mode support. The package style is grid array, featuring a max supply voltage of 1.15 V and operating temperature range from -40 to 125 °C.
MCIMX537CVV8C
MCIMX537CVV8C by NXP Semiconductors is a microprocessor with 32-bit architecture, 26-bit address bus width, and integrated cache. Ideal for automotive applications, it features a max clock frequency of 27 MHz and low power mode support. With a package style of grid array and fine pitch, this processor offers compatibility with various bus interfaces like CAN, Ethernet, I2C, SPI, UART, and USB.
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;
MCIMX6S7CVM08AC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; JESD-609 Code: e1;
MCIMX6U7CVM08AC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; External Data Bus Width: 32;
MCIMX6S6AVM08AC
MCIMX6S6AVM08AC by NXP Semiconductors is a 64-bit microprocessor with 32-bit external data bus width, operating at a max clock frequency of 24 MHz. Ideal for automotive applications, it features low power mode and integrated cache, making it suitable for high-performance computing in compact spaces.
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6U5DVM10AC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B2240;
MCIMX6U5EVM10AC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; Integrated Cache: YES;
MCIMX6L8DVN10AB
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 576; Package Code: TFBGA; Package Shape: SQUARE;
MCIMX6U8DVM10AC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; Width: 21 mm;
MCIMX536AVV8CR2
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 529; Package Code: HBGA; Package Shape: SQUARE;
MCIMX535DVP2C2
MCIMX535DVP2C2 by NXP Semiconductors is a 32-bit microprocessor with 147456 RAM words and 27 MHz clock frequency. It features a CMOS technology, 529 terminals, and operates b/w -20 to 85 °C. Ideal for applications requiring high-speed processing in compact devices.
MCIMX6U5DVM10AB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
MCIMX6X1CVK08AB
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6QP6AVT1AB
MCIMX6QP6AVT1AB by NXP Semiconductors is a microprocessor with a max supply voltage of 1.5V and operating temperature range of -40 to 125°C. It is commonly used in automotive applications due to its CMOS technology and fine pitch grid array package style.
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