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STM32MP151AAD3T

STMicroelectronics

STM32MP151AAD3T by STMicroelectronics

STM32MP151AAD3T by STMicroelectronics is a 32-bit microprocessor with a max clock frequency of 48 MHz and operates b/w -40 °C to 125 °C. It features integrated cache, low power mode, and supports automotive applications. Ideal for advanced embedded systems requiring efficiency and reliability.

Median Price

$5.596

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$5.596

3,600

-

-

-

$5.596

Verical

USA . 3,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$5.596

3,600

-

-

-

$5.596

Chip1Stop

Japan . 3,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$5.800

3,600

-

-

-

$5.800

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,866 parts In-Stock

1+ parts

-

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-

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4,866

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Vyrian

USA . 4,306 parts In-Stock

1+ parts

-

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4,306

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Anansix

USA . 129 parts In-Stock

1+ parts

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129

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,277 parts In-Stock

1+ parts

$7.060

100+ parts

-

1k+ parts

-

10k+ parts

-

3,277

$7.060

-

-

-

AZTECH Wire

Italy . 138 parts In-Stock

1+ parts

$17.450

100+ parts

-

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-

10k+ parts

-

138

$17.450

-

-

-

Microchip USA

USA . 6,286 parts In-Stock

1+ parts

$23.672

100+ parts

-

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-

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-

6,286

$23.672

-

-

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IDEA Electronic Components Group

UK . 1,612 parts In-Stock

1+ parts

$43.046

100+ parts

-

1k+ parts

$38.741

10k+ parts

-

1,612

$43.046

-

$38.741

-

MKK Technologies

India . 183 parts In-Stock

1+ parts

$80.945

100+ parts

-

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-

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183

$80.945

-

-

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DigiPath Technology Company

USA . 183 parts In-Stock

1+ parts

$80.945

100+ parts

-

1k+ parts

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10k+ parts

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183

$80.945

-

-

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

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-

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Corphita

USA . 2,476 parts In-Stock

1+ parts

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2,476

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Parana Technologies

USA . 317 parts In-Stock

1+ parts

-

100+ parts

$51.468

1k+ parts

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317

-

$51.468

-

-

Overview

Unlock your project’s potential with the STM32MP151AAD3T microprocessor from STMicroelectronics, a leader in innovative technology. Renowned for its exceptional quality and reliability, this powerful 32-bit solution excels in automotive applications, ensuring top performance even under extreme conditions. Experience enhanced efficiency and low power consumption that empower your designs to shine. Elevate your next project with unmatched value and flexibility!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material is lightweight and provides good protection against environmental factors, making this microprocessor suitable for various applications.

Integrated Cache: YES

The presence of integrated cache allows for faster access to frequently used data, enhancing overall performance and efficiency in data processing.

Surface Mount: YES

Surface mount technology simplifies installation and reduces the overall size of the device, making it ideal for compact applications.

Maximum Supply Voltage: 1.25 V

Support for low voltage operation minimizes power consumption, contributing to a longer battery life in portable applications.

On Chip Data RAM Width: 8

An 8-bit data RAM width allows for efficient data handling and improves the performance of tasks that require quick data processing.

Package Shape: SQUARE

The square shape aids in uniform heat dispersion and facilitates easier integration into circuit boards.

Bit Size: 32

A 32-bit architecture enables the handling of larger data types and memory addresses, improving functionality and performance in complex computations.

No. of Terminals: 257

A higher number of terminals allows for more input/output options, making it versatile for various applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The very thin profile and fine pitch design are beneficial for high-density applications, promoting a compact layout on PCB.

Minimum Supply Voltage: 1.18 V

This low minimum supply voltage increases tolerance for power fluctuations, ensuring reliable operation in diverse environments.

Maximum Operating Temperature: 125 °C

The ability to operate at high temperatures makes this microprocessor suitable for automotive and industrial applications where heat management is crucial.

Minimum Operating Temperature: -40 °C

With a wide operational temperature range, this product can function in extreme environmental conditions, ensuring reliability in varied applications.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates efficient heat dissipation and improves the electrical connectivity of the microprocessor.

Maximum Seated Height: 1.2 mm

A low seated height is crucial for space-constrained designs, enabling integration into devices with limited vertical space.

RAM Words: 724992

A considerable RAM capacity allows for greater data storage and more complex processing capabilities, enhancing overall performance.

Width: 10 mm

A compact width makes it suitable for space-limited applications while maintaining functionality and performance.

Boundary Scan: YES

Boundary scan support aids in testing and debugging, making the integration and maintenance of the microprocessor easier.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz allows for fast processing speeds, making it suitable for applications requiring quick response times.

Length: 10 mm

A compact length aligns with modern design requirements for space efficiency without sacrificing performance.

Temperature Grade: AUTOMOTIVE

Rated for automotive applications, this product is designed for durability and reliability under rigorous conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

As a RISC microprocessor, it utilizes a simplified instruction set, enhancing speed and efficiency in processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microprocessor energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form supports better soldering and connection stability, reducing the risk of mechanical failure.

Maximum Supply Current: 100 mA

With a maximum supply current of 100 mA, it ensures low energy consumption while providing enough power for operation.

Nominal Supply Voltage: 1.2 V

Operating at a nominal voltage of 1.2 V further supports energy efficiency, making it suitable for battery-powered devices.

No. of DMA Channels: 48

Having multiple DMA channels allows for efficient data transfer without CPU intervention, enhancing the processing speed.

No. of Serial I/Os: 8

Eight serial I/O channels provide ample interfacing options for communication with other devices, increasing versatility.

Terminal Pitch: 0.65 mm

A smaller terminal pitch accommodates more terminals in a compact space, making it effective for high-density applications.

Format: FLOATING-POINT

The floating-point format allows for accurate representation of a wide range of values, particularly beneficial for mathematical computations.

Speed: 650 rpm

A speed of 650 rpm indicates efficient and reliable operation across various tasks, enhancing productivity.

Low Power Mode: YES

The availability of a low power mode aids in energy conservation, making the microprocessor suitable for battery-operated devices.

Technical Specifications

Microprocessors STM32MP151AAD3T attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Additional Features:

"TERM PITCH-MAX"

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B257

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

48

No. of Serial I/Os:

8

No. of Terminals:

257

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA257,19X19,25/20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Words:

724992

Maximum Seated Height:

1.2 mm

Speed:

650 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

1.25 V

Minimum Supply Voltage:

1.18 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM32MP151AAD3T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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