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MCIMX6U1AVM10AD

NXP Semiconductors

MCIMX6U1AVM10AD by NXP Semiconductors

MCIMX6U1AVM10AD by NXP is a Microprocessor with 64-bit External Data Bus, 16-bit Address Bus, and integrated cache. Ideal for automotive applications due to its low power mode, CMOS technology, and operating temperature range of -40 to 125 °C. Features boundary scan capability and a compact package style with 624 terminals in a square shape.

Median Price

$46.714

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 450 parts In-Stock

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DigiKey

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Verical

USA . 152 parts In-Stock

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Vyrian

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Digiode

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Nova Conductors

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Anansix

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Corohmni

South Africa . 164 parts In-Stock

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$21.817

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Ampacity Inc.

Singapore . 140 parts In-Stock

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Microchip USA

USA . 1,293 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 21,423 parts In-Stock

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UNI Independent Distributors

Spain . 2,652 parts In-Stock

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Netroflash

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Overview

Discover the power and innovation of the MCIMX6U1AVM10AD by NXP Semiconductors, a cutting-edge microprocessor designed to elevate your projects to new heights. With NXP's reputation for quality and reliability, this processor offers seamless integration and top-notch performance in a wide range of applications. From automotive to industrial settings, this microprocessor delivers unparalleled value, efficiency, and speed, making it the perfect choice for tech-savvy customers looking to stay ahead of the curve. Elevate your projects with the MCIMX6U1AVM10AD and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and reliability for the microprocessor, making it suitable for long-term use.

Integrated Cache: YES

Having integrated cache improves the performance and speed of the microprocessor by allowing quick access to frequently used data.

Maximum Supply Voltage: 1.5 V

Operating within a maximum supply voltage of 1.5V ensures efficient power usage and prevents overheating of the microprocessor.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computing) microprocessor allows for faster execution of instructions, enhancing overall performance.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the microprocessor energy-efficient and suitable for various applications.

Technical Specifications

Microprocessors MCIMX6U1AVM10AD attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B624

JESD-609 Code:

e1

Length:

21 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

624

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Speed:

1000 rpm

Maximum Supply Voltage:

1.5 V

Minimum Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

21 mm

Peripheral IC Type:

Trade Compliance

MCIMX6U1AVM10AD Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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