Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MT9HTF12872PZ-667H1
Micron Technology
DRAMs; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.45 ns
333 MHz
COMMON
R-PDMA-N240
e4
9663676416 bit
72
240
134217728 words
128M
70 Cel
0 Cel
128MX72
3-STATE
PLASTIC/EPOXY
DIMM
DIMM240,40
RECTANGULAR
MICROELECTRONIC ASSEMBLY
1.8
Not Qualified
8192
.063 Amp
Other Memory ICs
1665 mA
NO
CMOS
COMMERCIAL
GOLD
NO LEAD
1 mm
DUAL
MT9HTF12872RHZ-80EH1
DRAMs; Temperature Grade: COMMERCIAL; No. of Terminals: 200; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.4 ns
400 MHz
R-PDMA-N200
200
DIMM200,24
260
1890 mA
.6 mm
30
MT9HVF12872PKZ-80EH1
DRAMs; Temperature Grade: COMMERCIAL; No. of Terminals: 244; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PDMA-N244
244
DIMM244,24
3015 mA
MT48LC32M8A2P-6AIT:G
Micron Technology's MT48LC32M8A2P-6AIT:G is a 32MX8 DRAM with 3.3V supply, operating at 167MHz clock frequency. Ideal for industrial applications, it offers synchronous operation, self-refresh capability, and a small outline package style.
FOUR BANK PAGE BURST
5.4 ns
AUTO/SELF REFRESH
167 MHz
1,2,4,8
R-PDSO-G54
e3
22.22 mm
268435456 bit
SYNCHRONOUS DRAM
8
1
54
33554432 words
32M
SYNCHRONOUS
85 Cel
-40 Cel
32MX8
TSOP2
TSOP54,.46,32
SMALL OUTLINE, THIN PROFILE
3.3
1.2 mm
YES
1,2,4,8,FP
.0025 Amp
DRAMs
100 mA
3.6 V
3 V
INDUSTRIAL
MATTE TIN
GULL WING
.8 mm
10.16 mm
MT48LC2M32B2TG-6A:J
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 86; Package Code: TSOP2; Refresh Cycles: 4096; Package Shape: RECTANGULAR;
166 MHz
R-PDSO-G86
e0
67108864 bit
32
86
2097152 words
2M
2MX32
TSSOP86,.46,20
4096
180 mA
TIN LEAD
.5 mm
MT41K512M16TNA-107:E
DDR3L DRAM; No. of Terminals: 96; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR; Memory Width: 16;
MULTI BANK PAGE BURST
934.5 MHz
4,8
R-PBGA-B96
e1
14 mm
8589934592 bit
DDR3L DRAM
16
96
536870912 words
512M
512MX16
TFBGA
BGA96,6X16,32
GRID ARRAY, THIN PROFILE, FINE PITCH
1.283 V
1.45 V
1.35
Tin/Silver/Copper (Sn/Ag/Cu)
BALL
BOTTOM
10 mm
MT41K512M16TNA-125IT:E
Micron Technology's MT41K512M16TNA-125IT:E is a DDR3L DRAM with 512MX16 organization, operating at 800 MHz clock frequency. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for industrial applications requiring high memory density and fast data access.
800 MHz
95 Cel
1.425 V
TIN SILVER COPPER
MT9JSF25672AZ-1G9K1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.575 V;
SINGLE BANK PAGE BURST
SELF REFRESH; WD-MAX
R-XDMA-N240
133.35 mm
19327352832 bit
DDR DRAM MODULE
268435456 words
256M
256MX72
UNSPECIFIED
30.5 mm
1.575 V
1.5
2.7 mm
MT41K128M16HA-15EIT:D
DDR3L DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 96; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.255 ns
667 MHz
2147483648 bit
128MX16
BGA96,9X16,32
.012 Amp
425 mA
9 mm
MT41K256M8DA-107IT:K
DDR3L DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 78; Package Code: TFBGA; Package Shape: RECTANGULAR; Length: 10.5 mm;
AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY
R-PBGA-B78
10.5 mm
78
256MX8
8 mm
MT42L16M32D1AC-25AAT:A
LPDDR2 DRAM; No. of Terminals: 134; Package Code: VFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B134; JESD-609 Code: e1;
5.5 ns
SELF REFRESH
R-PBGA-B134
11.5 mm
536870912 bit
LPDDR2 DRAM
134
16777216 words
16M
16MX32
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
1.95 V
1.7 V
.65 mm
MT42L16M32D1AC-25AIT:A
LPDDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 134; Package Code: VFBGA; Package Shape: RECTANGULAR; Length: 11.5 mm;
MTA9ASF51272AZ-2G1A1
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 284; Package Code: DIMM; Package Shape: RECTANGULAR; No. of Words: 536870912 words;
AUTO/SELF REFRESH; WD-MAX
R-XDMA-N284
38654705664 bit
DDR4 DRAM MODULE
284
512MX72
31.38 mm
1.26 V
1.14 V
1.2
OTHER
2.61 mm
MT42L128M32D1GU-18WT:A
LPDDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 134; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
SELF REFRESH; IT ALSO REQUIRES 1.2V NOM
533 MHz
4,8,16
4294967296 bit
-30 Cel
128MX32
BGA134,10X17,25
1.2,1.8
.7 mm
.0001 Amp
220 mA
W9751G6KB25I
Winbond Electronics
W9751G6KB25I by Winbond Electronics is a DDR2 DRAM with 32MX16 organization, operating at up to 400 MHz. It features a 32M word code, operates at 1.8V, and has a max clock frequency of 400 MHz. Ideal for industrial applications requiring high-speed memory performance in a compact form factor.
R-PBGA-B84
12.5 mm
DDR2 DRAM
84
32MX16
BGA84,9X15,32
.008 Amp
200 mA
1.9 V
MT48LC8M8A2P-6A:J
Micron Technology's MT48LC8M8A2P-6A:J is a 3.3V Synchronous DRAM with 8MX8 organization, operating at 167MHz clock frequency. It features common I/O type, self-refresh mode, and 4096 refresh cycles. Ideal for commercial applications requiring high-speed memory access in a compact form factor.
8388608 words
8M
8MX8
150 mA
MT47H64M16HR-25E:HTR
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Words Code: 64K;
1048576 bit
65536 words
64K
64KX16
MT9KSF51272HZ-1G6E1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 204; Package Code: DIMM; Package Shape: RECTANGULAR; Width: 3.8 mm;
AUTO/SELF REFRESH; WD-MAX; ALSO OPERATES AT 1.5V NOMINAL SUPPLY
R-XZMA-N204
67.6 mm
204
30.15 mm
ZIG-ZAG
3.8 mm
MTA18ADF1G72PZ-2G1A1
DDR DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Terminal Form: NO LEAD;
R-XDMA-N288
77309411328 bit
288
1073741824 words
1G
1GX72
18.9 mm
3.9 mm
MTA18ASF1G72HZ-2G1A1
Micron Technology's MTA18ASF1G72HZ-2G1A1 DDR DRAM MODULE offers 1GX72 organization, 72-bit memory width, and operates at 1.2V. Ideal for servers and high-performance computing applications due to its synchronous operation and self-refresh capability.
DUAL BANK PAGE BURST
R-XZMA-N260
69.6 mm
NOT SPECIFIED
30.13 mm
3.7 mm
MTA18ASF1G72PDZ-2G1A1
DDR DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.2;
31.4 mm
MTA36ASF2G72LZ-2G1A1
DDR DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Memory Width: 72;
154618822656 bit
2147483648 words
2G
2GX72
MT41J128M16JT-093J:K
DDR3 DRAM; No. of Terminals: 96; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Words: 134217728 words; Operating Mode: SYNCHRONOUS;
DDR3 DRAM
IS43TR16128B-15HBLI
Integrated Silicon Solution
IS43TR16128B-15HBLI by Integrated Silicon Solution is a 128MX16 DDR3 DRAM with 667 MHz clock frequency. It operates asynchronously, supports self-refresh, and has a common I/O type. Ideal for industrial applications requiring high memory density and fast access times.
13 mm
ASYNCHRONOUS
.014 Amp
286 mA
W971GG6KB25I
Winbond Electronics' W971GG6KB25I is a 64MX16 DDR2 DRAM with 400 MHz clock frequency, 1.8V supply, and 84 terminals in a grid array package. It operates synchronously with self-refresh capability and offers multi-bank page burst access mode. Ideal for high-speed memory applications requiring low power consumption and compact design.
1073741824 bit
67108864 words
64M
64MX16
185 mA
MT8KTF25664HZ-1G6M1
Micron Technology's MT8KTF25664HZ-1G6M1 is a 256MX64 DDR DRAM MODULE with 800 MHz clock frequency. Operating at 1.35V, it features synchronous mode and self-refresh capability. Ideal for applications requiring high-speed memory performance in commercial temperature environments.
17179869184 bit
64
256MX64
DIMM204,24
.096 Amp
1760 mA
Gold (Au)
MT46H128M16LFDD-48AIT:C
LPDDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
4.8 ns
208 MHz
2,4,8,16
R-PBGA-B60
LPDDR1 DRAM
60
BGA60,9X10,32
AEC-Q100
.00001 Amp
90 mA
MT48LC4M32B2B5-6AIT:L
Micron Technology's MT48LC4M32B2B5-6AIT:L is a 4MX32 SDRAM with 3.3V supply, operating at 166MHz clock frequency. It features synchronous operation, self-refresh capability, and industrial temperature grade suitability. Ideal for applications requiring high-speed memory access in industrial environments.
R-PBGA-B90
134217728 bit
90
4194304 words
4M
4MX32
BGA90,9X15,32
MT41K256M16HA-125IT:ETR
Micron Technology's MT41K256M16HA-125IT:ETR is a DDR3L DRAM with 256MX16 organization, operating at 1.35V. It features synchronous mode, self-refresh capability, and multi-bank page burst access. Suitable for applications requiring high memory density and fast data processing in compact devices.
256MX16
MT47H128M8CF-3AAT:H
DDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
105 Cel
128MX8
W9864G6KH-6I
The Winbond Electronics W9864G6KH-6I is a 4MX16 Synchronous DRAM with 67108864-bit memory density. Operating at 3.3V, it features a max access time of 5ns and supports four bank page burst access mode. Ideal for commercial applications requiring high-speed memory solutions in compact form factors.
5 ns
4MX16
TM124BBK32-80
Texas Instruments
TM124BBK32-80 by Texas Instruments is a 1MX32 DRAM module with 1048576 words, 32-bit memory width, and 33554432 bit memory density. It operates in asynchronous mode with a max access time of 80 ns. Ideal for applications requiring fast page access and common I/O type in microelectronic assemblies.
FAST PAGE
80 ns
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
R-XSMA-N72
33554432 bit
FAST PAGE DRAM MODULE
1048576 words
1M
1MX32
SIMM
SSIM72
5
1024
25.527 mm
640 mA
5.5 V
4.5 V
1.27 mm
SINGLE
TM124BBK32S-80
TM124BBK32S-80 by Texas Instruments is a 1MX32 DRAM module with 1048576 words, 32-bit memory width, and 33554432 bit memory density. It operates in FAST PAGE access mode with an 80 ns max access time. Ideal for commercial applications requiring high-speed data storage and retrieval.
SMJ44400-10HMM
SMJ44400-10HMM by Texas Instruments is a 1MX4 FAST PAGE DRAM with 1048576 words, operating at 5V. It features a max access time of 100ns, refresh cycles of 1024, and supports common I/O type. Ideal for military applications due to its MIL-STD screening levels and small outline package style.
100 ns
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
R-CDSO-N20
17.78 mm
4194304 bit
FAST PAGE DRAM
4
20
125 Cel
-55 Cel
1MX4
CERAMIC, METAL-SEALED COFIRED
SON
SOLCC20/26,.4
SMALL OUTLINE
38535Q/M;38534H;883B
2.337 mm
.004 Amp
75 mA
MILITARY
SMJ44400-80HMM
SMJ44400-80HMM by Texas Instruments is a 1MX4 FAST PAGE DRAM with 1048576 words, operating at 5V. It features a max access time of 80ns, refresh cycles of 1024, and military-grade temperature range. Ideal for applications requiring high-speed memory operations in harsh environments.
85 mA
TMS48C121-10DZ
TMS48C121-10DZ by Texas Instruments is a 128Kx8 DRAM with 131072 words, operating at 5V. It features an asynchronous mode, 100ns access time, and 512 refresh cycles. Ideal for video applications due to its small outline package and CMOS technology.
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 256 X 8 SAM PORT
R-PDSO-J40
26.035 mm
VIDEO DRAM
2
40
131072 words
128K
128KX8
SOJ
SOJ40,.44
512
3.76 mm
.01 Amp
95 mA
J BEND
TMS48C128-80DJ
TMS48C128-80DJ by Texas Instruments is a 128Kx8 FAST PAGE DRAM with 80ns access time, operating at 5V. It features 3-STATE output characteristics and consumes up to 80mA. Ideal for applications requiring high-speed memory operations in commercial temperature environments.
R-PDSO-J24
17.145 mm
24
SOJ24/26,.34
.002 Amp
80 mA
7.57 mm
TMS626402-12DGE
TMS626402-12DGE by Texas Instruments is a 4MX4 Synchronous DRAM with 16777216 bit memory density. Operating at 3.3V, it offers dual bank page burst access mode and self-refresh capability. Ideal for commercial applications requiring high-speed data processing in compact devices.
CAS BEFORE RAS/SELF REFRESH
R-PDSO-G44
18.41 mm
16777216 bit
44
4MX4
TMS44165-70DZ
TMS44165-70DZ by Texas Instruments is a 256Kx16 DRAM with 70ns access time, operating at 5V. It features asynchronous mode, common I/O type, and 3-state output characteristics. Ideal for applications requiring fast page access in commercial temperature grades.
70 ns
262144 words
256K
256KX16
.001 Amp
120 mA
TM248NBK36R-80
TM248NBK36R-80 by Texas Instruments is a 2MX36 DRAM module with 75497472-bit memory density. It operates at 5V, has a memory width of 36, and offers fast page access mode. Ideal for applications requiring high-speed data storage in commercial temperature environments.
75497472 bit
36
2MX36
.018 Amp
1440 mA
TM4100EAD9-80
TM4100EAD9-80 by Texas Instruments is a 4MX9 DRAM module with 37748736-bit memory density. It operates asynchronously at 5V, featuring self-refresh capability and fast page access mode. Ideal for applications requiring high-speed data storage in commercial temperature environments.
R-XSMA-N30
37748736 bit
9
4MX9
SIM30
20.447 mm
.009 Amp
720 mA
2.54 mm
TM4100GAD8-80
TM4100GAD8-80 by Texas Instruments is a 4MX8 DRAM module with 3-STATE output, operating at 5V. It features ASYNCHRONOUS mode, FAST PAGE access, and self-refresh capability. Ideal for applications requiring fast memory access and common I/O type in microelectronic assemblies.
4MX8
SMJ4416-15JDL
SMJ4416-15JDL by Texas Instruments is a 16KX4 PAGE MODE DRAM with 16384 words, operating at 5V. It features 3-STATE output, asynchronous mode, and common I/O type. Ideal for applications requiring fast access times and high memory density in commercial temperature environments.
PAGE
150 ns
RAS ONLY REFRESH
R-CDIP-T18
22.606 mm
65536 bit
PAGE MODE DRAM
18
16384 words
16K
16KX4
DIP
DIP18,.3
IN-LINE
256
5.08 mm
NMOS
THROUGH-HOLE
7.62 mm
MT47H128M8SH-187E:M
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 60; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.35 ns
BGA60,9X11,32
MT47H256M4SH-25E:M
256MX4
MT47H64M16NF-187E:M
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
MT36HTF51272PZ-80EH1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
4 mm
.252 Amp
6150 mA
30.175 mm
MT36HVS51272PZ-80EH1
DDR DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
6246 mA
17.9 mm
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