Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Add filters
All
Selected
MT47H128M8HQ-3IT:G
Micron Technology
DDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
MULTI BANK PAGE BURST
.45 ns
AUTO/SELF REFRESH
333 MHz
COMMON
4,8
R-PBGA-B60
e1
11.5 mm
1073741824 bit
DDR2 DRAM
8
1
60
134217728 words
128M
SYNCHRONOUS
85 Cel
-40 Cel
128MX8
3-STATE
PLASTIC/EPOXY
TFBGA
BGA60,9X11,32
RECTANGULAR
GRID ARRAY, THIN PROFILE, FINE PITCH
1.8
Not Qualified
8192
1.2 mm
YES
DRAMs
280 mA
1.9 V
1.7 V
CMOS
INDUSTRIAL
TIN SILVER COPPER
BALL
.8 mm
BOTTOM
8 mm
MT47H128M8HQ-3L:G
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 60; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
0 Cel
OTHER
MT47H64M16HR-25EIT:G
Micron Technology's MT47H64M16HR-25EIT:G is a DDR2 DRAM with 64MX16 organization, operating at 400 MHz. It features a 1.8V supply voltage and supports multi-bank page burst access mode. Ideal for industrial applications requiring high-speed synchronous memory with common I/O type and self-refresh capability.
.4 ns
400 MHz
R-PBGA-B84
12.5 mm
16
84
67108864 words
64M
64MX16
BGA84,9X15,32
.007 Amp
440 mA
MT47H64M16HR-25EL:G
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
MT47H64M16HR-3IT:G
Micron Technology's MT47H64M16HR-3IT:G is a DDR2 DRAM with 64MX16 organization, operating at 333 MHz. It features a thin profile grid array package and operates in industrial temperature range. Suitable for applications requiring high-speed synchronous memory with common I/O type and self-refresh capability.
260
350 mA
Tin/Silver/Copper (Sn/Ag/Cu)
30
MT47H64M16HR-3L:G
Micron Technology's MT47H64M16HR-3L:G is a DDR2 DRAM with 64MX16 organization, operating at 333 MHz. It features a 1.8V supply voltage and offers multi-bank page burst access mode. This memory module is suitable for applications requiring high-speed synchronous operation in electronic devices.
MT46H32M32LFCM-5IT:A
LPDDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
FOUR BANK PAGE BURST
5 ns
200 MHz
2,4,8,16
R-PBGA-B90
13 mm
LPDDR1 DRAM
32
90
33554432 words
32M
32MX32
VFBGA
BGA90,9X15,32
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
1 mm
.00001 Amp
150 mA
1.95 V
10 mm
MT46H32M32LFCM-6LIT:A
5.5 ns
166 MHz
140 mA
MT46H64M16LFCK-5IT:A
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
DDR1 DRAM
BGA60,9X10,32
130 mA
MT46H64M16LFCK-5LIT:A
MT18HTF25672AZ-667H1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
DUAL BANK PAGE BURST
R-XDMA-N240
133.35 mm
19327352832 bit
DDR DRAM MODULE
72
240
268435456 words
256M
70 Cel
256MX72
UNSPECIFIED
DIMM
DIMM240,40
MICROELECTRONIC ASSEMBLY
30.5 mm
.126 Amp
Other Memory ICs
1728 mA
NO
COMMERCIAL
NO LEAD
DUAL
30 mm
MT18HTF25672PZ-667H1
DDR DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
SINGLE BANK PAGE BURST
e4
ASYNCHRONOUS
3330 mA
GOLD
30.175 mm
MT47H128M16RT-187E:C
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: TFBGA; Package Shape: RECTANGULAR; Self Refresh: YES;
.35 ns
2147483648 bit
128MX16
9 mm
MT47H128M16RT-25EAAT:C
Micron Technology's MT47H128M16RT-25EAAT:C is a DDR2 DRAM with 128MX16 organization, operating at 400 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for industrial applications requiring high memory density and fast access times.
105 Cel
AEC-Q100
.012 Amp
330 mA
MT47H128M16RT-3:C
Micron Technology's MT47H128M16RT-3:C is a DDR2 DRAM with 128MX16 organization, operating at 1.8V. It features synchronous operation, self-refresh capability, and multi-bank page burst access mode. Ideal for applications requiring high memory density and fast data processing in devices like computers and networking equipment.
MT47H256M8EB-187E:C
533 MHz
256MX8
MT47H256M8EB-3:C
225 mA
MT47H512M4EB-187E:C
4
536870912 words
512M
512MX4
MT47H512M4EB-25E:C
250 mA
MT47H512M4EB-3:C
MT47R256M8EB-25E:C
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 60; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Ports: 1;
MT47R512M4EB-25E:C
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 60; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
MT16LSDF6464HY-133D2
SYNCHRONOUS DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: DIMM; Package Shape: RECTANGULAR; Package Style (Meter): MICROELECTRONIC ASSEMBLY;
5.4 ns
R-XZMA-N144
67.585 mm
4294967296 bit
SYNCHRONOUS DRAM MODULE
64
144
65 Cel
64MX64
3.8 mm
3.6 V
3 V
3.3
ZIG-ZAG
31.75 mm
MT8LSDT6464HIY-133C1
SYNCHRONOUS DRAM MODULE; Temperature Grade: INDUSTRIAL; No. of Terminals: 144; Package Code: DIMM; Package Shape: RECTANGULAR; Surface Mount: NO;
MT18VDVF12872Y-40BD4
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 184; Package Code: DIMM; Package Shape: RECTANGULAR; Memory Density: 9663676416 bit;
R-XDMA-N184
9663676416 bit
184
128MX72
4 mm
2.7 V
2.5 V
2.6
18.29 mm
MT16JTF25664AY-1G4D1
667 MHz
R-PDMA-N240
17179869184 bit
256MX64
1.5,3.3
.16 Amp
4640 mA
MT8JSF12864HY-1G4D1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 204; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PDMA-N204
8589934592 bit
204
128MX64
DIMM204,24
.08 Amp
3920 mA
.6 mm
MT16JSF25664HY-1G4D1
Micron Technology's MT16JSF25664HY-1G4D1 is a 256MX64 DDR DRAM MODULE with 17179869184-bit memory density. Operating at 1.5V, it features synchronous mode and self-refresh capability. Ideal for commercial applications, this rectangular package offers dual bank page burst access mode and CMOS technology.
R-XZMA-N204
1.575 V
1.425 V
1.5
Gold (Au)
MT4HTF6464AY-667E1
.028 Amp
1400 mA
MT16HTF25664AY-667E1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Terminal Position: DUAL;
MT8HTF12864HDY-667E1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 200; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PDMA-N200
200
DIMM200,24
.056 Amp
2160 mA
MT4HTF6464HY-667E1
MT18HTF6472Y-40EB2
.6 ns
4831838208 bit
64MX72
.09 Amp
4140 mA
MT41J512M8THU-15E:A
Micron Technology's MT41J512M8THU-15E:A is a DDR3 DRAM with 512MX8 organization, operating at 1.5V. It features synchronous operation, self-refresh capability, and dual bank page burst access mode. Ideal for applications requiring high memory density and fast data processing in a compact form factor.
R-PBGA-B82
15 mm
DDR3 DRAM
82
512MX8
LFBGA
GRID ARRAY, LOW PROFILE, FINE PITCH
1.35 mm
MT46H16M16LFBF-6IT:ATR
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: VFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
268435456 bit
16777216 words
16M
16MX16
MT46H16M32LFCM-6IT:BTR
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: VFBGA; Package Shape: RECTANGULAR; No. of Words: 16777216 words;
6 ns
536870912 bit
16MX32
MT46H32M16LFBF-6IT:BTR
Micron Technology's MT46H32M16LFBF-6IT:BTR is a DDR1 DRAM with 32MX16 organization, 33554432 words, and 536870912 bit memory density. It operates synchronously at a max temperature of 85°C and is ideal for industrial applications requiring fast access times and low power consumption.
32MX16
MT46V16M16P-5BIT:KTR
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
.7 ns
R-PDSO-G66
e3
22.22 mm
66
TSSOP
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
MATTE TIN
GULL WING
.65 mm
10.16 mm
MT46V32M16P-5B:FTR
MT46V32M16P-5B:FTR by Micron Technology is a DDR1 DRAM with 32MX16 organization and 33554432 words. It operates synchronously, has self-refresh capability, and a max access time of 0.7 ns. It is commonly used in applications requiring high-speed memory such as computers and servers.
Matte Tin (Sn)
MT46V32M16P-5BIT:FTR
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: TSSOP; Package Shape: RECTANGULAR; Width: 10.16 mm;
MT46V32M16P-6T:FTR
DDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: TSSOP; Package Shape: RECTANGULAR; Length: 22.22 mm;
3
2.3 V
2.5
MT46V32M16TG-6T:FTR
DDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: TSSOP; Package Shape: RECTANGULAR; No. of Functions: 1;
e0
TIN LEAD
MT46V32M8P-6T:GTR
DDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: TSSOP; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel;
32MX8
MT46V64M8FN-6IT:FTR
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: TBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
64MX8
TBGA
GRID ARRAY, THIN PROFILE
TIN LEAD SILVER
MT46V64M8P-6T:DTR
DDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: TSSOP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
MT46V64M8P-6T:FTR
DDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 66; Package Code: TSSOP; Package Shape: RECTANGULAR; Technology: CMOS;
MT48H16M32LFCM-75IT:ATR
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: VFBGA; Package Shape: RECTANGULAR; Memory Density: 536870912 bit;
SYNCHRONOUS DRAM
MT48LC16M16A2BG-75IT:DTR
Micron Technology's MT48LC16M16A2BG-75IT:DTR is a 16MX16 Synchronous DRAM with 268Mbit memory density. It operates at 3.3V, has a max access time of 5.4ns, and supports four bank page burst access mode. Ideal for industrial applications requiring high-speed memory with low power consumption.
R-PBGA-B54
14 mm
54
© 2023 All rights reserved
