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MT41J512M8THU-15E:A

Micron Technology

MT41J512M8THU-15E:A by Micron Technology

Micron Technology's MT41J512M8THU-15E:A is a DDR3 DRAM with 512MX8 organization, operating at 1.5V. It features synchronous operation, self-refresh capability, and dual bank page burst access mode. Ideal for applications requiring high memory density and fast data processing in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,743 parts In-Stock

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Chip Stock

USA . 5,210 parts In-Stock

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Digiode

USA . 460 parts In-Stock

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460

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Nova Conductors

Japan . 94 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 198 parts In-Stock

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$17.000

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198

$17.000

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AZTECH Wire

Italy . 46 parts In-Stock

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$17.100

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A-Z Elektronik GmbH

Germany . 7,082 parts In-Stock

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Corphita

USA . 1,661 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Futuretech Components

Singapore . 800 parts In-Stock

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Kepictronics

USA . 596 parts In-Stock

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Microchip USA

USA . 321 parts In-Stock

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Overview

Experience lightning-fast performance and seamless multitasking with the MT41J512M8THU-15E:A from Micron Technology. As a leading manufacturer in the industry, Micron delivers top-quality DRAM products that are perfect for a wide range of applications. Whether you're a gamer looking to boost your system's speed or a professional needing reliable memory for your work, this DDR3 DRAM offers unmatched value and benefits. Say goodbye to lag and hello to improved efficiency with Micron's innovative technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, ensuring the product's longevity and stability.

Surface Mount: YES

Ease of installation and compact design make it suitable for various applications and space-constrained environments.

Operating Mode: SYNCHRONOUS

Synchronous operation helps in maintaining high data transfer rates and efficient performance.

Nominal Supply Voltage / Vsup (V): 1.5

Operating at a stable voltage ensures reliable and consistent performance.

No. of Terminals: 82

Having a sufficient number of terminals allows for proper connectivity and communication within the system.

Maximum Operating Temperature: 85 °C

Ability to withstand high temperatures ensures stability and reliability even under demanding conditions.

Organization: 512MX8

Organized in a 512MX8 configuration for efficient data storage and retrieval capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making the product energy-efficient and fast.

No. of Words: 536870912 words

High word count enables ample storage capacity for data-intensive applications.

Memory Width: 8

Wider memory width allows for faster data transfer rates and better performance.

Technical Specifications

DRAM MT41J512M8THU-15E:A attributes and parameters. Explore more DRAM devices from Micron Technology

Specs

Access Mode:

DUAL BANK PAGE BURST

Additional Features:

AUTO/SELF REFRESH

JESD-30 Code:

R-PBGA-B82

JESD-609 Code:

e1

Length:

15 mm

Memory Density:

4294967296 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

82

No. of Words:

536870912 words

No. of Words Code:

512M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.35 mm

Self Refresh:

YES

Maximum Supply Voltage (Vsup):

1.575 V

Minimum Supply Voltage (Vsup):

1.425 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12.5 mm

Trade Compliance

MT41J512M8THU-15E:A Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.36

SB

8542.32.00.23

PCN

Manufacturer Highlights

Micron Technology

Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.

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Management team

President, CEO

Sanjay Mehrotra

Executive VP, CFO

Mark J. Murphy

Executive VP, CBO

Sumit Sadana

Manufacturer fab locations 23

Fab name Location Fab Initiation Wafer Capacity

Fab 4

Fabrication

Fab Initiation

1994

USA

Boise

Wafer Capacity

8,750

1994

8,750

Fab 6

Fabrication

Fab Initiation

1997

USA

Manassas

Wafer Capacity

23,000

1997

23,000

Fab 6

Fabrication

Fab Initiation

2006

USA

Manassas

Wafer Capacity

28,000

2006

28,000

Fab 11

Fabrication

Fab Initiation

2007

Taiwan

Taoyuan

Wafer Capacity

34,000

2007

34,000

Fab 16 A1

Fabrication

Fab Initiation

2007

Taiwan

Taichung

Wafer Capacity

50,000

2007

50,000

Fab 16 A3

Fabrication

Fab Initiation

2021

Taiwan

Taichung

Wafer Capacity

3,000

2021

3,000

Fab 15

Fabrication

Fab Initiation

2002

Japan

Hiroshima

Wafer Capacity

98,000

2002

98,000

Fab 11

Fabrication

Fab Initiation

2004

Taiwan

Taoyuan

Wafer Capacity

34,000

2004

34,000

New Hiroshima DRAM Fab

Fabrication

Fab Initiation

-

Japan

Hiroshima

Wafer Capacity

-

Fab 4

Fabrication

Fab Initiation

2017

USA

Boise

Wafer Capacity

11,750

2017

11,750

Fab 10W

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

20,000

2016

20,000

Fab 10X

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

55,000

2016

55,000

Fab 15

Fabrication

Fab Initiation

2019

Japan

Hiroshima

Wafer Capacity

18,000

2019

18,000

Fab 10A

Fabrication

Fab Initiation

2019

Singapore

Singapore

Wafer Capacity

18,000

2019

18,000

Fab 10N

Fabrication

Fab Initiation

2014

Singapore

Singapore

Wafer Capacity

47,000

2014

47,000

Fab 11

Fabrication

Fab Initiation

2000

Taiwan

Taoyuan

Wafer Capacity

32,000

2000

32,000

Fab 4

Fabrication

Fab Initiation

2012

USA

Boise

Wafer Capacity

6,000

2012

6,000

Fab 16 A2

Fabrication

Fab Initiation

2015

Taiwan

Taichung

Wafer Capacity

43,000

2015

43,000

New Clay Fab Phase 1

Fabrication

Fab Initiation

2027

USA

Clay

Wafer Capacity

2027

New Boise Fab 1

Fabrication

Fab Initiation

2025

USA

Boise

Wafer Capacity

2025

Fab 15

Fabrication

Fab Initiation

2021

Japan

Hiroshima

Wafer Capacity

2021

Fab 16 A5

Fabrication

Fab Initiation

2028

Taiwan

Taichung

Wafer Capacity

2028

Expansion Fab

Fabrication

Fab Initiation

2020

USA

Manassas

Wafer Capacity

6,000

2020

6,000

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