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W971GG6KB25I

Winbond Electronics

W971GG6KB25I by Winbond Electronics

Winbond Electronics' W971GG6KB25I is a 64MX16 DDR2 DRAM with 400 MHz clock frequency, 1.8V supply, and 84 terminals in a grid array package. It operates synchronously with self-refresh capability and offers multi-bank page burst access mode. Ideal for high-speed memory applications requiring low power consumption and compact design.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 35,180 parts In-Stock

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Vyrian

USA . 6,894 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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AZTECH Wire

Italy . 616 parts In-Stock

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$7.267

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S.R.D Solutions

India . 105,000 parts In-Stock

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Futuretech Components

Singapore . 10,901 parts In-Stock

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Perfect Parts

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Kepictronics

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Aranea Global

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Overview

Experience unparalleled performance and reliability with the W971GG6KB25I by Winbond Electronics. As a leading manufacturer in the industry, Winbond Electronics delivers top-notch DRAM products that guarantee seamless operation and efficiency. Ideal for a wide range of applications, this DDR2 DRAM offers unmatched value to customers seeking high-quality memory solutions. Trust Winbond Electronics to provide you with the best-in-class technology that meets all your performance needs. Elevate your system's capabilities with the W971GG6KB25I today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DRAM, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and coordination, improving overall performance.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at an efficient voltage level, reducing power consumption and heat generation.

Maximum Clock Frequency (fCLK): 400 MHz

High clock frequency allows for fast data transfer rates, enhancing system speed and responsiveness.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it an energy-efficient and reliable option.

Memory IC Type: DDR2 DRAM

DDR2 technology provides improved performance and increased data transfer rates compared to earlier DRAM versions.

Refresh Cycles: 8192

Efficient refresh cycles help maintain data integrity and reliability over extended periods of use.

Maximum Access Time: 0.4 ns

Low access time ensures quick access to stored data, improving overall system responsiveness.

Technical Specifications

DRAM W971GG6KB25I attributes and parameters. Explore more DRAM devices from Winbond Electronics

Specs

Access Mode:

MULTI BANK PAGE BURST

Maximum Access Time:

.4 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

400 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

4,8

JESD-30 Code:

R-PBGA-B84

Length:

12.5 mm

Memory Density:

1073741824 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

84

No. of Words:

67108864 words

No. of Words Code:

64M

Operating Mode:

SYNCHRONOUS

Organization:

64MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA84,9X15,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8

Qualification:

Not Qualified

Refresh Cycles:

Maximum Seated Height:

1.2 mm

Self Refresh:

YES

Sequential Burst Length:

4,8

Maximum Standby Current:

.008 Amp

Sub-Category:

DRAMs

Maximum Supply Current:

185 mA

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8 mm

Trade Compliance

W971GG6KB25I Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.32

SB

8542.32.00.15

PCN

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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