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XCZU6CG-2FFVC900I

Xilinx

XCZU6CG-2FFVC900I by Xilinx

The Xilinx XCZU6CG-2FFVC900I is a CMOS microprocessor circuit with 900 terminals in a grid array package. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. Ideal for industrial applications requiring high-performance processing capabilities.

Median Price

$3,998.590

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Mouser Electronics

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Digiode

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AZTECH Wire

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MARBEL Systems

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Texas Native Microelectronics

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Corohmni

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Modulus Dynamics

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Kenton Components

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One Stop Electronics

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Semicontronic

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Corphita

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Overview

Discover the power of innovation with the XCZU6CG-2FFVC900I by Xilinx. As a leader in the industry, Xilinx delivers top-quality products that exceed expectations. This versatile microprocessor circuit offers endless possibilities for various applications, providing customers with unparalleled performance and reliability. Experience the value and benefits of cutting-edge technology with the XCZU6CG-2FFVC900I and unlock new opportunities for success. Trust Xilinx to deliver excellence every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY provides good protection for the internal components and helps in maintaining the overall durability of the product.

Surface Mount: YES

Surface mount technology allows for easier and more efficient installation of the product on circuit boards.

Maximum Supply Voltage: 0.876 V

Having a high maximum supply voltage tolerance ensures stable operation within a safe operating range.

Package Shape: RECTANGULAR

Rectangular package shape makes the product compatibility easier with various designs and layouts of circuit boards.

No. of Terminals: 900

Having a high number of terminals allows for complex connectivity options and versatility in circuit design.

Package Style (Meter): GRID ARRAY

Grid array package style provides better connectivity and reliability for the product.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, the product can function in a wide range of environmental conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Having multiple terminal finish options ensures better conductivity and corrosion resistance for the product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Nominal Supply Voltage: 0.85 V

Having a stable nominal supply voltage ensures consistent and reliable performance of the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU6CG-2FFVC900I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU6CG-2FFVC900I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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