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XCZU5EV-1FBVB900I

Xilinx

XCZU5EV-1FBVB900I by Xilinx

XCZU5EV-1FBVB900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. Suitable for industrial applications requiring high performance and reliability in a grid array package style.

Median Price

$3,001.670

Lifecycle Status

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5

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1k+

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Nova Conductors

Japan . 10 parts In-Stock

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Digiode

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One Stop Electronics

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AZTECH Wire

Italy . 413 parts In-Stock

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Semicontronic

India . 299 parts In-Stock

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Ampacity Inc.

Singapore . 1,594 parts In-Stock

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Corohmni

South Africa . 622 parts In-Stock

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MARBEL Systems

Belgium . 971 parts In-Stock

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Texas Native Microelectronics

USA . 30 parts In-Stock

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Kenton Components

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Microchip USA

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Continental Prestige Electronics

USA . 6,052 parts In-Stock

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Argo Parts USA

USA . 4,558 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$2,851.586

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Supply Digital

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Qasali Group International

UK . 100 parts In-Stock

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Overview

Unlock the next level of performance with the XCZU5EV-1FBVB900I by Xilinx. As a leading manufacturer in the industry, Xilinx delivers top-quality Other Function uPs, uCs & Peripheral ICs that are designed to enhance your projects. Whether you're looking to boost processing power or streamline operations, this product offers unmatched value and benefits. From industrial applications to cutting-edge technology, the XCZU5EV-1FBVB900I is the ultimate solution for all your microprocessor circuit needs. Elevate your work with Xilinx today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for compact and efficient designs, saving space and improving overall performance.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage allows for flexibility in power input, accommodating various power sources.

Package Shape: RECTANGULAR

The rectangular shape of the package provides ease of handling and installation in different devices.

No. of Terminals: 900

With a large number of terminals, this product offers extensive connectivity options for versatile applications.

Package Style (Meter): GRID ARRAY

The grid array package style ensures stable connections and reliable performance in demanding environments.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage helps in reducing power consumption and improving energy efficiency.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature makes the product suitable for industrial and harsh conditions.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable operation in extreme cold environments.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

The terminal finish provides excellent conductivity and reliability for stable connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, enhancing the overall design efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature enables quick and efficient soldering processes.

Peak Reflow Temperature °C: 245

High peak reflow temperature ensures secure solder joints and reliable connections.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh operating conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit enables advanced functionality and processing capabilities for enhanced performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for efficient operation.

Terminal Form: BALL

Ball terminal form ensures reliable connections and simplifies installation in various devices.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage provides stable power input for consistent performance.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates that the product can withstand moderate exposure to moisture during storage and handling.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU5EV-1FBVB900I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU5EV-1FBVB900I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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