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XCZU5CG-2FBVB900I

Xilinx

XCZU5CG-2FBVB900I by Xilinx

XCZU5CG-2FBVB900I by Xilinx is a CMOS MICROPROCESSOR CIRCUIT with 900 terminals in a GRID ARRAY package. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. Ideal for industrial applications requiring high performance and reliability.

Median Price

$3,234.710

Lifecycle Status

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Nova Conductors

Japan . 64 parts In-Stock

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Modulus Dynamics

Lithuania . 592 parts In-Stock

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$11.292

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AZTECH Wire

Italy . 634 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 490 parts In-Stock

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MARBEL Systems

Belgium . 32,526 parts In-Stock

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Texas Native Microelectronics

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Ampacity Inc.

Singapore . 795 parts In-Stock

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Kenton Components

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Qasali Group International

UK . 500 parts In-Stock

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Corohmni

South Africa . 822 parts In-Stock

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Microchip USA

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Aranea Global

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Continental Prestige Electronics

USA . 6,664 parts In-Stock

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Argo Parts USA

USA . 4,840 parts In-Stock

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$3,202.360

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$3,137.666

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Authorized Procurement Solutions

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Supply Digital

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Overview

Elevate your electronic designs with the XCZU5CG-2FBVB900I by Xilinx. As a leader in the industry, Xilinx delivers top-quality microprocessor circuit technology in a rectangular grid array package with 900 terminals. This versatile IC is perfect for various applications in the Other Function uPs,uCs & Peripheral ICs category, offering customers unmatched value and benefits. Trust Xilinx to provide reliable products that exceed expectations and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, ensuring reliable performance over time.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and enabling streamlined manufacturing processes.

Maximum Supply Voltage: 0.876 V

With a high maximum supply voltage, this product can handle various power inputs, offering flexibility in usage scenarios.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to handle and install, fitting well within standard electronic setups.

No. of Terminals: 900

Having a high number of terminals allows for extensive connectivity options and integration with a wide range of external components.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates efficient thermal management and electrical performance, contributing to overall product reliability.

Minimum Supply Voltage: 0.825 V

With a low minimum supply voltage, this product can operate efficiently even in situations where power supply may fluctuate or be limited.

Maximum Operating Temperature: 100 °C

Being able to operate at high temperatures enables this product to be used in industrial settings or environments with elevated heat levels.

Minimum Operating Temperature: -40 °C

The ability to function at extremely low temperatures makes this product suitable for applications in cold climates or refrigerated conditions.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

This terminal finish provides excellent conductivity and solderability, ensuring stable connections and long-lasting performance.

Terminal Position: BOTTOM

The bottom terminal position offers easy accessibility and facilitates efficient PCB layout and routing for effective circuit design.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature helps in preventing overheating and potential damage during the soldering process.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance ensures reliable soldering and assembly, contributing to product longevity and performance.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can withstand harsh environmental conditions and demanding operational requirements.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporating a microprocessor circuit as a peripheral IC provides advanced processing capabilities for enhanced functionality and performance.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of electronic systems.

Terminal Form: BALL

The ball terminal form ensures secure connections and reliable contact points, contributing to the overall stability and functionality of the product.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage sets the standard operating point for the product, optimizing performance and reliability under normal operating conditions.

Moisture Sensitivity Level (MSL): 4

Having a MSL of 4 indicates that this product can withstand exposure to moderate levels of moisture during handling and storage without compromising performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU5CG-2FBVB900I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU5CG-2FBVB900I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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