Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: .825 V;
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Other Function uPs,uCs & Peripheral ICs XCVM1302-2MLIVFVC1596 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx
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XCVM1302-2MLIVFVC1596 Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
1N4148
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MBR0540T1G
Onsemi
MBR0540T1G by Onsemi is a Schottky rectifier diode with max. forward voltage of 0.62V and max. output current of 0.5A, ideal for applications requiring high efficiency power conversion in small outline packages. Operating temp range: -55 to 150°C, with peak reflow temp at 260°C, making it suitable for various electronic devices needing reliable rectification performance in compact designs.
2N7002
Supertex
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 5 pF;
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
Renesas Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LL4148
Semtech Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99
Electronic Devices
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358MX
Texas Instruments
LM358MX by Texas Instruments is a dual operational amplifier with a max input offset voltage of 9000 uV. It has a nominal voltage of 5V and a min voltage gain of 15000. This op amp is commonly used in applications requiring amplification and signal conditioning.
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): .715 V; Maximum Operating Temperature: 150 Cel; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .2 A;
M39029/58-360
Itt Cannon
CONNECTOR ACCESSORY; Alternate Contacts: 030-2042-000; DIN Conformity: NO; Contact Gender: MALE; Terminal Type: WIRE; MIL-Connector Accessory Name: CONTACT;
SS14
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM7805CT/NOPB
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Max): 125 Cel; Maximum Output Voltage-1: 5.25 V;
LL4148-GS08
Vishay Telefunken
MBR0520LT1
MBR0520LT1 by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring low power consumption in compact electronic devices. This single-configured diode is surface mountable and has a max repetitive peak reverse voltage of 20V, ideal for small outline package designs.
Daco Semiconductor
PAP-06V-S
J S T Mfg
PAP-06V-S by J S T Mfg is a 6-contact BOARD CONNECTOR with 94V-0 UL Flammability Code. It has FEMALE contacts, CRIMP termination, and comes WITH CABLE ASSEMBLY for CABLE mounting applications.
Vishay Intertechnology
Vishay Intertechnology's SS14 is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 1A. Operating at up to 125°C, it has a repetitive peak reverse voltage of 40V. Ideal for surface mount applications, it suits various electronic circuits requiring efficient rectification and low forward voltage drop.
Diodes Incorporated
SMBJ18CA
World Products
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
XC7Z100-2FFG1156I
Xilinx
XC7Z100-2FFG1156I by Xilinx is a 1156-terminal, square-shaped GRID ARRAY package with a max supply voltage of 1.05V and a min operating temperature of -40°C. It is a CMOS-based SYSTEM ON CHIP (SoC) used in Other Function uPs,uCs & Peripheral ICs applications.
XCZU4EV-3FBVB900E
Xilinx XCZU4EV-3FBVB900E is a CMOS microprocessor with 900 terminals in a grid array package. It operates b/w 0-100°C, with supply voltage range of 0.873-0.927 V. Ideal for applications requiring high-performance computing in compact form factors.
XA7Z020-1CLG484Q
XA7Z020-1CLG484Q by Xilinx is a MICROPROCESSOR CIRCUIT with 484 terminals in a GRID ARRAY package. Operating b/w -40 to 125 °C, it's AEC-Q100 compliant for AUTOMOTIVE use. Features include 1.8V power supply, 0.8mm terminal pitch, and TIN SILVER COPPER finish.
AX8052F131-2-TB05
AX8052F131-2-TB05 by Onsemi is a System on Chip (SoC) with a max supply voltage of 3.6V and a min supply voltage of 2.2V. It is used in industrial applications and has a package style of CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG.
NRF52810-QCAA-T
Nordic Semiconductor Asa
NRF52810-QCAA-T by Nordic Semiconductor Asa is a MICROPROCESSOR CIRCUIT with 32 terminals, operating from -40 to 85 °C. It has a supply voltage range of 1.7V to 3.6V and is ideal for INDUSTRIAL applications requiring low-profile SQUARE package style ICs.
CYAT827AZA59-3200A
Infineon Technologies
PSoC;
XC7Z020-L1CLG484I
XC7Z020-L1CLG484I by Xilinx is a CMOS technology System on Chip (SoC) with 484 terminals. It operates at a voltage range of 0.95V to 1.05V and has a max seated height of 1.6mm. This versatile IC is commonly used in various applications requiring low profile, fine pitch grid array packages.
ESP32-WROOM-32E-N8
Espressif Systems (Shanghai)
ESP32-WROOM-32E-N8 by Espressif Systems is a 38-terminal SoC with CMOS technology. It operates b/w -40 to 85°C, with supply voltage ranging from 3V to 3.6V. Ideal for IoT applications due to its compact rectangular package style and surface mount capability.
CY8C6244AZI-S4D92
CY8C6244AZI-S4D92 by Infineon Technologies is a 64-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage ranging from 1.7V to 3.6V. This IC is used in applications requiring low-profile, fine-pitch packages for various functions like uPs and uCs.
MCIMX6S5DVM10AB
NXP Semiconductors
MCIMX6S5DVM10AB by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 624 terminals. It operates at a voltage range of 1.35V to 1.5V and has a max temperature of 95°C. This semiconductor is commonly used in other function uPs, uCs, and peripheral ICs applications.
MCIMX6Q6AVT10AER
MCIMX6Q6AVT10AER by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With a supply voltage range of 1.35V to 1.5V and peak reflow temp of 260C, it's ideal for various uP/uC functions in surface-mount designs.
XC7Z030-1SBG485C
XC7Z030-1SBG485C by Xilinx is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-85 °C, with supply voltage range of 0.95-1.05 V. With 485 terminals in a GRID ARRAY package, it's ideal for applications requiring high performance and integration in compact spaces.
AR1100-I/SO
Microchip Technology
Microchip Technology's AR1100-I/SO is a CMOS microprocessor circuit with 20 terminals in a small outline package. It operates b/w -40 to 85 °C, with supply voltage ranging from 3.135V to 3.465V. Ideal for industrial applications requiring high-temperature tolerance and compact design.
MIMXRT1176CVM8A
The NXP MIMXRT1176CVM8A is a SoC with CMOS technology, featuring 289 terminals in a low-profile grid array package. Operating b/w -40 to 105°C, it has a supply voltage range of 1.1-1.15V and peak reflow temp of 260°C. Ideal for applications requiring high-performance microcontrollers in compact form factors.
MIMXRT1061CVJ5A
The NXP Semiconductors MIMXRT1061CVJ5A is a low-profile, fine-pitch grid array SoC with 196 terminals. It operates in industrial temperatures from -40 to 105°C and has a supply voltage range of 1.15V to 1.26V. Ideal for applications requiring high-performance computing in compact spaces.
ATWINC1510-MR210PB1961
ATWINC1510-MR210PB1961 by Microchip operates at 3-4.2V, with a temp range of -40 to 85°C. It is a CMOS microprocessor circuit with 28 terminals, ideal for industrial applications requiring surface mount technology in a compact rectangular package style.
CC2543RHBR
CC2543RHBR by Texas Instruments is a MICROPROCESSOR CIRCUIT with 32 terminals, operating b/w -40 to 85 °C. It supports I2C, SPI, UART, and USART bus compatibility at 3V nominal voltage. Ideal for industrial applications requiring CMOS technology in a compact square package style.
XC7Z015-2CLG485I
Xilinx XC7Z015-2CLG485I is a CMOS System on Chip with 485 terminals in a low profile grid array package. Operating b/w -40 to 100 °C, it has a supply voltage range of 0.95V to 1.05V. Ideal for applications requiring high-performance computing in compact spaces.
MCIMX6QP5EYM1AA
MCIMX6QP5EYM1AA by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 624 terminals. It operates b/w -20°C to 105°C, with supply voltage ranging from 1.35V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.
AR1100T-I/SS
Microchip Technology's AR1100T-I/SS is a CMOS microprocessor circuit with 20 terminals in a small outline package. It operates at temperatures from -40 to 85 °C and has a supply voltage range of 3.135V to 3.465V, making it ideal for industrial applications requiring precise control and processing capabilities.
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XCVM1802-1MSEVSVD1760
XCVM1802-1MSEVSVD1760 by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.775-0.825 V. This GRID ARRAY IC is ideal for applications requiring high performance in a compact 40x40 mm package.
XCVM1402-1MSEVFVC1596
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1596; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCVM1802-2MSEVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Maximum Supply Voltage: .825 V;
XCVM1102-1MLISFVB625
MICROPROCESSOR CIRCUIT;
XCVM1102-1MSISFVA784
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS;
XCVM1802-1LSIVSVD1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 110 Cel;
XCVM1802-2LLIVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;
XCVM1802-2MLEVSVA2197
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2197; Package Code: HBGA; Package Shape: SQUARE; JESD-609 Code: e1;
XCVM1102-1HLESFVA784
MICROPROCESSOR CIRCUIT; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1;
XCVM1102-1GLESFVA784
MICROPROCESSOR CIRCUIT; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER;
XCVM1102-1HLEVFVB1024
XCVM1102-1GSIVFVB1024
XCVM1102-1DSIVFVB1024
XCVM1102-1HLESFVB625
XCVM1102-1DLIVFVB1024
XCVM1102-1HLISFVA784
XCVM1102-1DLEVFVB1024
XCVM1102-1DSESFVA784
XCVM1102-1GLISFVA784
XCVM1102-1GLIVFVB1024
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