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XCVC1902-2HSIVSVD1760

Xilinx

XCVC1902-2HSIVSVD1760 by Xilinx

XCVC1902-2HSIVSVD1760 by Xilinx is a CMOS microprocessor circuit with 1760 terminals in a grid array package. It operates b/w -40 to 110 °C and has a supply voltage range of 0.854V to 0.906V. Ideal for applications requiring high-performance processing in compact spaces.

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Vyrian

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Semicontronic

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One Stop Electronics

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AZTECH Wire

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Microchip USA

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Overview

Unlock the power of cutting-edge technology with the XCVC1902-2HSIVSVD1760 by Xilinx. As a leading manufacturer in the industry, Xilinx delivers top-quality products that are designed to enhance performance and efficiency. This versatile product falls under the category of Other Function uPs, uCs & Peripheral ICs, making it suitable for a wide range of applications. Experience the value and benefits of this product as it offers customers unmatched advantages in terms of reliability, versatility, and innovation. Upgrade your systems with the XCVC1902-2HSIVSVD1760 and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making it a reliable choice for various applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and space.

Maximum Supply Voltage: 0.906 V

Supports high power requirements, ensuring stable performance in demanding scenarios.

Package Shape: SQUARE

Offers a compact design that can fit in tight spaces, maximizing board real estate.

No. of Terminals: 1760

Provides ample connectivity options for a wide range of functions and configurations.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

Enhances thermal management and overall performance, ideal for intensive applications.

Minimum Supply Voltage: 0.854 V

Maintains steady operation even at lower power levels, ensuring reliability under different conditions.

Maximum Operating Temperature: 110 °C

Withstands high temperatures, suitable for use in harsh environments or industrial settings.

Minimum Operating Temperature: -40 °C

Functions reliably even in extremely cold conditions, making it versatile for diverse applications.

Terminal Position: BOTTOM

Facilitates easy connection and integration into existing circuit designs, enhancing versatility.

Maximum Seated Height: 4 mm

Allows for a low profile design, suitable for compact spaces or applications with height constraints.

Width: 40 mm

Provides a standard size that is compatible with various board layouts and configurations.

Length: 40 mm

Offers a square form factor that is symmetrical and uniform, optimizing space utilization.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Features advanced processing capabilities, enabling complex tasks and computations.

Technology: CMOS

Utilizes efficient and low-power technology, ideal for energy-efficient applications.

Terminal Form: BALL

Ensures reliable connections and soldering, enhancing overall performance and durability.

Nominal Supply Voltage: 0.88 V

Maintains stable operation at the standard voltage level, suitable for most applications.

Terminal Pitch: 0.92 mm

Provides precise and compact terminal spacing, enabling high-density integration in tight layouts.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCVC1902-2HSIVSVD1760 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

S-PBGA-B1760

Length:

40 mm

No. of Terminals:

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1760,42X42,36

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Maximum Seated Height:

4 mm

Maximum Supply Voltage:

.906 V

Minimum Supply Voltage:

.854 V

Nominal Supply Voltage:

.88 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.92 mm

Terminal Position:

BOTTOM

Width:

40 mm

Peripheral IC Type:

Trade Compliance

XCVC1902-2HSIVSVD1760 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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